OT PLD Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
PLS105AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V		TTL				5		In-Line				Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz				36.51 mm		0
82S105/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V		TTL				5		Chip Carrier				Registered	4.5 V			125 °C (257 °F)	15 Dedicated Inputs, 0 I/O	15	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			10.5 MHz						0
PLC18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e4	21 MHz		8		6.5 mm		8
PLUS405/BXA	NXP Semiconductors	OT PLD		Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No			Bipolar						In-Line									16 Dedicated Inputs	16			Dual	R-CDIP-T28				No			30 MHz
PLUS16L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No							26.695 mm		6
PLUS20R6DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		TTL				5		Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Power-Up Reset		60.6 MHz				11.505 mm		2
5962-8850402LX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No									10
PLQ20R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V		BICMOS				5		In-Line				Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz						4
P3Q22V10-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V		BICMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm		11 Dedicated Inputs, 10 I/O	11			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload		105 MHz				15.4 mm		10
PLC18V8ZZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		18 MHz		8		12.8 mm		8
PLQ20R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V		BICMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz						0
5962-9176008M3A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	7.5 ns	Yes	5.25 V		BICMOS	MIL-STD-883 Class B			5		Chip Carrier				Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28				No		e0	71 MHz						10
5962-9201201MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No			10.5 MHz						0
PLQ16R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V		BICMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz						0
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz				6.5 mm		8
PML2852-50A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V		CMOS				5		Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No	52 Flip Flops						29.3116 mm		24
5962-8850701LA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	20 MHz						12
PLD20G10C-15PC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	90	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O		0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T24				No		e0	60 MHz		10
5962-9233807M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz				8.89 mm		2
5962-9233804M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz				8.89 mm		4
5962-9233802M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz				8.89 mm		0
5962-9233805M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No							8.89 mm		6
M38510/50802BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		25 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	30 MHz						10
5962-9233804M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz				8.89 mm		4
5962-9233801M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0					8.89 mm		6
5962-9233806M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz				8.89 mm		0
5962-9233808M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz				8.89 mm		4
5962-88713082X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No			22 MHz				8.89 mm		4
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	25 MHz						10
5962-9233803M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz				8.89 mm		2
5962-9233805M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0					8.89 mm		6
5962-9233808M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm		4
5962-9233801M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No							8.89 mm		6
5962-9233803M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz				8.89 mm		2
5962-88713082A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0	22 MHz				8.89 mm		4
5962-9233806M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm		0
5962-9233802M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz				8.89 mm		0
5962-9233807M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V		BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm		2
PLD20G10C-15DC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No			BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	60 MHz		10
XC7336-15PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XC7336Q-12VQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	19 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		240 °C (464 °F)	10 mm	No	32
XC7336Q-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7336-5PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes		36	CMOS					3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		No
XC73108-12PQ160I	Xilinx	OT PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	30 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XC7236-30PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	48 ns	Yes	5.5 V	36	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks	e0	25 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XC73108-7PQ160C	Xilinx	OT PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	18 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XC7372-10PG84C	Xilinx	OT PLD	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	23 ns	No	5.25 V	72	CMOS				5	3.3/5,5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		71.4 MHz				27.94 mm	No	37
XC7336-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.