Military Programmable Logic Devices (PLD) 1,614

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

8412907LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

TTL

5

In-Line

Registered

4.5 V

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 0 I/O

10

-55 °C (-67 °F)

Dual

R-PDIP-T24

4.064 mm

7.62 mm

15.4 MHz

30.378 mm

0

8412903LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

38535Q/M;38534H;883B

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

Yes

28.5 MHz

8

32.005 mm

2

M38510/50802BKX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

25 ns

Yes

5.5 V

CMOS

MIL-M-38510 Class B

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

30 MHz

10

5962-85155162A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

48 MHz

8

8.89 mm

No

4

TIBPAL16R8-30MW

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

Power-Up Reset

25 MHz

8

0

5962-8515506RA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

e0

25 MHz

8

24.2 mm

No

0

TIBPAL16R4-30MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

4

TIBPAL16R8-12MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

48 MHz

8

24.195 mm

0

TIFPLA839MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

14

PLA-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

4.5 V

32

1.27 mm

125 °C (257 °F)

14 Dedicated Inputs, 0 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

6

11.43 mm

0

SNJ54LS335J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

5962-8767101LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

MIL-STD-883

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

28.5 MHz

8

32.005 mm

6

TIBPAL16L8-10MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

12 ns

Yes

5.5 V

TTL

MIL-PRF-38535

10

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

52.5 MHz

8

13.09 mm

6

TIBPAL16R8-30MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

0

TIBPAL20R6-30MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

14

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

8

5962-8767105LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

6

TIBPAL20R4-7MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

7 ns

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

74 MHz

8

PAL20R4A-2MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

18 MHz

8

TIBPAL20L8-20MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

8

11.43 mm

6

8412903KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.25 V

TTL

38535Q/M;38534H;883B

14

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

28.5 MHz

8

14.355 mm

2

TIBPAL22V10AMJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-PRF-38535

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

22 MHz

10

32.005 mm

10

JM38510/50403BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

20 MHz

TIBPAL16R6-30MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

6

8.89 mm

No

2

SNJ54LS335W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PLS-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

PAL16R8AMJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

0

JM38510/50502BLA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

MIL-M-38510 Class B

5

In-Line

Registered

4.75 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

40 MHz

32.005 mm

0

TIBPAL20R8-20MW

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

No

Register Preload; Power-Up Reset

28.5 MHz

0

TIBPAL16R8-20MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

41.6 MHz

8

24.195 mm

No

0

5962-8767115LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-STD-883

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

8

32.005 mm

6

SN54LS333J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL20R8-10MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

Register Preload; Power-Up Reset

50 MHz

8

11.43 mm

0

5962-8767103KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.25 V

TTL

MIL-STD-883

14

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

28.5 MHz

8

14.355 mm

2

8412903KX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

No

28.5 MHz

2

5962-8515512SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.45 mm

6.92 mm

Yes

e0

50 MHz

8

No

4

5962-8767117KX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

No

50 MHz

2

PAL20L8AMFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

30 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

8

8412902KX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

No

28.5 MHz

0

8103609RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883 Class B

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

25 MHz

2

8412905KX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.286 mm

10.465 mm

15.57 mm

8

M38510/50604BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

Yes

e0

41.6 MHz

8

24.2 mm

No

4

81036112X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

MIL-STD-883 Class B

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

6

5962-85155102A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

12 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

50 MHz

8

8.89 mm

0

TIBPAL16R8-15MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

50 MHz

8

24.195 mm

0

PAL16R4A-2MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

16 MHz

8

8.89 mm

No

4

SN54PL16R4-2J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

TIBPAL16R8-20MFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

40 MHz

8

TIBPAL16L8-10MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

52.5 MHz

8

24.195 mm

6

5962-8515511SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

50 MHz

2

PAL16R4A-2MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

16 MHz

8

4

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.