Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CPL20L8-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL16R4-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	4
CPL20R6L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL16R8-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	8
CPL20R8L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			22 MHz	8
CPL20R4-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	22 MHz	8
CPL16R8-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	8
CPL20L10-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL20L8L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL16L8-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0		8
CPL20L10-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL16L8-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0		8
CPL20R4L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20L10L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	10
CPL20R4L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20R6L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			22 MHz	8
CPL20R6L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL16R4-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	4
CPL16R6-25WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	22 MHz	6
CPL20L8-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20R8L35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			16.5 MHz	8
CPL20R8L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20R8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L10L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes			CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	10
CPL20R4-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	16.5 MHz	8
CPL16R6-35WM	Samsung		Military	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0	16.5 MHz	6
EPF81500RM240-3	Altera	Loadable PLD	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Registered	4.5 V		.5 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3				32 mm
EPF10K50QM304-5	Altera	Loadable PLD	Military	Gull Wing	304	QFP	Square	Plastic/Epoxy	27 ns	Yes	5.5 V		CMOS				5		Flatpack				Registered	4.5 V			125 °C (257 °F)	4 Dedicated Inputs, 249 I/O	4	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G304				No	2880 Logic elements; Built-in JTAG boundry-scan test circuitry	e3	53.76 MHz					249
EPF10K40BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns	Yes	5.5 V		CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V		1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz			35 mm
5962-01-330-5522	Altera		Military	J Bend	44	QCCJ	Square	Ceramic	60 ns	Yes			CMOS		36	PAL-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell		240	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-J44	1			No		e0	16.7 MHz	24
EP610LM-35	Altera	OT PLD	Military	J Bend	28	QCCJ	Square	Plastic/Epoxy	37 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)		Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks		28.6 MHz			11.5062 mm		16
EPM7192EG5962160-15	Altera	EE PLD	Military	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	15 ns	No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P160		5.34 mm	39.624 mm	No	192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock		76.9 MHz			39.624 mm		120
EPF8820BM225-2	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.5 V		CMOS				5		Grid Array				Registered	4.5 V		1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1				27 mm		148
5962-8863501RX	Altera	UV PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No								8
5962-01-416-1943	Altera		Military	Through-Hole	40	DIP	Rectangular	Ceramic	60 ns	No			CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell		240	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T40				No			16.7 MHz	24
EPM9560RM240-25	Altera	EE PLD	Military	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.5 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 191 I/O	0	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz			32 mm		191
EPF8452GM160-2	Altera	Loadable PLD	Military	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS				5		Grid Array				Registered	4.5 V		2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 116 I/O	4	-55 °C (-67 °F)		Perpendicular	S-CPGA-P160		5.34 mm	39.624 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements					39.624 mm		116
5962-9473301MXX	Altera	Loadable PLD	Military	Pin/Peg	232	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883			5		Grid Array				Registered	4.5 V		2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 180 I/O	4	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P232		5.207 mm	44.7 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e4				44.7 mm		180
EPM5128ALM68-20	Altera	OT PLD	Military	J Bend	68	QCCJ	Square	Plastic/Epoxy	33 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Labs interconnected by PIA; 8 Labs; 1 External Clock		66.7 MHz			24.2316 mm		52
5962-01-429-6233	Altera	OT PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	50 ns	No		48	CMOS	38535Q/M;38534H;883B			5	5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P68				No							No
EP600JM	Altera	UV PLD	Military	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	160	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	16 Macrocells	e0	22.2 MHz	16	220 °C (428 °F)	11.43 mm		16
EPF10K20BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns	Yes	5.5 V		CMOS				5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V		1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz			35 mm
5962-01-324-9620	Altera	UV PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	75 ns	No		48	CMOS	38535Q/M;38534H;883B			5	5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P68				No							No
5962-9061102YX	Altera	UV PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V		CMOS	MIL-STD-883			5		Chip Carrier				Macrocell	4.5 V			125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)		Quad	S-CQCC-J28				No			33.3 MHz					16
EPM5128JM68	Altera	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Quad	S-CQCC-J68		5.08 mm	24.13 mm	No	128 Macrocells; Shared Input/Clock; Shared Product Terms		33.3 MHz			24.13 mm		52
EPM5192AGM84-20	Altera	UV PLD	Military	Pin/Peg	84	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 64 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.96 mm	27.94 mm	No	Labs interconnected by PIA; 12 Labs; 1 External Clock		66.7 MHz			27.94 mm		64
EP1830JM-30	Altera	OT PLD	Military	J Bend	68	QCCJ	Square	Ceramic	34 ns	Yes		48	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-J68				No		e0			220 °C (428 °F)		No

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.