Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
5962-01-349-2199	Infineon Technologies		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			18.1 MHz	10
CY37064P44-100YMB	Infineon Technologies	EE PLD	Military	J Bend	44	QCCJ	Square	Ceramic	12 ns	Yes		64	CMOS	38535Q/M;38534H;883B				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Quad	S-XQCC-J44				No		e0				Yes
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	25 MHz				10
5962-8946805XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock		50 MHz		27.9527 mm		52
5962-9233803M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz		8.89 mm		2
5962-9233805M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0			8.89 mm		6
5962-9233808M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz		8.89 mm		4
5962-9233801M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No					8.89 mm		6
5962-9233803M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz		8.89 mm		2
5962-88713082A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0	22 MHz		8.89 mm		4
5962-01-382-8760	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-360-1553	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-8946803XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	51 ns	No	5.5 V		CMOS	MIL-STD-883			5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No							52
5962-01-382-8715	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-277-6831	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz	4
5962-9233806M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz		8.89 mm		0
5962-01-360-4028	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz	6
5962-01-349-7443	Infineon Technologies		Military	Through-Hole	28	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	25	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices				192	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28				No			14.2 MHz	12
5962-01-354-5490	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz	10
5962-9233802M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz		8.89 mm		0
5962-9233807M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz		8.89 mm		2
XC73108-20WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz		29.21 mm	No	37
XC73108-15PG144M	Xilinx	UV PLD	Military	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	No	5.5 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 78 I/O	12	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P144		3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz		39.624 mm	No	78
XC73144-10PG184M	Xilinx	UV PLD	Military	Pin/Peg	184	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				Macrocell				125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P184				No	PAL Blocks interconnected by PIA; 144 Macrocells; Configurable I/O operation with 3.3 V or 5 V
XC7336-7WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS				5		Chip Carrier, Window				Macrocell			1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 32 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks				16.51 mm		32
XC7236A-25WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 30 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		33 MHz		16.51 mm	No	30
XC7272A-20WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 42 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		50 MHz		29.21 mm	No	42
XC7372-12WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84		4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks		62.5 MHz		29.21 mm	No	37
XC7354-15WC68M	Xilinx	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 42 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops	e0	55.6 MHz		24.13 mm	No	42
XC7354-15WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 42 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	Configurable I/O operation with 3.3 V or 5 V		55.6 MHz		16.51 mm		42
XC73108-20PG144M	Xilinx	UV PLD	Military	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 78 I/O	12	-55 °C (-67 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz		39.624 mm	No	78
XC7372-15WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz		29.21 mm	No	37
XC7236A-20WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 30 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		40 MHz		16.51 mm	No	30
XC7336-15WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	23 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 32 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	Configurable I/O operation with 3.3 V or 5 V; 18 Output Macrocells		41.67 MHz		16.51 mm		32
XC73108-15WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz		29.21 mm	No	37
XC7372-12WC68M	Xilinx	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 25 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz		24.13 mm	No	25
XC73144-15PG184M	Xilinx	UV PLD	Military	Pin/Peg	184	PGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P184				No	144 Macrocells With Programmable I/O Architecture		45.5 MHz				120
XC7354-12WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	27 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 42 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	Configurable I/O operation with 3.3 V or 5 V		66.7 MHz		16.51 mm		42
XC7336-12WC44M	Xilinx	UV PLD	Military	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 32 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	Configurable I/O operation with 3.3 V or 5 V; 18 Output Macrocells		47.62 MHz		16.51 mm		32
XC7372-15WC68M	Xilinx	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 25 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz		24.13 mm	No	25
XC7354-12WC68M	Xilinx	UV PLD	Military	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	27 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 42 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops	e0	66.7 MHz		24.13 mm	No	42
XC73144-12PG184M	Xilinx	UV PLD	Military	Pin/Peg	184	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P184				No	144 Macrocells With Programmable I/O Architecture						120
XC7272A-25WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 42 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		40 MHz		29.21 mm	No	42
5962-01-333-2525	Renesas Electronics	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	125 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-286-1613	Renesas Electronics	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	55 ns	No			TTL	MIL-STD-883 Class B (Modified)	18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices				42	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				10
PLX464M-55	Broadcom		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS		26	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T24			7.98 mm	No		e0		8	31.14 mm		8
PLX448M-65	Broadcom	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	65 ns	No	5.5 V	8	CMOS		26	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.3 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	11.1 MHz	8	32.2 mm		8
CPL20R6L35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			16.5 MHz	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.