Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
5962-85155142A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	TTL	MIL-STD-883	8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			48 MHz	8	8.89 mm		0
TIB82S167BMJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL		14	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.5 V	48	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 0 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Field-Programmable Logic Sequencer		25 MHz	6			0
TIBPAL16R8-15MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	12 ns	Yes	5.5 V	TTL	MIL-PRF-38535	8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.45 mm	6.92 mm	No			50 MHz	8			0
5962-8515512RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes		e0	50 MHz	8		No	4
TIBPAL20R4-20MWB	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.25 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			28.5 MHz	8	14.355 mm		4
M38510/50503BLX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V	Bipolar				5			In-Line				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No							2
82S167AMFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	14	PLS-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices				48	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No				6
TIBPALT19R6MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 2 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz	8	11.43 mm		2
8103607RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes		e0	25 MHz	8	24.2 mm	No	6
PAL20R4A-2MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			18 MHz	8
5962-8515509RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			50 MHz	8			6
PAL20R8AJM/883C	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		TTL	MIL-STD-883 Class C	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	20 MHz	8
TIBPALT19R4MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	0 Dedicated Inputs, 4 I/O	0	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz	8	11.43 mm		4
TIBPAL20L8-10MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-PRF-38535	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			50 MHz	8	32.005 mm		6
5962-8515508SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20	2.54 mm	6.92 mm	Yes		e0	25 MHz	8	13.09 mm	No	4
PAL20R4AMFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz	8	11.43 mm		4
TIBPAL22V10-20MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL		22	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		33.3 MHz	10	11.43 mm		10
5962-8515513SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	14 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.45 mm	6.92 mm	No			48 MHz	8			6
M38510/50401BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	Bipolar	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			Yes		e0		8		No	6
8103614SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	40 ns	Yes	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.54 mm	6.92 mm	No			16 MHz	8			4
5962-01-351-3812	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				10
8103611RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	TTL	MIL-STD-883 Class B			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20			Yes							6
TIBPAL16R4-15MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	Power-Up Reset		50 MHz	8	24.195 mm		4
81036112A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	Yes		e0	16 MHz	8	8.89 mm	No	6
TIBPAL16L8-20MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No				8	8.89 mm		6
PAL20L8A-2MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No				8
5962-85155022X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5			Chip Carrier			No	Registered	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20			Yes			41.6 MHz	8		No	0
PAL20L8AMFH	Texas Instruments	OT PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Quad	S-CQCC-J28	2.54 mm	11.43 mm	No				8	11.43 mm		6
PAL16R6AMFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			25 MHz	6	8.89 mm		2
TIBPALT19R6MJWB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				8
TIBPALT19L8MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No				8
TIB82S105BMJD	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	25 ns	No	5.5 V	TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices		Registered	4.5 V	48	2.54 mm	125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28			No	Field-Programmable Logic Sequencer		25 MHz	8			0
JM38510/50501BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.75 V		2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No		e0	40 MHz		32.005 mm		6
PAL16R8AMFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	8	8.89 mm	No	0
TIBPAL16R6-15MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No	Power-Up Reset		50 MHz	6	8.89 mm		2
TIBPALR19L8MJW	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Dual	R-GDIP-T24			No				8			6
PAL16R8AMWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.54 mm	6.92 mm	No			25 MHz	8			0
5962-85155092A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20	2.03 mm	8.89 mm	No			50 MHz	8	8.89 mm		6
TIBPAL22V10AMFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		22	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		22 MHz	10	11.43 mm		10
M38510/50404BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	Bipolar	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 8 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			Yes		e0	20 MHz	8		No	8
GAL20V8-30HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL16V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	20 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	33.3 MHz	8
GAL20V8-30HZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	30 ns	Yes		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	22.2 MHz	8
GAL16V8-30QZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	30 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	22.2 MHz	8
GAL20V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	20 ns	Yes		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	33.3 MHz	8
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.