Square Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5962-89841063A	Defense Logistics Agency	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns		Yes	5.5 V		CMOS	MIL-STD-883			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28		1.9812 mm	11.43 mm	Yes		e0	76.9 MHz				11.43 mm		10
CY7C344-25JC	Cypress Semiconductor	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J28		4.57 mm	11.5316 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz	30 s	16	225 °C (437 °F)	11.5316 mm		16
EP1K50FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			186		17 mm		186
EP20K200EQC208-2X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS		128		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			128		28 mm		136
EPF10K20RI208-4	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS		147		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	67.11 MHz		147		28 mm		147
EPF10K20TC144-3N	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS		102		5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			102		20 mm		102
EPF10K30RI208-4N	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS		147		5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	62.89 MHz		147		28 mm		147
EPF8282LC84-3	Altera	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS		68		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 64 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			64	220 °C (428 °F)	29.3116 mm		64
EPM7256SQC208-10N	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	256	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	164
GAL26V12C-15LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS		26	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	122	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	55.5 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
ISPLSI1016E-80LTN44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.25 V	64	CMOS		35	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	57 MHz		32	260 °C (500 °F)	10 mm	No	32
ISPLSI1032-60LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V	128	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 64 I/O	4	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	4.57 mm	29.3116 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
ISPLSI2032A-80LT44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.5 V	32	CMOS				5	5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G44	3		10 mm	No		e0	57 MHz				10 mm	No	32
LA4032V-75TN44E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	32	CMOS	AEC-Q100	30		3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 30 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	168 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LA4128V-75TN100E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	128	CMOS	AEC-Q100	64		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	168 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4064ZC-75TN48I	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64			36	PAD-TYPE	1.8	1.8 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	111 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4128ZE-5TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5.8 ns		Yes	1.9 V	128	CMOS				1.8	1.8 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		10 Dedicated Inputs, 64 I/O	10		Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	149 MHz	40 s		260 °C (500 °F)	14 mm	Yes	64
M4A3-256/128-10YNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS				3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	14 Dedicated Inputs, 128 I/O	14	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	28 mm	Yes	128
M4A3-32/32-5VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	32	CMOS			PAL-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	105 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
MACH211SP-12VC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12 ns		Yes	5.25 V	64	CMOS				5	5 V	Flatpack	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3		10 mm	No		e0	66.7 MHz			240 °C (464 °F)	10 mm	No	64
XC2C256-7TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real Digital Design Technology	e4	108 MHz		118		20 mm	Yes	118
XC2C512-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95216-10PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	216	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC9536XL-10VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells	e4	100 MHz		36		10 mm	Yes	36
CY7C342B-25JC	Cypress Semiconductor	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	40 ns		Yes	5.25 V	128	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 52 I/O	7	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz				24.2316 mm	No	52
EP1K100FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			186		17 mm		186
EP1K100QC208-1N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS		147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	90 MHz		147		28 mm		147
EP1K30TC144-1	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		102		2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	90 MHz		102		20 mm		102
EPF10K20RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS		189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1152 Logic Elements	e0	71.43 MHz		189		32 mm		189
EPF10K250ABC600-1	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	12160	Yes	3.6 V		CMOS		470		3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	45 mm		470
EPF10K30AQI208-3N	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS		147		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic Elements; 216 Labs	e3	80 MHz		147		28 mm		147
EPF10K30RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS		189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	66.67 MHz		189		32 mm		189
EPM570F100I5	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	440	CMOS		76		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e0			76		11 mm	Yes	76
EPM570GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		160		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
EPM7032STC44-10	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	125 MHz			220 °C (428 °F)	10 mm	Yes	36
EPM7064AETC100-10	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	100 MHz	30 s		235 °C (455 °F)	14 mm	Yes	68
EPM7064STC44-5N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	64	CMOS				5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	250 MHz				10 mm	No	36
EPM7064STI100-10	Altera	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	64 Macrocells	e0	125 MHz			220 °C (428 °F)	14 mm	No	68
EPM7128SLI84-10	Intel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	2	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				29.3116 mm	Yes	68
EPM7128STI100-10	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				14 mm	Yes	84
EPM7192SQC160-15N	Intel	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	192	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 124 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				28 mm	Yes	124
EPM7256AETC100-7	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	126.6 MHz	30 s		235 °C (455 °F)	14 mm	Yes	84
EPM7256SQC208-10	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	256	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				28 mm	Yes	164
EPM7512AEFC256-7	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	116.3 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM9320ALC84-15	Altera	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns		Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 56 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	320 Macrocells					220 °C (428 °F)	29.3116 mm		56
EPM9560RC208-15	Altera	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	16.6 ns		Yes	5.25 V	560	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 153 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	28 mm	Yes	153
GAL22V10C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	71.4 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
GAL22V10D-10QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.