Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
10 |
|||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
No |
31.2 MHz |
10 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
45 ns |
No |
3.6 V |
CMOS |
3.3 |
In-Line |
Macrocell |
3 V |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
No |
Programmable Output Polarity |
18 MHz |
26.73 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
BICMOS |
MIL-PRF-38535 |
5 |
In-Line |
Macrocell |
4.75 V |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
No |
e0 |
55 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
9 ns |
No |
3.6 V |
BICMOS |
3.3 |
In-Line |
Macrocell |
3 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
No |
8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock |
91 MHz |
26.73 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Mixed |
4.75 V |
75 °C (167 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
Register Preload; Power-Up Reset |
118 MHz |
2 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
25 MHz |
8 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Power-Up Reset |
60.6 MHz |
31.7 mm |
2 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
9 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Macrocell |
4.75 V |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock |
87 MHz |
10 |
||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
50 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset |
66.6 MHz |
31.7 mm |
10 |
||||||||||||||||||||
NXP Semiconductors |
UV PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
3.6 V |
CMOS |
3.3 |
In-Line |
Macrocell |
2.7 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock |
21 MHz |
24.305 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
No |
22 MHz |
10 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
55 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
75 °C (167 °F) |
4 Dedicated Inputs, 12 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
Programmable Logic Sequencer; 1 External Clock |
14 MHz |
12 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4.7 ns |
No |
ECL |
20 |
PAL-TYPE |
-5.2 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
90 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 8 I/O |
11 |
0 °C (32 °F) |
Dual |
R-GDIP-T24 |
1 |
5.08 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset |
204 MHz |
8 |
31.955 mm |
8 |
|||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock |
87 MHz |
31.7 mm |
10 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
30 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
9.8 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Combinatorial |
4.75 V |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
6 |
||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
50 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Power-Up Reset |
74 MHz |
31.7 mm |
4 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Combinatorial |
4.75 V |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
4.06 mm |
7.62 mm |
No |
26.695 mm |
6 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
BICMOS |
MIL-PRF-38535 |
5 |
In-Line |
Macrocell |
4.75 V |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
No |
e0 |
55 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 10 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
No |
10 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
40 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Combinatorial |
4.75 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 10 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
4.06 mm |
7.62 mm |
No |
Programmable Output Polarity |
26.695 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
35 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Registered |
4.5 V |
125 °C (257 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
No |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.25 V |
TTL |
22 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Combinatorial |
4.75 V |
42 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Programmable Output Polarity |
10 |
31.7 mm |
10 |
||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Power-Up Reset |
74 MHz |
31.7 mm |
2 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
BICMOS |
MIL-PRF-38535 |
5 |
In-Line |
Macrocell |
4.75 V |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
No |
e0 |
71 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
55 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
4 Dedicated Inputs, 12 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
4.06 mm |
7.62 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
14 MHz |
26.695 mm |
12 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
45 ns |
No |
5.5 V |
Bipolar |
18 |
PLA-TYPE |
5 |
In-Line |
No |
Combinatorial |
4.5 V |
42 |
125 °C (257 °F) |
8 Dedicated Inputs, 10 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
No |
10 |
No |
10 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
18.2 MHz |
31.7 mm |
12 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
30 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
12.5 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
Bipolar |
In-Line |
16 Dedicated Inputs |
16 |
Dual |
R-CDIP-T28 |
No |
30 MHz |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Combinatorial |
4.75 V |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
4.06 mm |
7.62 mm |
No |
26.695 mm |
6 |
||||||||||||||||||||||
NXP Semiconductors |
UV PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
55 ns |
No |
5.25 V |
CMOS |
42 |
PLS-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
105 |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
0 °C (32 °F) |
Dual |
R-GDIP-T24 |
1 |
No |
Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload |
14.9 MHz |
12 |
12 |
|||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
No |
10 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Mixed |
4.75 V |
75 °C (167 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
Register Preload; Power-Up Reset |
118 MHz |
4 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
6 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Registered |
4.75 V |
75 °C (167 °F) |
12 Dedicated Inputs, 0 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
Register Preload; Power-Up Reset |
118 MHz |
0 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
35 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Registered |
4.5 V |
125 °C (257 °F) |
12 Dedicated Inputs, 0 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
No |
10.5 MHz |
0 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
6 ns |
No |
5.25 V |
BICMOS |
5 |
In-Line |
Registered |
4.75 V |
75 °C (167 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
Register Preload; Power-Up Reset |
118 MHz |
0 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Mixed |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
20 MHz |
12 |
||||||||||||||||||||||
Infineon Technologies |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
BICMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
90 |
2.54 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T24 |
No |
e0 |
60 MHz |
10 |
|||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
132 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
No |
e0 |
100 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
132 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
No |
e0 |
100 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
25 ns |
No |
5.5 V |
CMOS |
MIL-M-38510 Class B |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
30 MHz |
10 |
|||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
90 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
1 |
No |
e0 |
25 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
90 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
1 |
No |
e0 |
25 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
30 ns |
No |
CMOS |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Combinatorial |
64 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
8 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.