OT PLD Programmable Logic Devices (PLD) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5962-8515522SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883 Class S

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

74 MHz

8

4

TIBPAL20L8-7CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

74 MHz

8

31.64 mm

6

5962-8515518SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Flatpack

No

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

Yes

52.5 MHz

8

No

0

TIBPAL20R6-20MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

28.5 MHz

8

32.005 mm

2

PAL16L8AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

6

TIBPAL20X8-30CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

10 Dedicated Inputs, 2 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

22.2 MHz

2

TIBPAL20R4-15CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

18 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

37 MHz

8

4

TIFPLA839CFN

Texas Instruments

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

TTL

14

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

32

1.27 mm

70 °C (158 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

6

11.5062 mm

0

5962-87671183X

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Chip Carrier

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

50 MHz

4

PAL16R6A-2MFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

6

81036132A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

16 MHz

6

8.89 mm

2

M38510/50802B3X

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

25 ns

Yes

5.5 V

CMOS

MIL-M-38510 Class B

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

30 MHz

10

5962-85155152A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

48 MHz

6

8.89 mm

No

2

TIBPAL16R4-10CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQCC-J20

3

4.57 mm

8.9662 mm

No

Power-Up Reset; Register Preload

e4

55.5 MHz

30 s

8

245 °C (473 °F)

8.9662 mm

4

5962-8767106LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

81036082X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

MIL-STD-883 Class B

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

25 MHz

0

5962-85155132X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

6

PAL16R8AMFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

25 MHz

8

8.89 mm

0

JM38510/50602BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-M-38510 Class B

5

In-Line

Registered

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

41.6 MHz

0

TIBPAL20L10-30CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.25 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

40

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

10

8

TIBPAL16L8-10MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

52.5 MHz

8

24.195 mm

6

EP630-20CFN

Texas Instruments

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

22 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

160

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

16 Macrocells; 2 External Clocks; Asynchronous Clocks

35.7 MHz

16

11.5062 mm

16

TIBPAD16N8-7CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

16

PAD-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

16

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

81036142A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

Yes

e0

16 MHz

8

8.89 mm

No

4

SN74S330N

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

50

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

P3C18V8ZIDH

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

2.7 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

6.5 mm

8

PLC18V8ZIADB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

7.2 mm

8

PLUS405-45A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

TTL

16

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

4.75 V

64

1.27 mm

75 °C (167 °F)

15 Dedicated Inputs, 8 I/O

15

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

29.4 MHz

8

11.5062 mm

8

5962-9176012NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

5962-9176011NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

5962-9176008M3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

7.5 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

71 MHz

10

PLS155A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

55 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Logic Sequencer; 1 External Clock

14 MHz

8.965 mm

12

P3C18V8ZIN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

50 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

26.73 mm

8

PLS105AA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

11.505 mm

0

5962-9176008MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.5 V

BICMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

71 MHz

10

LVT22V10-DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

11.5062 mm

10

PLHS501A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

52

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

5.25 V

TTL

32

PLE-TYPE

5

5 V

Chip Carrier

LDCC52,.8SQ

Programmable Logic Devices

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

24 Dedicated Inputs, 8 I/O

24

0 °C (32 °F)

Quad

S-PQCC-J52

1

4.57 mm

19.1262 mm

No

30 MHz

24

19.1262 mm

8

PLS173N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

22

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

10

31.7 mm

10

P3C18V8Z40DH-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

Programmable Output Polarity

22 MHz

6.5 mm

8

PML2552-35KA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

50 MHz

24.065 mm

24

LVT22V10-DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

31.7 mm

10

PLUS20R4DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

4

82S105/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

10.5 MHz

0

PLQ20R8-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Registered

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

0

PLUS105-45N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

31.3 MHz

36.51 mm

0

PLUS20R8DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

0

PLS153A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

40 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Output Polarity

8.965 mm

10

PLHS18P8A/BRA

NXP Semiconductors

OT PLD

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

30 ns

No

In-Line

10 Dedicated Inputs, 8 I/O

10

Dual

R-CDIP-T20

No

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.