Square Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL22V10D-5LJN

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

e3

142.8 MHz

40 s

10

245 °C (473 °F)

11.5062 mm

10

XC2C32A-4CP56C

Xilinx

Flash PLD

Commercial

Ball

56

LFBGA

Square

Plastic/Epoxy

4 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

33 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

Real Digital Design Technology

e0

450 MHz

30 s

240 °C (464 °F)

6 mm

Yes

33

EPM7064AETC44-4N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

36

PLA-TYPE

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

2048

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

222.2 MHz

36

10 mm

Yes

36

GAL22V10D-25QJN

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

e3

33.3 MHz

40 s

10

245 °C (473 °F)

11.5062 mm

10

XA2C64A-7VQG44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

AEC-Q100

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 33 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

10 mm

Yes

33

XC2C64A-5VQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

333 MHz

30 s

260 °C (500 °F)

14 mm

Yes

64

XC95288XL-10PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

100 MHz

30 s

168

245 °C (473 °F)

28 mm

Yes

168

XC95288XL-7FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

125 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

ATF1504ASL-20AC100

Atmel

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

64

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

83.3 MHz

240 °C (464 °F)

14 mm

Yes

64

EP1K50QC208-1N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

90 MHz

147

28 mm

147

EP1K50QC208-3N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

147

28 mm

147

EPM3032ALC44-4N

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

227.3 MHz

16.5862 mm

Yes

34

EPM7192SQC160-10N

Intel

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

192

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 124 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

28 mm

Yes

124

GAL16V8D-7LJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

100 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

ISPLSI1016E-125LJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

64

CMOS

35

PLA-TYPE

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

3 Dedicated Inputs, 32 I/O

3

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.57 mm

16.59 mm

No

e3

100 MHz

40 s

32

245 °C (473 °F)

16.59 mm

No

32

LC4256ZE-5TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5.8 ns

Yes

1.9 V

256

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

10 Dedicated Inputs, 64 I/O

10

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

149 MHz

40 s

260 °C (500 °F)

14 mm

Yes

64

LC5512MV-75Q208C

Lattice Semiconductor

EE PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

0 Dedicated Inputs, 149 I/O

0

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

30 s

225 °C (437 °F)

28 mm

Yes

149

M4A3-64/32-10VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

62.5 MHz

40 s

260 °C (500 °F)

10 mm

Yes

32

XC2C256-6TQG144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

118

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 118 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Real Digital Design Technology

e3

139 MHz

30 s

118

260 °C (500 °F)

20 mm

Yes

118

XC95144XL-7TQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

81

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

138.88 MHz

30 s

81

260 °C (500 °F)

14 mm

Yes

81

EPM1270T144I5

Intel

Flash PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

116

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 116 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e0

116

20 mm

Yes

116

LC4032V-5TN48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

156 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4128V-5TN128I

Lattice Semiconductor

EE PLD

Gull Wing

128

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

96

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP128,.64SQ,16

Programmable Logic Devices

Yes

Macrocell

3 V

83

.4 mm

105 °C (221 °F)

4 Dedicated Inputs, 92 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G128

3

1.6 mm

14 mm

No

e3

156 MHz

40 s

92

260 °C (500 °F)

14 mm

Yes

92

M4A5-64/32-10VNI48

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

64

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

62.5 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

M4A5-64/32-7VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

64

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

76.9 MHz

40 s

32

260 °C (500 °F)

10 mm

Yes

32

XC9572XL-10TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

72

CMOS

72

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

72 Macrocells

e4

100 MHz

72

14 mm

Yes

72

XCR3128XL-7VQ100I

Xilinx

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

3/3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

119 MHz

30 s

240 °C (464 °F)

14 mm

Yes

84

5M570ZT144I5

Intel

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

114 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e0

118.3 MHz

20 mm

114

EPM7032SLC44-10N

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin/Copper

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e2

125 MHz

40 s

245 °C (473 °F)

16.5862 mm

Yes

36

EPM7064SLC44-7N

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

166.7 MHz

16.5862 mm

No

36

EPM7064SLI44-7N

Intel

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

166.7 MHz

30 s

245 °C (473 °F)

16.5862 mm

No

36

EPM7256AETC100-10

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

95.2 MHz

30 s

235 °C (455 °F)

14 mm

Yes

84

EP1K50TI144-2N

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

37.5 MHz

102

20 mm

102

EPM7256SQC208-15N

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

256

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

100 MHz

28 mm

Yes

164

LC4128V-75TN144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

100

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 96 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

111 MHz

30 s

96

260 °C (500 °F)

20 mm

Yes

96

LC4128ZE-5TN144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5.8 ns

Yes

1.9 V

128

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 96 I/O

4

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

149 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

LC4256V-75TN100E

Lattice Semiconductor

EE PLD

Automotive

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

130 °C (266 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256ZE-5TN144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5.8 ns

Yes

1.9 V

256

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

14 Dedicated Inputs, 96 I/O

14

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

149 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

XC2C64A-7PCG44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 33 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e3

200 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

33

ATF1502AS-7JX44

Microchip Technology

EE PLD

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

32

36

PAL-TYPE

5

Chip Carrier

LDCC44,.7SQ

Yes

Macrocell

4.75 V

40

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.586 mm

95.23 MHz

40 s

32

245 °C (473 °F)

16.586 mm

Yes

32

ATF22V10C-15JU-T

Microchip Technology

Flash PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

10 Dedicated Inputs, 10 I/O

10

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

55.5 MHz

11.5062 mm

10

ATF22V10CQZ-20JU-T

Microchip Technology

Flash PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

5

Tape and Reel

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.572 mm

11.506 mm

38.5 MHz

11.506 mm

10

EP1K100QI208-2N

Intel

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

37.5 MHz

147

28 mm

147

EPM2210F324A5N

Intel

Flash PLD

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

GAL16V8D-15QJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

45.5 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

SLG47004V

Renesas Electronics

OT PLD

No Lead

24

VQCCN

Square

Yes

5.5 V

20

8

PLA-TYPE

2.5

Chip Carrier, Very Thin Profile

LCC24,.12SQ,16

Yes

Macrocell

2.4 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 7 I/O

1

-40 °C (-40 °F)

Quad

S-XQCC-N24

1

.6 mm

3 mm

7

3 mm

No

7

XC95288XL-7TQ144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

125 MHz

117

20 mm

Yes

117

XC9536XL-7VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

36

CMOS

34

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

138.88 MHz

30 s

34

260 °C (500 °F)

10 mm

Yes

34

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.