Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
M38510/50605BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	5.08 mm	6.92 mm	Yes		e0	30 MHz	8	24.2 mm	No	6
TIBPAL20R4-20MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		28.5 MHz	8	11.43 mm		4
5962-8767116KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL	MIL-STD-883			5			Flatpack				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24			No			50 MHz				0
M38510/50303BRX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	14 Dedicated Inputs, 0 I/O	14	-55 °C (-67 °F)		Dual	R-CDIP-T20			No							0
5962-8767118KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24			No			50 MHz				4
TIBPALT19L8MJW	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Dual	R-GDIP-T24			No				8			6
PAL16L8AMFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No				8	8.89 mm		6
5962-8767119LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		74 MHz	8	32.005 mm		0
PAL20L8A-2MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No				8
8103611SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	40 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.54 mm	6.92 mm	No				8			6
PAL20R6A-2MFH	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			18 MHz	8
TIBPAL20R8-12MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Power-Up Reset; Security Fuse		48 MHz	8			0
TIBPAL16R6-15MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-PRF-38535	10	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			50 MHz	6	24.195 mm		2
TIBPAL16R8-20MW	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V	TTL		8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20			No	Power-Up Reset		41.6 MHz	8			0
M38510/50803BLX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular		20 ns	No	5.5 V	CMOS	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-XDIP-T24			No			31.2 MHz				10
TIBPAL16R6-20MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	TTL	MIL-PRF-38535	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	41.6 MHz	6	24.195 mm	No	2
8412904LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	Yes		e0	40 MHz	8	32.005 mm	No	4
TIBPAL20X4MJTB	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			25 MHz	10
TIBPAL20R8-30MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			25 MHz	8
PAL16R6AMW	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20			No			25 MHz	6			2
TIBPAL16R6-20MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL	MIL-PRF-38535	10	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	41.6 MHz	6	8.89 mm	No	2
TIBPAL22V10-20MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL	MIL-PRF-38535	22	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No			33.3 MHz	10	11.43 mm		10
5962-8515504SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.25 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F20	2.45 mm	6.92 mm	Yes		e0	40 MHz	8	13.09 mm	No	4
5962-8515522SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL	MIL-STD-883 Class S	12	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.54 mm	6.92 mm	No			74 MHz	8			4
5962-8515518SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5			Flatpack			No	Registered	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20			Yes			52.5 MHz	8		No	0
TIBPAL20R6-20MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL		14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		28.5 MHz	8	32.005 mm		2
PAL16L8AMFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	8	8.89 mm	No	6
5962-87671183X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	TTL	MIL-STD-883			5			Chip Carrier				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28			No			50 MHz				4
PAL16R6A-2MFH	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic		Yes		TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20			No				6
81036132A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			16 MHz	6	8.89 mm		2
M38510/50802B3X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square		25 ns	Yes	5.5 V	CMOS	MIL-M-38510 Class B			5			Chip Carrier				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-XQCC-N28			No			30 MHz				10
5962-85155152A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	14 ns	Yes	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	Yes		e0	48 MHz	6	8.89 mm	No	2
5962-8767106LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V	Bipolar	MIL-STD-883			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No
81036082X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL	MIL-STD-883 Class B			5			Chip Carrier				Registered	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20			Yes			25 MHz				0
5962-85155132X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	14 ns	Yes	5.5 V	TTL	MIL-STD-883			5			Chip Carrier				Combinatorial	4.5 V			125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20			No							6
PAL16R8AMFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			25 MHz	8	8.89 mm		0
JM38510/50602BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-M-38510 Class B			5			In-Line				Registered	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			41.6 MHz				0
SNJ54LS333J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
TIBPAL16L8-10MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V	TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			52.5 MHz	8	24.195 mm		6
81036142A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	Yes		e0	16 MHz	8	8.89 mm	No	4
GAL20V8-30HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL16V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	20 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	33.3 MHz	8
GAL20V8-30HZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	30 ns	Yes		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	22.2 MHz	8
GAL16V8-30QZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	30 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	22.2 MHz	8
GAL20V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	20 ns	Yes		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	33.3 MHz	8
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.