Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic |
17.7 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8,1.2/3.3 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
1.71 V |
.5 mm |
105 °C (221 °F) |
0 Dedicated Inputs, 79 I/O |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
14 mm |
No |
14 mm |
Yes |
||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
142 MHz |
10 |
11.5062 mm |
10 |
|||||||||
Intel |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
201.1 MHz |
20 mm |
114 |
|||||||||||||||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
103.1 MHz |
10 mm |
Yes |
34 |
|||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
32 |
5 |
Tray |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Yes |
Macrocell |
4.75 V |
40 |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
166.7 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
98 MHz |
14 mm |
Yes |
80 |
||||||||||||
|
Microchip Technology |
EE PLD |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
32 |
36 |
PAL-TYPE |
5 |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
30.3 MHz |
40 s |
32 |
245 °C (473 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
32 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.8 mm |
130 °C (266 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
111 MHz |
40 s |
30 |
260 °C (500 °F) |
10 mm |
Yes |
30 |
|||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
72 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
72 Macrocells |
e4 |
100 MHz |
34 |
10 mm |
Yes |
34 |
||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||||
|
Intel |
Flash PLD |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
211 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
e1 |
201.1 MHz |
17 mm |
Yes |
211 |
|||||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
84 |
||||||||
|
Intel |
Flash PLD |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
2.625 V |
440 |
CMOS |
160 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
160 |
17 mm |
Yes |
160 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
144 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
138.88 MHz |
117 |
20 mm |
Yes |
117 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
48 |
FBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
36 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Fine Pitch |
BGA48,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
No |
e1 |
138.88 MHz |
30 s |
36 |
260 °C (500 °F) |
7 mm |
Yes |
36 |
|||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8.1 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
114 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
247.5 MHz |
20 mm |
Yes |
114 |
|||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
3.3 |
Tube |
3.3/5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
3 V |
64 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
e3 |
71 MHz |
8 |
8.966 mm |
8 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
64 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
52.6 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
95.2 MHz |
14 mm |
Yes |
84 |
|||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e4 |
333 MHz |
10 mm |
Yes |
33 |
||||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 172 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
Yes |
172 |
||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
38535Q/M;38534H;883B |
12 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
No |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
No |
e0 |
25 MHz |
8 |
8.89 mm |
No |
4 |
||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
119 MHz |
30 s |
100 |
260 °C (500 °F) |
20 mm |
Yes |
100 |
||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e4 |
200 MHz |
10 mm |
Yes |
33 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e3 |
76.9 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
103.1 MHz |
16.5862 mm |
Yes |
34 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2.5 ns |
Yes |
3.6 V |
32 |
36 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
90 °C (194 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
250 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
1.8 |
1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
14 Dedicated Inputs, 96 I/O |
14 |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
111 MHz |
40 s |
260 °C (500 °F) |
20 mm |
Yes |
96 |
||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
3.3 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
83.3 MHz |
40 s |
260 °C (500 °F) |
14 mm |
64 |
|||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
36 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
e3 |
138.88 MHz |
30 s |
36 |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
3.3 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
100 MHz |
10 mm |
32 |
|||||||||||||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
5 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
e3 |
166.7 MHz |
10 mm |
32 |
|||||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
Tube |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
No |
e3 |
100 MHz |
40 s |
245 °C (473 °F) |
16.586 mm |
Yes |
32 |
||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
192.3 MHz |
14 mm |
Yes |
80 |
|||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
144 |
CMOS |
81 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 81 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V |
e4 |
81.3 MHz |
81 |
14 mm |
Yes |
81 |
||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
32 |
5 |
Tube |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
No |
e3 |
76.9 MHz |
40 s |
245 °C (473 °F) |
16.586 mm |
32 |
||||||||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
14 mm |
Yes |
84 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Ball |
64 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA64,8X8,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
4 Dedicated Inputs, 32 I/O |
4 |
Tin Silver Copper |
Bottom |
S-PBGA-B64 |
3 |
1.1 mm |
5 mm |
No |
e1 |
111 MHz |
40 s |
260 °C (500 °F) |
5 mm |
Yes |
32 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
74 |
PAD-TYPE |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
83 |
.5 mm |
105 °C (221 °F) |
10 Dedicated Inputs, 64 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
111 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
|||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
64 |
HTFQFP |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
128 |
CMOS |
1.8 |
1.2/3.3,1.8 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP64,.35SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
54 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
1.2 mm |
7 mm |
No |
e3 |
184.1 MHz |
7 mm |
Yes |
54 |
|||||||||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
114 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
184.1 MHz |
20 mm |
Yes |
114 |
|||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
e3 |
68 MHz |
8 |
8.966 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e3 |
37 MHz |
40 s |
8 |
250 °C (482 °F) |
8.9662 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
4 Dedicated Inputs, 32 I/O |
4 |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
No |
e3 |
111 MHz |
40 s |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e3 |
166.7 MHz |
29.3115 mm |
Yes |
64 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
16 Dedicated Inputs, 96 I/O |
16 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
20 mm |
Yes |
96 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.9 V |
512 |
CMOS |
173 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 173 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
91 MHz |
30 s |
173 |
245 °C (473 °F) |
28 mm |
Yes |
173 |
||||||
Xilinx |
Flash PLD |
Industrial |
Ball |
56 |
LFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA56,10X10,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 45 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
No |
Real Digital Design Technology |
e0 |
200 MHz |
30 s |
240 °C (464 °F) |
6 mm |
Yes |
45 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.