Square Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7064AETI44-7

Intel

EE PLD

Industrial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

36

PLA-TYPE

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

2048

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

135.1 MHz

36

10 mm

Yes

36

EPM7128SLI84-10N

Intel

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

128

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 68 I/O

0

-40 °C (-40 °F)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

125 MHz

29.3116 mm

Yes

68

EPM7256SRI208-10

Intel

EE PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

256

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

HQFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

125 MHz

28 mm

Yes

164

ISPLSI2064A-80LT100

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

57 MHz

30 s

240 °C (464 °F)

14 mm

No

64

LC4064V-10TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

86 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4128V-75TN100E

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

130 °C (266 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4256V-3FTN256BC

Lattice Semiconductor

EE PLD

Ball

256

LBGA

Square

Plastic/Epoxy

3 ns

Yes

3.6 V

256

164

PAD-TYPE

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

83

1 mm

90 °C (194 °F)

4 Dedicated Inputs, 160 I/O

4

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

212 MHz

40 s

160

260 °C (500 °F)

17 mm

Yes

160

LC4256V-5FTN256AC

Lattice Semiconductor

EE PLD

Ball

256

LBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

256

132

PAD-TYPE

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

83

1 mm

90 °C (194 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

156 MHz

40 s

128

260 °C (500 °F)

17 mm

Yes

128

LCMXO2280C-3TN100I4W

Lattice Semiconductor

Flash PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5.1 ns

2280

Yes

3.465 V

CMOS

73

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

7 Dedicated Inputs, 73 I/O

7

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

It can also operate at 2.5 V and 3.3 V

e3

388 MHz

40 s

73

260 °C (500 °F)

14 mm

73

LCMXO640C-3TN100I4W

Lattice Semiconductor

Flash PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

4.9 ns

640

Yes

3.465 V

CMOS

74

1.8

1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

7 Dedicated Inputs, 74 I/O

7

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

It can also operate at 2.5 V and 3.3 V

e3

388 MHz

40 s

74

260 °C (500 °F)

14 mm

74

XC2C128-7CPG132C

Xilinx

Flash PLD

Commercial

Ball

132

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

100

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

119 MHz

30 s

100

260 °C (500 °F)

8 mm

Yes

100

XC9536XL-7CSG48I

Xilinx

Flash PLD

Industrial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e1

138.88 MHz

30 s

36

260 °C (500 °F)

7 mm

Yes

36

XCR3128XL-10TQG144C

Xilinx

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 108 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

95 MHz

30 s

260 °C (500 °F)

20 mm

Yes

108

XCR3256XL-12TQ144C

Xilinx

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 120 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

88 MHz

20 mm

Yes

120

EPF10K50RC240-3N

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.6 ns

2880

Yes

5.25 V

CMOS

189

5

3.3/5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

2880 Logic Elements

e3

66.67 MHz

189

32 mm

189

EPF6024ATC144-2N

Intel

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 117 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can Also Be Used 24000 Logic Gates

e3

153 MHz

20 mm

117

EPM3064ATC100-7N

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 66 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

135.1 MHz

14 mm

Yes

66

EPM570T100C4N

Intel

Flash PLD

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

76

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 76 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

It can also operate at 3.3 V

e3

76

14 mm

Yes

76

EPM7128SLC84-15N

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

100 MHz

29.3116 mm

Yes

68

LC4032V-5TN44C

Lattice Semiconductor

EE PLD

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

32

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

83

.8 mm

90 °C (194 °F)

2 Dedicated Inputs, 30 I/O

2

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

156 MHz

40 s

30

260 °C (500 °F)

10 mm

Yes

30

LC4032ZC-5TN48C

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

32

36

PAD-TYPE

1.8

1.8 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

156 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4064V-10TN44I

Lattice Semiconductor

EE PLD

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

32

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

83

.8 mm

105 °C (221 °F)

2 Dedicated Inputs, 30 I/O

2

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

86 MHz

40 s

30

260 °C (500 °F)

10 mm

Yes

30

LC4128ZE-7MN144C

Lattice Semiconductor

EE PLD

Ball

144

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

1.8

1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,12X12,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 96 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.1 mm

7 mm

No

e1

111 MHz

40 s

260 °C (500 °F)

7 mm

Yes

96

XCR3032XL-7VQG44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

32

CMOS

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

119 MHz

30 s

260 °C (500 °F)

10 mm

Yes

36

XCR3128XL-10VQ100C

Xilinx

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

95 MHz

30 s

240 °C (464 °F)

14 mm

Yes

84

5M1270ZT144C4

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

114 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e0

247.5 MHz

20 mm

114

5M240ZM100I5N

Intel

Flash PLD

Industrial

Ball

100

TFBGA

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

192

CMOS

79

1.8

1.8,1.2/3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

79 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.2 mm

6 mm

No

e1

118.3 MHz

79

6 mm

Yes

79

ATF22V10CQZ-20JC

Microchip Technology

Flash PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.572 mm

11.506 mm

38.5 MHz

11.506 mm

10

ATF22V10CQZ-20JI

Microchip Technology

Flash PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.572 mm

11.506 mm

38.5 MHz

11.506 mm

10

EPF10K50ETI144-2

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

102

20 mm

102

EPF10K50ETI144-2N

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

102

EPF10K50VRC240-3N

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

3.6 V

CMOS

189

3.3

3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

189

32 mm

189

LC4032ZC-5TN48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

32

36

PAD-TYPE

1.8

1.8 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

156 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4128ZC-75TN100E

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

74

PAD-TYPE

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

130 °C (266 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

LC4128ZE-7TN144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 96 I/O

4

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

111 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

LC4256ZC-75TN100C

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

74

PAD-TYPE

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

83

.5 mm

90 °C (194 °F)

10 Dedicated Inputs, 64 I/O

10

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

PML2552-35KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

50 MHz

24.065 mm

24

XC2C128-7VQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e4

119 MHz

80

14 mm

Yes

80

XC2C64A-7PCG44I

Xilinx

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 33 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e3

200 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

33

XC95288XL-10FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-6FG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

208.3 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XC9572XL-5TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

72

CMOS

72

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

72 Macrocells

e4

178.6 MHz

72

14 mm

Yes

72

XC9572XL-5TQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

72

CMOS

72

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

72 Macrocells

e3

178.6 MHz

30 s

72

260 °C (500 °F)

14 mm

Yes

72

XCR3128XL-7TQG144I

Xilinx

EE PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

3/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 108 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

119 MHz

30 s

260 °C (500 °F)

20 mm

Yes

108

5M1270ZF256A5N

Intel

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic

10 ns

Yes

1.89 V

980

CMOS

AEC-Q100

1.8,1.2/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1.71 V

1 mm

105 °C (221 °F)

0 Dedicated Inputs, 211 I/O

-40 °C (-40 °F)

Bottom

S-PBGA-B256

17 mm

No

17 mm

Yes

ATF1502ASV-15AC44

Atmel

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

32

CMOS

3.3

3 V

Flatpack, Thin Profile

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

100 MHz

10 mm

Yes

32

ATF1502ASV-15AI44

Atmel

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

32

CMOS

3.3

3 V

Flatpack, Thin Profile

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

100 MHz

10 mm

Yes

32

EP1K50QC208-3

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

28 mm

147

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.