OT PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PML2852-35A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No	52 Flip Flops				29.3116 mm	24
PML2852-35KA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-CQCC-J84	4.83 mm	29.145 mm	No	52 Flip Flops				29.145 mm	24
PLC18V8ZIA	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8	8.965 mm	8
5962-9201201MLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24			No		e0	10.5 MHz			0
PLUS20L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No					31.7 mm	6
PML2852-50KA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-CQCC-J84	4.83 mm	29.145 mm	No	52 Flip Flops				29.145 mm	24
ABT22V10-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	BICMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock		83 MHz		11.5062 mm	10
P3Q16V8-7D	NXP Semiconductors	OT PLD		Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		8 Dedicated Inputs, 9 I/O	8			Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		12.8 mm	9
PML2552-50A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-PQCC-J68	4.57 mm	24.23 mm	No			35 MHz		24.23 mm	24
PLUS153-10N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Programmable Output Polarity					10
PLUS153-10A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Programmable Output Polarity				8.965 mm	10
PLUS16R8/BRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T20			No		e0	50 MHz	8
PLUS105-70N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	6.5 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		47.6 MHz		36.51 mm	0
LVT22V10-BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		50 MHz		31.7 mm	10
5962-8768201M2X	NXP Semiconductors	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.5 V	Bipolar	MIL-STD-883			5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20			No						10
PLUS105-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		36.51 mm	0
P3C18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	2.7 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		6.5 mm	8
PLUS405-55A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	4.75 V	64	1.27 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		38.5 MHz	8	11.5062 mm	0
PLC18V8Z25A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz		8.965 mm	8
PLS167AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		31.7 mm	0
82S101/B3A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Quad	S-CQCC-N28			No						0
P3C18V8Z40A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Programmable Output Polarity		22 MHz		8.9662 mm	8
5962-86709013A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	35 ns	Yes	5.5 V	Bipolar	MIL-STD-883			5		Chip Carrier			Registered	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28			No		e0				0
PLUS16R6-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	2
PLUS105-45A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		31.3 MHz		11.505 mm	0
LVT22V10-BD-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		50 MHz		15.4 mm	10
PLS153AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Programmable Output Polarity				26.695 mm	10
P3C18V8Z40N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	Programmable Output Polarity		22 MHz		26.73 mm	8
PLC18V8Z25DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz	8	6.5 mm	8
PML2552-35A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-PQCC-J68	4.57 mm	24.23 mm	No			50 MHz		24.23 mm	24
P3C18V8Z35A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	2.7 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		8.9662 mm	8
LVT22V10-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	11.5062 mm	10
P3C18V8Z40DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	Programmable Output Polarity		22 MHz		7.2 mm	8
5962-8768201MRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			No		e0				10
PLHS473/BLA	NXP Semiconductors	OT PLD		Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	20 ns	No		Bipolar						In-Line								11 Dedicated Inputs, 9 I/O	11			Dual	R-CDIP-T24			No						9
LVT22V10BDA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Programmable Output Polarity; Shared Input/Clock		74 MHz		11.5062 mm	10
P3C18V8Z35DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch			Macrocell	2.7 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		7.2 mm	8
P3C18V8ZIAD	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	Programmable Output Polarity		18 MHz		12.8 mm	8
5962-9176007MLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V	BICMOS	MIL-STD-883 Class B			5		In-Line			Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24			No		e0	55 MHz			10
PLUS20R4DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Power-Up Reset		60.6 MHz		11.505 mm	4
PLQ20L8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Combinatorial	4.75 V			75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24			No						6
P3C18V8ZIAA-T	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Programmable Output Polarity		18 MHz		8.9662 mm	8
PLUS105-45N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28	5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		31.3 MHz		35.505 mm	0
PLUS405-37N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices	Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		25 MHz	8	36.51 mm	8
P3Q22V10-7A	NXP Semiconductors	OT PLD		J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm		11 Dedicated Inputs, 10 I/O	11			Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload		105 MHz		11.505 mm	10
PLC18V8ZIADB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Shrink Pitch	SSOP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz	8	7.2 mm	8
PLC18V8Z35DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Shrink Pitch	SSOP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No			21 MHz	8	7.2 mm	8
5962-9176007M3A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B			5		Chip Carrier			Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28			No		e0	55 MHz			10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.