Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CPL20L8-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL16R4-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	4
CPL20R6L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL16R8-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	8
CPL20R8L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			22 MHz	8
CPL20R4-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	22 MHz	8
CPL16R8-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	8
CPL20L10-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL20L8L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL16L8-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0		8
CPL20L10-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL16L8-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0		8
CPL20R4L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20L10L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	10
CPL20R4L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20R6L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			22 MHz	8
CPL20R6L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL16R4-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	4
CPL16R6-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	6
CPL20L8-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20R8L35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			16.5 MHz	8
CPL20R8L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20R8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L10L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	10
CPL20R4-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	16.5 MHz	8
CPL16R6-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	6
EPF8636ARM160-3	Altera	Loadable PLD	Military	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug				Registered	4.5 V		.65 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		3.91 mm	28 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3				28 mm
EPF10K50QM240-5	Altera	Loadable PLD	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27 ns	Yes	5.5 V		CMOS				5		Flatpack, Fine Pitch				Registered	4.5 V		.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 189 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	2880 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz			32 mm		189
EPM5064LM44	Altera	OT PLD	Military	J Bend	44	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 28 I/O	7	-55 °C (-67 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	64 Macrocells; Shared Input/Clock; Shared Product Terms		33.3 MHz			16.5862 mm		28
EPF81188ARM208-3	Altera	Loadable PLD	Military	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Registered	4.5 V		.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3				28 mm
EP600JM883B	Altera	UV PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.5 V		CMOS	MIL-STD-883 Class B	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	160	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	16 Macrocells	e0	22.2 MHz	16	220 °C (428 °F)	11.43 mm		16
EPM7256EQM160-15	Altera	EE PLD	Military	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	125 °C (257 °F)	0 Dedicated Inputs, 128 I/O	0	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock	e3	76.9 MHz			28 mm		128
EP610DM-35	Altera	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	37 ns	No	5.5 V		CMOS		20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.334 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	28.6 MHz	16	220 °C (428 °F)	31.75 mm		16
EPM9320GM280-12	Altera	EE PLD	Military	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired	12 ns	No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	0 Dedicated Inputs, 168 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P280		5.081 mm	49.78 mm	No	320 Macrocells; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V		118 MHz			49.78 mm		168
EPS448DM28-20	Altera	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V		CMOS				5		In-Line, Window				Registered	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	PLS		20 MHz			36.83 mm		0
EP1210DMB	Altera		Military	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS		36	PAL-TYPE			In-Line	DIP40,.6	Programmable Logic Devices				236	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T40						e0	12.5 MHz	24	220 °C (428 °F)
EPM5032DM	Altera		Military	Through-Hole	28	DIP	Rectangular	Ceramic	25 ns	No			CMOS		24	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices				320	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T28				No		e0	62.5 MHz	16	220 °C (428 °F)
EPM5130LM84	Altera	OT PLD	Military	J Bend	84	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	19 Dedicated Inputs, 48 I/O	19	-55 °C (-67 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	128 Macrocells; Shared Input/Clock; Shared Product Terms		33.3 MHz			29.3116 mm		48
EPF10K10QM240-5	Altera	Loadable PLD	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27 ns	Yes	5.5 V		CMOS				5		Flatpack, Fine Pitch				Registered	4.5 V		.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	576 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz			32 mm
5962-01-324-9619	Altera	UV PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	75 ns	No		48	CMOS	38535Q/M;38534H;883B			5	5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P68				No							No
EPM5192AQM100-20	Altera	OT PLD	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	33 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	125 °C (257 °F)	7 Dedicated Inputs, 64 I/O	7	-55 °C (-67 °F)	Matte Tin	Quad	R-PQFP-G100		3.425 mm	14 mm	No	Labs interconnected by PIA; 12 Labs; 1 External Clock	e3	66.7 MHz		220 °C (428 °F)	20 mm		64
EPS448PM28-20	Altera	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No	5.5 V		CMOS				5		In-Line				Registered	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-PDIP-T28		4.318 mm	7.62 mm	No	PLS		20 MHz			34.29 mm		0
EPM5128AJM68-20	Altera	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Quad	S-CQCC-J68		5.08 mm	24.13 mm	No	Labs interconnected by PIA; 8 Labs; 1 External Clock		66.7 MHz			24.13 mm		52
EPF81500GM280-2	Altera	Loadable PLD	Military	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS				5		Grid Array				Registered	4.5 V		2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 204 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P280		5.081 mm	49.78 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V					49.78 mm		204
EPM5128LM68	Altera	OT PLD	Military	J Bend	68	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	128 Macrocells; Shared Input/Clock; Shared Product Terms		33.3 MHz			24.2316 mm		52
5962-01-292-2397	Altera		Military	Through-Hole	24	DIP	Rectangular	Ceramic	55 ns	No			CMOS	38535Q/M;38534H;883B	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		160	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			18.2 MHz	16
5962-9206201MZX	Altera	UV PLD	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	90 ns	No	5.5 V		CMOS	MIL-STD-883 Class B			5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	7 Dedicated Inputs, 64 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No			19.6 MHz					64

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.