Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K1500CB652C8	Altera	Loadable PLD	Commercial	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	70 °C (158 °F)	488 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm		488
EPM7064BUI49-7N	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		64	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EPF10K100EFI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16 ns	4992	Yes	2.7 V		CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			338	220 °C (428 °F)	23 mm		338
EP20K200BC356V	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 279 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		279
EP20K100BC356-3X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		252
EPM7128BUC49-4	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	243.9 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM7128BUC49-7	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	126.6 MHz			220 °C (428 °F)	7 mm	Yes	41
EP20K100BC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
EPM7256AEFI256-6	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS		3.3		Grid Array, Thin Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.1 mm	17 mm	No		e1	166.7 MHz				17 mm		164
EPM240F100C3N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	4.7 ns		Yes	2.625 V	192	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	80
EP20K400CF672C7	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.48 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm		488
EP20K1500CFI1020-7X	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm		808 I/O			Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		808
EPF10K100BBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes							Grid Array				Mixed		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPF8820ABI225-A-3	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EP20K400FI672-2V	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm		502 I/O			Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	496	220 °C (428 °F)	27 mm		502
EPM2210GM100I5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EPF10K100EBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPM7064BUC49-7N	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e1	303 MHz				7 mm	Yes	41
EPM240GM100I5	Altera	Flash PLD		Ball	100	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		192	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B100				No								Yes
EP20K200BI356-3X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 277 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		277
EP20K200FC484-2XV	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	376	220 °C (428 °F)	23 mm		382
EP20K200EFC784-1	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPM7064AEFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	68
EP20K600EFC672-2N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1	160 MHz	30 s	500	245 °C (473 °F)	27 mm		508
EP20K400FC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	496	220 °C (428 °F)	27 mm		502
EPF6016AFC100-3N	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Grid Array, Low Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	133 MHz				11 mm		81
EP1M350FC780-6	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1					29 mm		486
EPM7128BFI256-4	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 100 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	238.1 MHz			220 °C (428 °F)	17 mm	Yes	100
EP1K30FI484	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		171
EPF10K50SFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.7 V		CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EP20K200BI784-2	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K100EFC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		246
EPF10K50EBC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 254 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							254
5M570ZM100A5N	Altera	Flash PLD	Industrial	Ball	100	FBGA	Square	Plastic/Epoxy	17.7 ns		Yes		440	CMOS			1.8,1.2/3.3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B100				No								Yes
EPF10K30ABI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2 ns	1728	Yes	3.6 V		CMOS	246	3.3	3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1			246	220 °C (428 °F)	27 mm		191
EP20K30EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.1 mm	19 mm	No		e1	160 MHz				19 mm		128
EP20K60EFC324-1N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196
EP20K160EFI484	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm		4 Dedicated Inputs, 324 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm		324
EPF10K100EFI672-3X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPM2210M100C5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EP20K1000EFC672-2N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.13 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	27 mm		508
EPM2210F256I3N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 204 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	17 mm	Yes	204
EPM7128AEFI100-10	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	98 MHz			220 °C (428 °F)	11 mm	Yes	84
EP20K100BC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							252
EP20K200CF672C-7	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		376
EPM7512AEBI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	512 Macrocells	e0	71.9 MHz			220 °C (428 °F)	27 mm	Yes	212
EP20K160EBI356-1	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		6400	Yes	2.625 V		CMOS	263	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			263	220 °C (428 °F)	35 mm		271
EPM7512AEBI256-7N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	512 Macrocells	e1	163.9 MHz				27 mm		212

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.