Square Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL22V10D-10QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	83.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
ISPLSI1016E-100LTN44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	64	CMOS		35	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	77 MHz		32	260 °C (500 °F)	10 mm	No	32
ISPLSI1024-60LJI	Lattice Semiconductor	EE PLD	Industrial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	96	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
ISPLSI2032E-110LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.6 mm	10 mm	No	In-System Programmable	e0	77 MHz				10 mm	No	32
ISPLSI2032VE-180LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS				3.3	3.3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	118 MHz			260 °C (500 °F)	10 mm	No	32
ISPLSI2096A-100LTN128	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	128	LFQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	96	CMOS				5	5 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	4.75 V		.4 mm	70 °C (158 °F)	3 Dedicated Inputs, 96 I/O	3	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	77 MHz	40 s		260 °C (500 °F)	14 mm	No	96
LA4064V-75TN48E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	48	TFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	64	CMOS	AEC-Q100	32		3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP48,.35SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	168 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4064V-75T44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64			32	PAD-TYPE	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	111 MHz	30 s	30	240 °C (464 °F)	10 mm	Yes	30
LC4128V-10TN128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128			96	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	86 MHz	40 s	92	260 °C (500 °F)	14 mm	Yes	92
LCMXO640C-3TN144I4W	Lattice Semiconductor	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4.9 ns	640	Yes	3.465 V		CMOS		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 113 I/O	7		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 2.5 V and 3.3 V	e3	388 MHz	40 s	113	260 °C (500 °F)	20 mm		113
XC2C512-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	91 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95288XL-7FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XCR3512XL-10FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	97 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
5M160ZM100I5N	Intel	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS				1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	79
5M570ZM100C4N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	74
ATF750CL-15JC	Atmel	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	10	CMOS				5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e0	44 MHz			225 °C (437 °F)	11.5062 mm	No	10
CY37064P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS				5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e4	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY39200V388-125MGC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	388	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.7 V	3072	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA388,26X26,50	Programmable Logic Devices	Yes	Macrocell	2.3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 294 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B388		2.46 mm	35 mm	No	Also operates at 3.3 V nominal supply	e0					35 mm	Yes	294
CY7C342B-30RI	Cypress Semiconductor	UV PLD	Industrial	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	60 ns		No	5.5 V	128	CMOS				5	5 V	Grid Array, Window	PGA68,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				27.9527 mm	No	52
CY7C343-35HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	35 ns		Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz				16.51 mm	No	28
CY7C373I-66JC	Cypress Semiconductor	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	64	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 64 I/O	1	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	In-system re-programmable; 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz				29.3116 mm	No	64
EP1810GM883B	Altera	OT PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	50 ns		No		48	CMOS	38535Q/M;38534H;883B			5	5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P68				No		e0				220 °C (428 °F)		No
EP1K100FC484-3N	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		333		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	333 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1			333		23 mm		333
EP1K100FI484-2N	Intel	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		333		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	333 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	37.5 MHz		333		23 mm		333
EP1K10FC256-3	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		136		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	136 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136		17 mm		136
EP1K10QC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		120		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	120 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			120		28 mm		120
EP20K100EBC356-2X	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3N	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1			238		35 mm		246
EP20K100EQC240-2X	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS		175		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			175		32 mm		183
EP20K200EQI240-2X	Intel	Loadable PLD		Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS		160		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		4 Dedicated Inputs, 168 I/O	4		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm		168
EP900JC	Altera	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Glass-Sealed	60 ns		Yes	5.25 V		CMOS		36	PAL-TYPE	5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-GQCC-J44		4.57 mm	16.51 mm	No	24 Macrocells	e0	20 MHz		24	220 °C (428 °F)	16.51 mm		24
EPF10K100EQC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS		189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K100EQI208-2	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147		28 mm		147
EPF10K10ATI144-3	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS		102		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		102		20 mm		102
EPF10K20RC208-4N	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS		147		5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	67.11 MHz		147		28 mm		147
EPF10K40RC208-3	Intel	Loadable PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	2304	Yes	5.25 V		CMOS		147		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 147 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz		147		28 mm		147
EPF10K50RC240-3	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	5.25 V		CMOS		189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	2880 Logic Elements	e0	66.67 MHz		189		32 mm		189
EPF8452ALC84-3	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		336	Yes	5.25 V		CMOS		68		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	336 Logic Elements	e0	385 MHz		64		29.3116 mm		68
EPF8636AQC160-3N	Intel	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		504	Yes	5.25 V		CMOS		118		5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		.65 mm	70 °C (158 °F)	4 Dedicated Inputs, 118 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	385 MHz		118		28 mm		118
EPM1270F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM3064ATC100-4	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 66 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	222.2 MHz				14 mm	Yes	66
EPM3128ATC100-7	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	129.9 MHz				14 mm	Yes	80
EPM570GF256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		160		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
EPM570T100I4N	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		76		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
EPM7032LC44-15T	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz	20 s		220 °C (428 °F)	16.5862 mm	No	36
EPM7032STC44-7	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	166.7 MHz			220 °C (428 °F)	10 mm	Yes	36

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.