Square Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

M4A5-64/32-12VI48

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

64

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e0

52.6 MHz

30 s

240 °C (464 °F)

7 mm

Yes

32

PALCE22V10-10JCR

Cypress Semiconductor

Flash PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

76.9 MHz

10

PALCE22V10-10JCT

Cypress Semiconductor

Flash PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.572 mm

11.5316 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

76.9 MHz

11.5316 mm

10

XC2C32A-6CP56C

Xilinx

Flash PLD

Commercial

Ball

56

LFBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

33 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

Real Digital Design Technology

e0

300 MHz

30 s

240 °C (464 °F)

6 mm

Yes

33

XC95108-10TQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

Yes

81

XC9536-15VQ44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

55.6 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XCR3128XL-7VQG100C

Xilinx

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

119 MHz

30 s

260 °C (500 °F)

14 mm

Yes

84

5M1270ZF256C4N

Intel

Flash PLD

Other

Ball

256

LBGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

211 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

247.5 MHz

17 mm

Yes

211

5M1270ZF324C5N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

19 mm

Yes

271

5M1270ZT144C5

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

114 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e0

201.1 MHz

20 mm

114

5M2210ZF256I5

Intel

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

203

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

203 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

201.1 MHz

203

17 mm

Yes

203

5M40ZE64C4

Intel

Flash PLD

Other

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

7.9 ns

Yes

1.89 V

1.8

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

54 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

1.2 mm

7 mm

No

e0

184.1 MHz

7 mm

54

5M570ZT100I5

Intel

Flash PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

1.8

Flatpack, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

74 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

1.2 mm

14 mm

No

e0

118.3 MHz

14 mm

74

5M80ZM68C5N

Intel

Flash PLD

Other

Ball

68

TFBGA

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

64

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA68,9X9,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

52 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B68

1.2 mm

5 mm

No

e1

118.3 MHz

5 mm

Yes

52

ATF1504ASV-15JC44

Atmel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

2

4.572 mm

16.586 mm

No

e0

100 MHz

225 °C (437 °F)

16.586 mm

Yes

32

ATF1504ASVL-20AC100

Atmel

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

20 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

83.3 MHz

240 °C (464 °F)

14 mm

Yes

64

ATF1508ASL-20AC100

Atmel

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

128

5

3.3/5,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

128 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

41.7 MHz

240 °C (464 °F)

14 mm

Yes

80

ATF16V8C-5JX

Microchip Technology

Flash PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

Tube

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 8 I/O

7

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

4.572 mm

8.966 mm

No

8 Macrocells

e3

142 MHz

8

8.966 mm

8

ATF22V10C-7JU

Microchip Technology

Flash PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

Tube

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

85 °C (185 °F)

10 Dedicated Inputs, 10 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

e3

125 MHz

10

11.5062 mm

10

CY37128P100-100AC

Cypress Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

128

CMOS

5

3.3/5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

1 Dedicated Inputs, 69 I/O

1

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

128 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

80 MHz

14 mm

Yes

69

EP1K10TC144-3N

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.7 ns

576

Yes

2.625 V

CMOS

92

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

92 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

92

20 mm

92

EP1K30QC208-3N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

147

28 mm

147

EP1K50TI144-2

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

37.5 MHz

102

20 mm

102

EP2A15F672C9

Intel

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.23 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

480

27 mm

492

EPF10K100EQC240-3N

Intel

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

4992 Logic Elements

e3

140 MHz

189

32 mm

189

EPF10K200SRC240-3N

Intel

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

0.8 ns

9984

Yes

2.625 V

CMOS

182

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

182 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

182

32 mm

182

EPF10K20RC240-4

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.6 ns

1152

Yes

5.25 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1152 Logic Elements

e0

67.11 MHz

189

32 mm

189

EPF10K20RC240-4N

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.6 ns

1152

Yes

5.25 V

CMOS

189

5

3.3/5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1152 Logic Elements

e3

67.11 MHz

189

32 mm

189

EPF10K30ATI144-3N

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

102

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 102 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

1728 Logic Elements; 216 Labs

e3

80 MHz

102

20 mm

102

EPF6016TC144-3

Intel

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1320

Yes

5.25 V

CMOS

117

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Macrocell

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 117 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 16000 Logic Gates

e0

133 MHz

117

20 mm

117

EPF6016TC144-3N

Intel

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1320

Yes

5.25 V

CMOS

117

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Macrocell

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 117 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 16000 Logic Gates

e3

133 MHz

117

20 mm

117

EPM3064ATC44-4NAG

Intel

EE PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

70 °C (158 °F)

0 Dedicated Inputs, 30 I/O

0

0 °C (32 °F)

Quad

S-PQFP-G44

222.2 MHz

30

EPM7032SLC44-6N

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

200 MHz

16.5862 mm

Yes

36

EPM7032SLC44-7

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

e0

166.7 MHz

220 °C (428 °F)

16.5862 mm

Yes

36

EPM7064STC44-10FN

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Low Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

125 MHz

10 mm

36

GAL16V8D-20QJI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e0

41.6 MHz

30 s

8

225 °C (437 °F)

8.9662 mm

8

GAL16V8D-25LJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-25QJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

LC4128ZE-7TN144I

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 96 I/O

4

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

111 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

LC4256V-5TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

256

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

156 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256V-5TN144I

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

256

110

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

14 Dedicated Inputs, 96 I/O

14

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

156 MHz

40 s

96

260 °C (500 °F)

20 mm

Yes

96

LC4512V-10TN176I

Lattice Semiconductor

EE PLD

Gull Wing

176

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

132

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP176,1.0SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 128 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G176

3

1.6 mm

21 mm

No

e3

86 MHz

40 s

128

260 °C (500 °F)

21 mm

Yes

128

M4A3-64/32-55VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

64

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

105 MHz

40 s

260 °C (500 °F)

10 mm

Yes

32

M4A5-32/32-7VNI48

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

32

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

76.9 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

M4A5-96/48-12VNI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

96

CMOS

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 48 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

52.6 MHz

40 s

260 °C (500 °F)

14 mm

Yes

48

M4A5-96/48-55VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5.5 ns

Yes

5.25 V

96

CMOS

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 48 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

105 MHz

40 s

260 °C (500 °F)

14 mm

Yes

48

M4A5-96/48-7VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

96

CMOS

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 48 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

76.9 MHz

40 s

260 °C (500 °F)

14 mm

Yes

48

M5-192/68-15VC/1

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

192

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

55.6 MHz

30 s

240 °C (464 °F)

14 mm

Yes

68

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.