DIP Programmable Logic Devices (PLD) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
JM38510/50501BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.75 V		2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No		e0	40 MHz		32.005 mm		6
TIBPALR19L8MJW	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Dual	R-GDIP-T24			No				8			6
TIBPAL20L8-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24	5.08 mm	7.62 mm	No		e4	25 MHz	8	31.64 mm		6
TIBPAL20R4-7CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		74 MHz	8	31.64 mm		4
TIBPAL20R4-5CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		111 MHz	8	31.64 mm		4
M38510/50404BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	Bipolar	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 8 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			Yes		e0	20 MHz	8		No	8
GAL20V8-35QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	18.1 MHz	8
GAL39V18-15HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL16V8S-20EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm		8
GAL20V8-30HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL16V8-15HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	15 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	41.6 MHz	8
GAL16V8-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	28.5 MHz	8
GAL39V18-20HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL39V18-20QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-30QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33 MHz	10
GAL16V8S-25EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8AS-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8S-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL20V8-35QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-25QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL39V18-35HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL16V8AS-12HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8	25.15 mm		8
GAL16V8S-20EB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		33.3 MHz		25.15 mm		8
GAL16V8AS-15EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz		25.15 mm		8
GAL16V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL20V8-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	50 MHz	10
GAL39V18-30HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33 MHz	10
GAL16V8-20QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL20V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL20V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8AS-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm		8
GAL20V8S-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8AS-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL20V8AS-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8			8
GAL20V8-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-20HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-10HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8			8
GAL39V18-15QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL20V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8			8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.