Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
14 mm |
Yes |
84 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs |
e3 |
56 MHz |
40 s |
245 °C (473 °F) |
28 mm |
No |
96 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
32 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e3 |
52.6 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
132 |
TFBGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA132,14X14,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B132 |
3 |
1.1 mm |
8 mm |
No |
e1 |
152 MHz |
30 s |
100 |
260 °C (500 °F) |
8 mm |
Yes |
100 |
||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||||
|
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
440 |
CMOS |
1.8,1.2/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
No |
Yes |
|||||||||||||||||||||||||
Intel |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
114 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
184.1 MHz |
20 mm |
114 |
|||||||||||||||||||||
Intel |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
114 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
118.3 MHz |
20 mm |
114 |
|||||||||||||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock |
e0 |
125 MHz |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
|||||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
1.89 V |
440 |
CMOS |
76 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
76 |
14 mm |
Yes |
76 |
|||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
14 mm |
80 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
56 |
LFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
32 |
36 |
PAD-TYPE |
1.8 |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA56,10X10,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
No |
e1 |
111 MHz |
40 s |
32 |
260 °C (500 °F) |
6 mm |
Yes |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
5.8 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
4 Dedicated Inputs, 32 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
149 MHz |
40 s |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
74 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
90 °C (194 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
74 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
105 °C (221 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
76.9 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic |
14 ns |
Yes |
64 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
No |
Yes |
||||||||||||||||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.57 mm |
29.3116 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
29.3116 mm |
Yes |
64 |
||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
37.5 MHz |
102 |
20 mm |
102 |
||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1152 |
Yes |
5.25 V |
CMOS |
102 |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
102 |
20 mm |
102 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
336 Logic Elements |
e0 |
385 MHz |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
||||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
9.1 ns |
Yes |
2.625 V |
1700 |
CMOS |
204 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 204 I/O |
0 |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
30 s |
204 |
260 °C (500 °F) |
17 mm |
Yes |
204 |
|||||||
|
Intel |
Flash PLD |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4.7 ns |
Yes |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
80 |
14 mm |
Yes |
80 |
||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
166.7 MHz |
16.5862 mm |
Yes |
36 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs |
e0 |
56 MHz |
30 s |
225 °C (437 °F) |
28 mm |
No |
96 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
77 MHz |
260 °C (500 °F) |
10 mm |
No |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
176 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
105 °C (221 °F) |
4 Dedicated Inputs, 128 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
No |
e3 |
86 MHz |
40 s |
128 |
260 °C (500 °F) |
21 mm |
Yes |
128 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
74 |
PAD-TYPE |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
83 |
.5 mm |
130 °C (266 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
96 |
CMOS |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 48 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
48 |
||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.9 V |
512 |
CMOS |
173 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 173 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
91 MHz |
30 s |
173 |
245 °C (473 °F) |
28 mm |
Yes |
173 |
||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
288 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
125 MHz |
30 s |
117 |
260 °C (500 °F) |
20 mm |
Yes |
117 |
|||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
68 |
|||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
125 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
240 °C (464 °F) |
14 mm |
Yes |
64 |
|||||||||||
Intel |
Loadable PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1.93 ns |
6400 |
Yes |
1.89 V |
CMOS |
80 |
1.8 |
1.8,1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 88 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
160 MHz |
80 |
20 mm |
88 |
||||||||||||
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
9984 |
Yes |
2.625 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
182 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
182 |
32 mm |
182 |
||||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.9 ns |
1728 |
Yes |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
1728 Logic Elements; 216 Labs |
e3 |
80 MHz |
102 |
20 mm |
102 |
||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e3 |
140 MHz |
189 |
32 mm |
189 |
|||||||||||
Intel |
Flash PLD |
Commercial Extended |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6.1 ns |
Yes |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e0 |
80 |
14 mm |
Yes |
80 |
||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
192 |
CMOS |
80 |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
6 mm |
No |
It can also operate at 3.3 V |
e1 |
80 |
6 mm |
Yes |
80 |
||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
166.7 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
100 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
105 °C (221 °F) |
4 Dedicated Inputs, 96 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
86 MHz |
40 s |
96 |
260 °C (500 °F) |
20 mm |
Yes |
96 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2.7 ns |
Yes |
3.6 V |
128 |
100 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 96 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
222 MHz |
40 s |
96 |
260 °C (500 °F) |
20 mm |
Yes |
96 |
|||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
No |
e1 |
208.3 MHz |
30 s |
192 |
260 °C (500 °F) |
17 mm |
Yes |
192 |
|||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.55 mm |
27 mm |
No |
e1 |
125 MHz |
30 s |
192 |
250 °C (482 °F) |
27 mm |
Yes |
192 |
|||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e4 |
138.88 MHz |
34 |
10 mm |
Yes |
34 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.