Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF6016ABC256-2	Altera	Loadable PLD		Ball	256	BGA		Plastic/Epoxy			Yes			CMOS		204		3.3,3.3/5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays									Tin Lead	Bottom					No		e0			204	220 °C (428 °F)
EP20K200EBC356-2X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS		263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	263	220 °C (428 °F)	35 mm		271
EPF10K50EFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No	2880 Logic Elements	e1	140 MHz	40 s		260 °C (500 °F)	23 mm		254
EPM3256AFC256-10N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 161 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1					17 mm		161
EPF10K20BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP1K100FI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 333 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		333
EPM2210GF256A5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS				1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPM2210GF324C5N	Altera	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	19 mm	Yes	272
EP20K400CB652C8N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm		488
EPM7064BUI49-3	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	3.5 ns		Yes		64	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Lead	Bottom	S-PBGA-B49				No		e0				220 °C (428 °F)		Yes
EPF10K10ABI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EP20K1000EFC33-2X	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.13 ns	38400	Yes	1.89 V		CMOS		700	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	700	220 °C (428 °F)	33 mm		708
EPF10K100ABI600-1	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 406 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		406
EPF10K250ABC600	Altera	Loadable PLD	Commercial	Ball	600	HBGA	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Grid Array, Heat Sink/Slug				Mixed	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
EPF10K100BM560-5	Altera	Loadable PLD	Military	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS			5		Grid Array				Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EP20K100EFC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS		238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	238	220 °C (428 °F)	19 mm		246
EP20K60EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.1 mm	19 mm	No		e1	160 MHz				19 mm		204
EP20K160EBC356-1	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.55 ns	6400	Yes	1.89 V		CMOS		263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	263	220 °C (428 °F)	35 mm		271
EP20K100BC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
EP20K1000EFC1020-1X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	2.625 V		CMOS		708	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		708	220 °C (428 °F)	33 mm		708
EPF10K100EFC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	338	220 °C (428 °F)	23 mm		338
EP1M350FC780-8A	Altera	Loadable PLD	Other	Ball	780	HBGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS			1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1					29 mm		486
EP20K200CFI672-7	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP20K60EBC356-1	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS		188	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	35 mm		196
EPM7032BUI49-5N	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	5 ns		Yes		32	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EPF10K50SFI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns	2880	Yes	2.7 V		CMOS		254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EP20K200EFC484-1N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V		CMOS		368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	30 s	368	260 °C (500 °F)	23 mm		376
EPXA4F1020C3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 488 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm		488
EPF10K50SFC256-1X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EP20K200CBI356-7	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		271 I/O			Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EPM570M100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 76 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							76
EP20K1000EFC1020-3X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5		Grid Array, Heat Sink/Slug				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1	160 MHz				33 mm		708
EPM7064AEFC256-4	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	222.2 MHz			220 °C (428 °F)	17 mm	Yes	68
EPM570M256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
5M1270ZF324A5N	Altera	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes		980	CMOS	AEC-Q100			1.8,1.2/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324				No								Yes
EP20K200BC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							382
EPF6016AFC256-3N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	133 MHz				17 mm		171
EP2A40F1020C9N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.05 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1 mm	85 °C (185 °F)	735 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm		735
EP1M120FC484-7	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EPM1270GM256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns		Yes	1.89 V	980	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EP20K30EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1	160 MHz				27 mm		128
EPM1270M100C5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPF10K100EFC672-2X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPM570F256A5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes		440	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPM7064BFI100	Altera	EE PLD		Ball	100	LBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 68 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1					11 mm		68
EP20K160EBC356	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array, Low Profile				Macrocell		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 273 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		273
EP20K200CBC652-8	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EP20K200EBC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							376

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.