Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
TIBPAL16L8-30MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	8	8.89 mm	No	6
M38510/50803BKX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular		20 ns	Yes	5.5 V	CMOS	MIL-M-38510 Class B			5			Flatpack				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-XDFP-F24			No			31.2 MHz				10
82S105AMJD	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28			No				8
5962-8515509SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V	TTL	MIL-STD-883			5			Flatpack				Combinatorial	4.5 V			125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F20			No							6
5962-8515507RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes		e0	25 MHz	6	24.2 mm	No	2
TIBPAL16R6-20MFH	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic		Yes		TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20			No				6
5962-8515506SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V	TTL	MIL-STD-883	8	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20	2.54 mm	6.92 mm	Yes		e0	25 MHz	8	13.09 mm	No	0
TIBPLS506MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	6 ns	No	5.5 V	TTL		13	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	97	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Field-Programmable Logic Sequencer			8			0
TIBPAL22V10AMWB	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V	TTL	MIL-PRF-38535	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			22 MHz	10	14.355 mm		10
5962-8515513RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	14 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			48 MHz	8			6
5962-85155012A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Combinatorial	4.75 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	Yes		e0	40 MHz	8	8.89 mm	No	6
8103613RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	TTL				5			In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20			No			16 MHz				2
TIBPAL20R6-20MWB	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.25 V	TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			28.5 MHz	8	14.355 mm		2
8412907LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	TTL				5			In-Line				Registered	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 0 I/O	10	-55 °C (-67 °F)		Dual	R-PDIP-T24	4.064 mm	7.62 mm	No			15.4 MHz		30.378 mm		0
TIBPAL16R4-30MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	8	8.89 mm	No	4
JM38510/50603BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			41.6 MHz				2
5962-8767115KA	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL	MIL-STD-883	20	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			50 MHz	8	14.355 mm		6
M38510/50608BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.25 V	TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	5.08 mm	6.92 mm	Yes		e0	30 MHz	8	24.2 mm	No	4
5962-8767101LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL	MIL-STD-883		PAL-TYPE	5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24			No							6
TIBPAL16R8-15MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V	TTL	MIL-PRF-38535	8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			50 MHz	8	8.89 mm		0
5962-8515522RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883			5			In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20			No			74 MHz				4
5962-8767116LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883			5			In-Line				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			50 MHz				0
8412906KA	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	35 ns	Yes	5.5 V	TTL				5			Flatpack				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 2 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.286 mm	10.465 mm				15.4 MHz		15.57 mm		2
5962-01-201-6826	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		TTL		14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			28.5 MHz	8
5962-8767104LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	Yes		e0	40 MHz	8	32.005 mm	No	4
5962-8515520RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			52.5 MHz	8			4
SN54PL16R8-2J	Texas Instruments	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic		No		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No			25 MHz	8
TIBPAL16R6-30MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	25 MHz	6	24.195 mm	No	2
8412902XA	Texas Instruments	OT PLD	Military	No Lead	28	HQCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.25 V	TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	Chip Carrier, Heat Sink/Slug	LCC28,.45SQ	Programmable Logic Devices		Registered	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No			28.5 MHz	8	11.43 mm		0
TIBPAL20R6-10MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No			50 MHz	8	11.43 mm		2
TIBPAL16R6-20MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL		10	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset		41.6 MHz	6	24.195 mm		2
TIB82S105BMJB	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28			No			25 MHz	8
PAL20R4AMFH	Texas Instruments	OT PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J28	2.54 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz	8	11.43 mm		4
8412903XA	Texas Instruments	OT PLD	Military	No Lead	28	HQCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V	TTL	MIL-STD-883	14	PAL-TYPE	5		5 V	Chip Carrier, Heat Sink/Slug	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No			28.5 MHz	8	11.43 mm		2
5962-8767118LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			50 MHz	8	32.005 mm		4
TIBPALT19R8MJWB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				8
TIBPAL20L8-12MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V	TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	Security Fuse			8	11.43 mm		6
8412908KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	35 ns	Yes	5.5 V	TTL				5			Flatpack				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.286 mm	10.465 mm				15.4 MHz		15.57 mm		6
8103613SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	40 ns	Yes	5.5 V	TTL				5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20			No			16 MHz				2
TIBPAL20R6-10MWB	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL		14	PAL-TYPE	5		5 V	Flatpack	FL24,.35	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			50 MHz	8	14.355 mm		2
8412905KA	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	35 ns	Yes	5.5 V	TTL				5			Flatpack				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.286 mm	10.465 mm						15.57 mm		8
TIFPLA840MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL		14	PLA-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.5 V	32	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 0 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24			No				6			0
TIBPAL16R6-20MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No	Power-Up Reset		41.6 MHz	6	8.89 mm		2
SNJ54LS334W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes		TTL	38535Q/M;38534H;883B	12	PLA-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24			No				6
5962-8515503RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes		e0	41.6 MHz	6		No	2
PAL16R4AMFH	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic		Yes		TTL		12	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20			No				8
TIBPAL16R6-15MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V	TTL	MIL-PRF-38535	10	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.45 mm	6.92 mm	No			50 MHz	6			2
M38510/50503BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V	Bipolar	MIL-M-38510 Class B	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			20 MHz	8			2

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.