Square Programmable Logic Devices (PLD) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM5032LC-20

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

24

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

320

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

16

220 °C (428 °F)

16

EPM570GT100I5N

Intel

Flash PLD

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

76

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

It can also operate at 3.3 V

e3

76

14 mm

Yes

76

EPM7032SLC44-10

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

e0

125 MHz

30 s

220 °C (428 °F)

16.5862 mm

Yes

36

EPM7064AETC100-10N

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

100 MHz

14 mm

Yes

68

EPM7128AETC100-7N

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

129.9 MHz

30 s

260 °C (500 °F)

14 mm

Yes

84

EPM7128SQC160-10N

Intel

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

28 mm

Yes

100

EPM7160ELC84-20

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

160

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

2

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

83.3 MHz

29.3116 mm

No

64

EPM7160SQC160-10N

Intel

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

160

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 104 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

28 mm

Yes

104

EPM7192SQI160-10

Intel

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

192

CMOS

124

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 124 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

192 Macrocells; 12 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

125 MHz

124

28 mm

Yes

124

EPM7512AEQI208-10

Intel

EE PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

176

PAL-TYPE

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 176 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

87 MHz

176

28 mm

Yes

176

EPM7512AEQI208-10N

Intel

EE PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 176 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

512 Macrocells

e3

87 MHz

28 mm

Yes

176

EPXA1F484C2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 186 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220 °C (428 °F)

23 mm

186

GAL16V8D-25QJI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e0

37 MHz

30 s

8

225 °C (437 °F)

8.9662 mm

8

GAL20V8C-10LJI

Lattice Semiconductor

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e0

58.8 MHz

30 s

8

225 °C (437 °F)

11.5062 mm

8

GAL20V8C-10LJN

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e3

58.8 MHz

40 s

8

245 °C (473 °F)

11.5062 mm

8

GAL20V8C-10LJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e3

58.8 MHz

40 s

8

245 °C (473 °F)

11.5062 mm

8

LC4032ZC-35MN56C

Lattice Semiconductor

EE PLD

Ball

56

LFBGA

Square

Plastic/Epoxy

3.5 ns

Yes

1.9 V

32

36

PAD-TYPE

1.8

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

e1

212 MHz

40 s

32

260 °C (500 °F)

6 mm

Yes

32

LC4064V-10T48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e0

86 MHz

30 s

32

240 °C (464 °F)

7 mm

Yes

32

LC4064V-75T48C

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e0

111 MHz

30 s

32

240 °C (464 °F)

7 mm

Yes

32

LC4064V-75T48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e0

111 MHz

30 s

32

240 °C (464 °F)

7 mm

Yes

32

LC4064ZC-75TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

74

PAD-TYPE

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256C-5TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.95 V

256

74

PAD-TYPE

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.65 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

156 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256V-10TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

86 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256V-5T144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

256

110

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

14 Dedicated Inputs, 96 I/O

14

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

156 MHz

30 s

96

256 °C (492.8 °F)

20 mm

Yes

96

LC4256V-75T144I

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

110

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

14 Dedicated Inputs, 96 I/O

14

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

111 MHz

30 s

96

256 °C (492.8 °F)

20 mm

Yes

96

LC4256ZE-7MN144C

Lattice Semiconductor

EE PLD

Ball

144

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

CMOS

1.8

1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,12X12,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 108 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.1 mm

7 mm

No

e1

111 MHz

40 s

260 °C (500 °F)

7 mm

Yes

108

LCMXO2280C-5TN144C4W

Lattice Semiconductor

Flash PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3.6 ns

2280

Yes

3.465 V

CMOS

113

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

7 Dedicated Inputs, 113 I/O

7

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 2.5 V and 3.3 V

e3

388 MHz

40 s

113

260 °C (500 °F)

20 mm

113

M4A3-128/64-10VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

62.5 MHz

40 s

260 °C (500 °F)

14 mm

Yes

64

M4A3-64/32-12VNI48

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

64

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

52.6 MHz

40 s

260 °C (500 °F)

7 mm

Yes

32

M4A5-256/128-10YNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

256

CMOS

5

5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

14 Dedicated Inputs, 128 I/O

14

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

62.5 MHz

40 s

245 °C (473 °F)

28 mm

Yes

128

M4A5-32/32-10JC

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

62.5 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

32

M4A5-32/32-10JNC

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

62.5 MHz

40 s

245 °C (473 °F)

16.5862 mm

Yes

32

M4A5-32/32-10VNI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

32

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

62.5 MHz

40 s

32

260 °C (500 °F)

10 mm

Yes

32

TIBPAL16L8-25CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

4.75 V

64

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQCC-J20

3

4.57 mm

8.965 mm

No

e4

30 MHz

30 s

8

245 °C (473 °F)

8.965 mm

6

XA2C64A-7VQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

AEC-Q100

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 64 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

14 mm

Yes

64

XC2C128-6TQG144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

128

CMOS

100

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

152 MHz

30 s

100

260 °C (500 °F)

20 mm

Yes

100

XC2C256-6FTG256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

184

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 184 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e1

139 MHz

30 s

184

260 °C (500 °F)

17 mm

Yes

184

XC2C256-6VQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

139 MHz

30 s

80

260 °C (500 °F)

14 mm

Yes

80

XC2C256-7PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Real Digital Design Technology

e3

108 MHz

30 s

173

245 °C (473 °F)

28 mm

Yes

173

XC95144XL-10CS144I

Xilinx

Flash PLD

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95144XL-7CSG144I

Xilinx

Flash PLD

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

138.88 MHz

30 s

117

260 °C (500 °F)

12 mm

Yes

117

XC95288XL-7PQG208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 168 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

125 MHz

30 s

168

245 °C (473 °F)

28 mm

Yes

168

XC9536-7VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

83.3 MHz

30 s

260 °C (500 °F)

10 mm

Yes

34

XC9572-15PCG44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e3

55.6 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

34

XC9572XL-5VQ64C

Xilinx

Flash PLD

Commercial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

72

CMOS

36

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 52 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

72 Macrocells

e4

178.6 MHz

36

10 mm

Yes

52

XCR3064XL-10PC44C

Xilinx

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.7 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

95 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

36

XCR3064XL-10VQ100C

Xilinx

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e4

95 MHz

14 mm

Yes

68

XCR3064XL-10VQ44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e4

95 MHz

10 mm

Yes

36

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.