DIP Programmable Logic Devices (PLD) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
5962-01-350-4918	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
5962-01-359-8984	Infineon Technologies		Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No		CMOS		25	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices			192	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T28			No			23.8 MHz	12
5962-01-382-3312	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
5962-01-305-5393	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1		No		e0	25 MHz	10
5962-01-385-4552	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
5962-01-349-2199	Infineon Technologies		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			18.1 MHz	10
5962-01-385-4477	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18.1 MHz	10
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V	CMOS	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	25 MHz				10
5962-01-382-8760	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No				8
5962-01-360-1553	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No				8
5962-01-382-8715	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No				8
5962-01-277-6831	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No			16.5 MHz	4
5962-01-360-4028	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No			16.5 MHz	6
5962-01-349-7443	Infineon Technologies		Military	Through-Hole	28	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	25	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices			192	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28			No			14.2 MHz	12
5962-01-364-5424	Infineon Technologies	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T20			No				8
5962-01-354-5490	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1		No		e0	25 MHz	10
PLD20G10C-15DC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24			No		e0	60 MHz	10
PEEL18CV8ZP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	113	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		7.62 mm	No		e0	33.3 MHz	8		26.162 mm	8
PEEL22CV10AP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz	10		31.75 mm	10
PEEL22CV10AP-10	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz	10		31.75 mm	10
PEEL22CV10API-10	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz	10		31.75 mm	10
PEEL22CV10API-10L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz		260 °C (500 °F)	31.75 mm	10
PEEL18LV8ZP-15	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	2.7 V	113	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		7.62 mm	No		e0	31.25 MHz	8		26.162 mm	8
PA7540PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		22		5	5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No		e0	71.4 MHz	22		31.75 mm	20
PEEL22CV10AZPI-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	133	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No		e3	33.3 MHz	10	260 °C (500 °F)	31.75 mm	10
PEEL22CV10API-7	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz	10		31.75 mm	10
PEEL18CV8PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		7.62 mm	No		e0	41.6 MHz	8		26.162 mm	8
PEEL22LV10AZP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	3.6 V	CMOS		22	PAL-TYPE	3	3/3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	2.7 V	133	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No		e0	25 MHz	10		31.75 mm	10
PA7540P-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS		22		5	5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 20 I/O	0	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No		e3	71.4 MHz	22	260 °C (500 °F)	31.75 mm	20
PA7536P-15	Diodes Incorporated	EE PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS		26		5	5 V	In-Line	DIP28,.3	Field Programmable Gate Arrays	Mixed	4.75 V		2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 12 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T28		7.62 mm	No			83.3 MHz	12	245 °C (473 °F)	34.925 mm	12
PA7572PI-20L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS		24	PLA-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices	Macrocell	4.5 V	124	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T40		15.24 mm	No		e3	66.6 MHz	24	260 °C (500 °F)	52.07 mm	24
PEEL22CV10AP-7L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	117 MHz		260 °C (500 °F)	31.75 mm	10
PEEL18LV8ZPI-35L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	2.7 V	113	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		7.62 mm	No		e3	17.9 MHz	8	260 °C (500 °F)	26.162 mm	8
PEEL22CV10AP-25L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin	Dual	R-PDIP-T24	3	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz		260 °C (500 °F)	31.75 mm	10
PEEL22CV10AP-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin	Dual	R-PDIP-T24	3	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	62.5 MHz		260 °C (500 °F)	31.75 mm	10
PEEL22CV10AZPI-25	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	133	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No		e0	33.3 MHz	10		31.75 mm	10
PEEL18CV8PI-15L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		7.62 mm	No		e3	41.6 MHz	8	260 °C (500 °F)	26.162 mm	8
PA7572P-20L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		24	PLA-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices	Macrocell	4.75 V	124	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T40		15.24 mm	No		e3	66.6 MHz	24	260 °C (500 °F)	52.07 mm	24
PEEL22CV10AP-10L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz		260 °C (500 °F)	31.75 mm	10
PEEL18CV8P-7L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		7.62 mm	No		e3	83.3 MHz	8	260 °C (500 °F)	26.162 mm	8
PEEL18CV8PI-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		7.62 mm	No		e3	28.5 MHz	8	260 °C (500 °F)	26.162 mm	8
PA7572PI-20	Diodes Incorporated	EE PLD	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS		24	PLA-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices	Macrocell	4.5 V	124	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Dual	R-PDIP-T40		15.24 mm	No			66.6 MHz	24	245 °C (473 °F)	52.07 mm	24
PEEL18CV8ZPI-25	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	113	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		7.62 mm	No		e0	33.3 MHz	8		26.162 mm	8
PEEL22CV10AZP-25L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	133	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No		e3	33.3 MHz	10	260 °C (500 °F)	31.75 mm	10
PA7536PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		26		5	5 V	In-Line	DIP28,.3	Field Programmable Gate Arrays	Mixed	4.5 V		2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)		Dual	R-PDIP-T28		7.62 mm	No			83.3 MHz	12	245 °C (473 °F)	34.925 mm	12
PEEL22CV10API-15L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	62.5 MHz		260 °C (500 °F)	31.75 mm	10
PA7540PI-15L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		22		5	5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		7.62 mm	No		e3	71.4 MHz	22	260 °C (500 °F)	31.75 mm	20
PEEL22CV10API-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz	10		31.75 mm	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.