Military Programmable Logic Devices (PLD) 1,614

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5962-8768201MRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

10

5962-9176007MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

BICMOS

MIL-STD-883 Class B

5

In-Line

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

55 MHz

10

5962-9176007M3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

55 MHz

10

82S105/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

10.5 MHz

0

82S105/BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

5

In-Line

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

10.5 MHz

0

S82S102R/883B

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

16

PAD-TYPE

5

5 V

Flatpack

FL28,.4

Programmable Logic Devices

9

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDFP-F28

No

e0

9

82S101/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

5962-9176007MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

BICMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

55 MHz

10

5962-8850402LA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

10

5962-8984102LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

31.2 MHz

10

5962-9176007M3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

55 MHz

10

PLC18V8Z/BRA(OT)

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

25 MHz

8

5962-8984105LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

5962-86709013X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

5962-8984101LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

22 MHz

10

5962-8670901Y3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

22V10-15/BLA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

5962-8768201MRX

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

10

5962-8670901Y3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

5962-8670901XX

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

82S100/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

5962-8768201RA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

18

PLA-TYPE

5

In-Line

No

Combinatorial

4.5 V

42

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

10

No

10

82S105/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

10.5 MHz

0

5962-8850402LX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10

5962-9176008M3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

7.5 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

71 MHz

10

5962-9201201MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10.5 MHz

0

5962-8850701LA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 12 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

20 MHz

12

5962-9233807M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

2

5962-9233804M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

87 MHz

8.89 mm

4

CY37064VP44-83YMB

Infineon Technologies

EE PLD

Military

J Bend

44

QCCJ

Square

Ceramic

15 ns

Yes

64

CMOS

38535Q/M;38534H;883B

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-J44

No

e0

Yes

59628753906LX

Infineon Technologies

UV PLD

Military

Through-Hole

WDIP

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

5

In-Line, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

83 MHz

32 mm

10

5962-9233802M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

0

5962-9233805M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

8.89 mm

6

M38510/50802BLA

Infineon Technologies

OT PLD

Military

Through-Hole

24

DIP

Rectangular

25 ns

No

5.5 V

CMOS

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

30 MHz

10

5962-01-302-9835

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

5962-8946804XA

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

42 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

40 MHz

27.9527 mm

52

5962-8946803XA

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

51 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

27.9527 mm

52

5962-9233804M2X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

87 MHz

8.89 mm

4

5962-01-302-9836

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

5962-01-394-3671

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

5962-8946804XX

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

42 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

40 MHz

27.9527 mm

52

5962-9233801M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

e0

8.89 mm

6

5962-9233806M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

0

5962-01-421-4812

Infineon Technologies

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

20 ns

Yes

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

28.5 MHz

6

5962-01-305-5393

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

5962-9233808M2A

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

7 ns

Yes

5.5 V

BICMOS

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

Power-Up Reset

e0

105.3 MHz

8.89 mm

4

5962-88713082X

Infineon Technologies

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Mixed

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

1.905 mm

8.89 mm

No

22 MHz

8.89 mm

4

5962-8946805XA

Infineon Technologies

UV PLD

Military

Pin/Peg

68

WPGA

Square

Ceramic, Metal-Sealed Cofired

33 ns

No

5.5 V

CMOS

5

Grid Array, Window

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 52 I/O

7

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P68

5.08 mm

27.9527 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

50 MHz

27.9527 mm

52

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.