Square Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL16V8D-10QJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
LC4064V-5TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	64		32	PAD-TYPE	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	156 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4128V-10TN100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128		74	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	86 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LC4128ZC-75MN132I	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128		100	PAD-TYPE	1.8	1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 96 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
LC4128ZE-7MN144I	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 96 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	96
LC4256V-10T176I	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 128 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e0	86 MHz	30 s	128	256 °C (492.8 °F)	21 mm	Yes	128
LC4256V-3T144C	Lattice Semiconductor	EE PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256		110	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	14 Dedicated Inputs, 96 I/O	14	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	212 MHz	30 s	96	256 °C (492.8 °F)	20 mm	Yes	96
LC4256V-3TN176C	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e3	212 MHz	40 s	128	260 °C (500 °F)	21 mm	Yes	128
LC4256ZE-5MN144C	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	5.8 ns		Yes	1.9 V	256	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 108 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	149 MHz	40 s		260 °C (500 °F)	7 mm	Yes	108
M4A3-64/32-7VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS		PAL-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
M4A5-192/96-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	192	CMOS			5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	16 Dedicated Inputs, 96 I/O	16	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	52.6 MHz	40 s		260 °C (500 °F)	20 mm	Yes	96
M4A5-32/32-10JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-12JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	52.6 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-5VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	32	CMOS	34	PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	105 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
XC2C256-6VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	80	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e4	139 MHz		80		14 mm	Yes	80
XC2C256-7PQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 173 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC2C32A-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	450 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC2C64A-7CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
XC95108-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9536-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XC9572-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9572-15PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC9572XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		36		10 mm	Yes	52
XCR3032XL-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32	CMOS			3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	95 MHz				10 mm	Yes	36
XCR3032XL-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	119 MHz				10 mm	Yes	36
5M160ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M40ZE64I5	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
5M570ZT100C5	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V					1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz				14 mm		74
5M80ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V					1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
ATF1508ASL-20JC84	Atmel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	128				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	41.7 MHz			225 °C (437 °F)	29.3115 mm	Yes	64
CY37128P160-100AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	160	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	128	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 133 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160		1.6 mm	24 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	80 MHz				24 mm	Yes	133
EP1K100FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		186		17 mm		186
EP1K50QI208-2N	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	37.5 MHz		147		28 mm		147
EP1K50TI144-3	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.625 V		CMOS	102		2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Registered	2.375 V		.5 mm	85 °C (185 °F)	6 Dedicated Inputs, 102 I/O	6	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			102	220 °C (428 °F)	20 mm		102
EP20K30EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS	120		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EPF10K20RC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.5 ns	1152	Yes	5.25 V		CMOS	147		5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	71.43 MHz		147		28 mm		147
EPF6010ATC144-3N	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 10000 Logic Gates	e3	133 MHz				20 mm		102
EPM1270T144C3	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS	116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM1270T144C4	Intel	Flash PLD	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS	116		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e0			116		20 mm	Yes	116
EPM2210F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210F256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			204		17 mm	Yes	204
EPM2210GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	204		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM3128ATI100-10	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	98 MHz				14 mm	Yes	80
EPM5032JC	Intel	OT PLD	Commercial	J Bend	28		Square	Plastic/Epoxy	25 ns		Yes	5.25 V	32	CMOS	24	PAL-TYPE	5					No	Macrocell	4.75 V	320		70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)		Quad	S-XQCC-J28							50 MHz		16			No	16
EPM5032JC-20	Altera	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns		Yes	5.25 V		CMOS	24	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032JM-25	Altera	UV PLD	Military	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns		Yes			CMOS	24	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		320	1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032LC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS	24	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.