DIP Programmable Logic Devices (PLD) 1,674

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5962-8850701LX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 12 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

20 MHz

12

PLUS153DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

TTL

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Output Polarity

10

10

LVT16V8-6N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

7 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

111 MHz

26.73 mm

8

M38510/50202BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

N82S105N

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

48

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

9.8 MHz

8

LVT22V10-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8.5 ns

No

3.6 V

BICMOS

22

PAL-TYPE

3.3

3.3 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

3 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

95 MHz

10

31.7 mm

10

M38510/50201BXX

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

PLUS16R6DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

26.695 mm

2

PLUS405-45N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

15 Dedicated Inputs, 8 I/O

15

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

29.4 MHz

8

36.51 mm

8

PLUS173BN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

22

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

10

31.7 mm

10

PLUS153BN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Output Polarity

10

10

PLC18V8Z25N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

82S101/BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

80 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

5962-9201201MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

10.5 MHz

0

PLUS20L8DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

31.7 mm

6

PLUS153-10N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Output Polarity

10

PLUS16R8/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

50 MHz

8

5962-8984105LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

42 MHz

10

PLUS105-70N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6.5 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

36.51 mm

0

LVT22V10-BN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

31.7 mm

10

PLUS105-55N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

35.7 MHz

36.51 mm

0

PLS167AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

31.7 mm

0

PLUS16R6-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

74 MHz

26.695 mm

2

PLS153AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Programmable Output Polarity

26.695 mm

10

P3C18V8Z40N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

40 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

Programmable Output Polarity

22 MHz

26.73 mm

8

PLC18V8ZIAFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

24.305 mm

8

PL22V10I15N

NXP Semiconductors

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

31.7 mm

10

5962-8768201MRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

10

PLHS473/BLA

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

20 ns

No

Bipolar

In-Line

11 Dedicated Inputs, 9 I/O

11

Dual

R-CDIP-T24

No

9

5962-9176007MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

BICMOS

MIL-STD-883 Class B

5

In-Line

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

55 MHz

10

PLQ20L8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

PLUS105-45N3

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.33 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

31.3 MHz

35.505 mm

0

PLUS405-37N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

15 Dedicated Inputs, 8 I/O

15

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

25 MHz

8

36.51 mm

8

PLC42VA12IFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

55 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

85 °C (185 °F)

8 Dedicated Inputs, 12 I/O

8

-40 °C (-40 °F)

Dual

R-GDIP-T24

No

Programmable Multi-Function Pld; Register Preload; Shared Input/Clock

14.9 MHz

12

PLS168N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

31.7 mm

0

PLS167N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

31.7 mm

0

82S105/BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

5

In-Line

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

10.5 MHz

0

PLUS173-10N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

31.7 mm

10

PLC42VA12N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

CMOS

42

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

105

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T24

1

4.7 mm

7.62 mm

No

Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload

14.9 MHz

12

31.7 mm

12

P3Q22V10-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

11 Dedicated Inputs, 10 I/O

11

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload

105 MHz

31.7 mm

10

PLC42VA12IN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

85 °C (185 °F)

8 Dedicated Inputs, 12 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T24

No

Programmable Multi-Function Pld; Register Preload; Shared Input/Clock

14.9 MHz

12

PLC18V8Z35FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

24.305 mm

8

P3Q16V8-7N

NXP Semiconductors

OT PLD

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

8 Dedicated Inputs, 9 I/O

8

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

26.695 mm

9

PLUS16R4DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

26.695 mm

4

LVT20V8-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

12 Dedicated Inputs, 8 I/O

12

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

110 MHz

31.7 mm

8

P3Q20V8-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

12 Dedicated Inputs, 9 I/O

12

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

31.7 mm

9

PLUS20L8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

31.7 mm

6

5962-9176007MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

BICMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

55 MHz

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.