Square Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9536XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	125 MHz		36		10 mm	Yes	36
XC9572-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-15PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3032A-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	10 mm		32
XCR3064XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS				3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XCR3256XL-12PQ208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS				3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	88 MHz				28 mm	Yes	164
XCR3256XL-12TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS				3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	88 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
XCR3512XL-12PQ208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS		184	PLA-TYPE	3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	67.56 MHz		180		28 mm	Yes	180
XCR3512XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	135 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
5962-89839032A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns		Yes	5.5 V		CMOS	MIL-STD-883			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	41.6 MHz				8.89 mm		8
5962-9154505MYX	Microchip Technology	UV PLD	Military	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns		Yes	5.5 V		CMOS	MIL-STD-883			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	13 Dedicated Inputs, 24 I/O	13	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.57 mm	16.5862 mm	No			40 MHz				16.5862 mm		24
5962-9952501QZC	Defense Logistics Agency	EE PLD	Military	Gull Wing	208	FQFP	Square		15 ns		Yes	5.5 V	512	CMOS	MIL-PRF-38535 Class Q	165	PLA-TYPE	5		Flatpack, Fine Pitch	QFP208,1.2SQ,20		Yes	Macrocell	4.5 V		.5 mm	125 °C (257 °F)	1 Dedicated Inputs, 160 I/O	1	-55 °C (-67 °F)	Gold	Quad	S-XQFP-G208		2.94 mm	28 mm	Yes		e4	62.5 MHz		160		28 mm	Yes	160
5M2210ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		271		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	201.1 MHz	30 s	271	260 °C (500 °F)	19 mm	Yes	271
5M240ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS		52		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz		52		5 mm	Yes	52
5M40ZM64C4	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V						1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	184.1 MHz				4.5 mm		30
5M80ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
5M80ZT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS				1.8	1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	184.1 MHz				14 mm	Yes	79
ATF1500A-12JC	Atmel	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.25 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	62.5 MHz			225 °C (437 °F)	16.586 mm	No	32
ATF1500AL-20AC	Atmel	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	40 MHz				10 mm	No	32
ATF1502ASV-20AC44	Atmel	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	32	CMOS				3.3	3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	83.3 MHz				10 mm	Yes	32
ATF1504AS-10JC68	Atmel	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	4.57 mm	24.2316 mm	No	64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry	e0	125 MHz			225 °C (437 °F)	24.2316 mm	Yes	48
ATF1508ASV-15AI100	Atmel	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	128					3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	100 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
ATF1508ASVL-20AI100	Atmel	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	128					3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	83.3 MHz			240 °C (464 °F)	14 mm	Yes	80
CY37032P44-154AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	32	CMOS				5	3.3/5,5 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	1 Dedicated Inputs, 37 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44		1.6 mm	10 mm	No	32 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	105 MHz				10 mm	Yes	37
CY37032P44-154AXI	Infineon Technologies	EE PLD		Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	32	CMOS		37	PLA-TYPE	5		Flatpack, Low Profile	QFP44,.47SQ,32		Yes	Macrocell	4.5 V	87	.8 mm	85 °C (185 °F)	5 Dedicated Inputs, 32 I/O	5	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.6 mm	10 mm				105 MHz		32		10 mm	Yes	32
CY37064P100-125AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS				5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				14 mm	Yes	69
CY37064P100-200AXC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	64	CMOS				5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY37064P84-200JC	Cypress Semiconductor	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	64	CMOS				5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				29.3116 mm	Yes	69
CY37128P160-125AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	160	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS				5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 133 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	1.6 mm	24 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				24 mm	Yes	133
CY37128VP84-83YMB	Cypress Semiconductor	EE PLD	Military	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns		Yes	3.6 V	128	CMOS	38535Q/M;38534H;883B			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	125 °C (257 °F)	1 Dedicated Inputs, 69 I/O	1	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J84		4.826 mm	29.21 mm	No	128 Macrocells	e0	62.5 MHz				29.21 mm	Yes	69
CY37512P208-83UMB	Cypress Semiconductor	EE PLD	Military	Gull Wing	208	FQFP	Square	Ceramic, Metal-Sealed Cofired	15 ns		Yes	5.5 V	512	CMOS	38535Q/M;38534H;883B	165	PLA-TYPE	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	125 °C (257 °F)	1 Dedicated Inputs, 160 I/O	1	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-G208	1	3.94 mm	28 mm	No	512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V	e0	62.5 MHz		160		28 mm	Yes	160
CY39100V256B-83BBC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	15 ns		Yes	2.7 V	1536	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.6 mm	17 mm	No	Also operates at 3.3 V nominal supply	e0					17 mm	Yes	180
CY7C342-30HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	60 ns		Yes	5.5 V	128	CMOS				5	5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J68		5.08 mm	24.13 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				24.13 mm	No	52
CY7C343B-35JI	Cypress Semiconductor	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	35 ns		Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.572 mm	16.6116 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz				16.6116 mm	No	28
EP1810LC-20T	Altera	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	22 ns		Yes	5.25 V	48	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 48 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		5.08 mm	24.23 mm	No	Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks	e0	50 MHz			220 °C (428 °F)	24.23 mm	No	48
EP1K100QC208-1	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS		147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	90 MHz		147		28 mm		147
EP1K30TC144-3	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V		CMOS		102		2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			102		20 mm		102
EP1K50FC256-1N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	90 MHz		186		17 mm		186
EP1K50FI256-2	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz		186		17 mm		186
EP1K50FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		186		17 mm		186
EP20K100EQC208-1X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS		143		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			143		28 mm		151
EP20K100FC324-1	Intel	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0			246		19 mm		252
EP20K1500EFC33-1X	Intel	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS		800		1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	5A	3.5 mm	33 mm	No		e0			800		33 mm		808
EP20K160EQC208-2X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS		135		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz		135		28 mm		143
EP20K30EFI144-2X	Intel	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V		CMOS		85		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0			85		13 mm		93
EP20K400BC652-1	Intel	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS		496		2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			496		45 mm		502
EP20K600EBI652-2X	Intel	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS		480		1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			480		45 mm		488
EP22V10ELC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz		10	220 °C (428 °F)	11.505 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.