Military Programmable Logic Devices (PLD) 1,614

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP630-25MJTB

Texas Instruments

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

160

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 16 I/O

4

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

40 MHz

16

32.005 mm

16

8103607SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

MIL-STD-883 Class B

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

Yes

6

TIBPALT19R8MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

19

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

8

TIBPAL22V10-20MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

33.3 MHz

10

10

5962-8515510SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

12 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

50 MHz

0

5962-8767117KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883

20

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

50 MHz

6

14.355 mm

2

82S167AMJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

14

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

48

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

5962-85155132A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

48 MHz

8

8.89 mm

6

M38510/50603BRX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

41.6 MHz

2

TIBPAL16L8-12MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

14 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

48 MHz

8

6

TIBPAL20L10-25MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

TIBPAL22V10AMFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

MIL-PRF-38535

22

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

22 MHz

10

11.43 mm

10

TIBPAL20R4-30MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

25 MHz

8

4

TIB82S105BMJ

Texas Instruments

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Registered

4.5 V

48

2.54 mm

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

Field-Programmable Logic Sequencer

25 MHz

8

0

TIBPAL16R4-30MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e0

25 MHz

8

24.195 mm

No

4

PAL20R4AMFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

20 MHz

8

TIBPAL16R6-30MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

25 MHz

6

2

8103607SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

Yes

e0

25 MHz

8

13.09 mm

No

6

5962-85155182A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

52.5 MHz

8

8.89 mm

No

0

TIBPAL20X10-25MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.5 V

40

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 0 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

25 MHz

10

0

TIBPAL16L8-12MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

48 MHz

8

24.195 mm

6

TIBPAL20R6-7MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

14

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

Register Preload; Power-Up Reset

74 MHz

8

11.43 mm

2

M38510/50804BKX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

15 ns

Yes

5.5 V

CMOS

MIL-M-38510 Class B

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

50 MHz

10

TIBPAL20SP8-30MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

8

11.43 mm

6

TIBPAL20L10-25MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.5 V

40

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10

8

TIBPAL20X8MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL20X8-25MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL20L10-25MWB

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

25 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Combinatorial

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

10

TIBPAL20X8MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

81036102A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

25 MHz

8

8.89 mm

No

4

TIBPAL16L8-20MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Combinatorial

4.75 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

e0

40 MHz

8

13.09 mm

No

6

M38510/50302BRX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 0 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

0

5962-8767117LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-STD-883

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

8

32.005 mm

2

5962-8515516RA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

e0

48 MHz

8

No

4

TIBPAL16R4-12MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

48 MHz

8

24.195 mm

No

4

TIBPAL22V10-20MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-PRF-38535

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

33.3 MHz

10

32.005 mm

10

TIBPAL20R8-30MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

8

5962-8515512SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Flatpack

No

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

Yes

50 MHz

4

No

4

PAL16R8AMFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

25 MHz

8

TIBPAL16R6-12MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset; Register Preload

48 MHz

6

24.195 mm

2

5962-8515504RA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

Yes

e0

40 MHz

8

24.2 mm

No

4

5962-8605303LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

25 MHz

10

TIBPALT19R4MJW

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

0 Dedicated Inputs, 4 I/O

0

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

1 External Clock; Register Preload

20 MHz

8

4

PAL16R4A-2MFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

8

PAL20R8A-2MJW

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

18 MHz

8

5962-85155022A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

41.6 MHz

8

8.89 mm

No

0

5962-8605304LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

33.3 MHz

10

32.005 mm

10

81036102X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

MIL-STD-883 Class B

5

Chip Carrier

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

25 MHz

4

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.