OT PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
TIBPAL16R4-12CJ	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.25 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Power-Up Reset		62 MHz		8		24.195 mm		4
TIBPAL16R6-5CN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7 ns	No	5.25 V	TTL		10	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		5.08 mm	7.62 mm	No	Power-Up Reset; Register Preload		111 MHz		6		24.325 mm		2
TIBPAL16R4-15MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL		12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Power-Up Reset		50 MHz		8		24.195 mm		4
81036112A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.03 mm	8.89 mm	Yes		e0	16 MHz		8		8.89 mm	No	6
TIBPAL16L8-20MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V	TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No					8		8.89 mm		6
PAL20L8A-2MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					8
5962-85155022X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5			Chip Carrier			No	Registered	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20				Yes			41.6 MHz		8			No	0
PAL20L8AMFH	Texas Instruments	OT PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Quad	S-CQCC-J28		2.54 mm	11.43 mm	No					8		11.43 mm		6
PAL16R6AMFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			25 MHz		6		8.89 mm		2
TIBPALT19R6MJWB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No					8
TIBPALT19L8MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					8
TIB82S105BCN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices		Registered	4.75 V	48	2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer		30 MHz		8		36.32 mm		0
TIB82S105BMJD	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	25 ns	No	5.5 V	TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices		Registered	4.5 V	48	2.54 mm	125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No	Field-Programmable Logic Sequencer		25 MHz		8				0
JM38510/50501BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.75 V		2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	40 MHz				32.005 mm		6
PAL16R8AMFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.03 mm	8.89 mm	No		e0	25 MHz		8		8.89 mm	No	0
TIBPAL16R6-15MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL		10	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset		50 MHz		6		8.89 mm		2
TIBPALR19L8MJW	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Dual	R-GDIP-T24				No					8				6
TIBPAL20L8-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No		e4	25 MHz		8		31.64 mm		6
TIBPAL16R8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	TTL	MIL-STD-883	8	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Registered	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No	Power-Up Reset	e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		0
TIBPAL20R4-7CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		74 MHz		8		31.64 mm		4
PAL16R8AMWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V	TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20		2.54 mm	6.92 mm	No			25 MHz		8				0
5962-85155092A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			50 MHz		8		8.89 mm		6
TIBPAL20R4-5CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		111 MHz		8		31.64 mm		4
TIBPAL22V10AMFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL		22	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		22 MHz		10		11.43 mm		10
M38510/50404BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	Bipolar	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 8 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				Yes		e0	20 MHz		8			No	8
P3C18V8ZIDH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	50 ns	Yes	3.6 V	CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	2.7 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz				6.5 mm		8
PLC18V8ZIADB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5			Small Outline, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz				7.2 mm		8
PLUS405-45A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Registered	4.75 V	64	1.27 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		29.4 MHz		8		11.5062 mm		8
5962-9176012NXA	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5			In-Line				Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	55 MHz						10
5962-9176011NXA	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5			In-Line				Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	55 MHz						10
5962-9176008M3X	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	7.5 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B			5			Chip Carrier				Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28				No		e0	71 MHz						10
PLS155A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.25 V	TTL				5			Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock		14 MHz				8.965 mm		12
P3C18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	50 ns	No	3.6 V	CMOS				3.3			In-Line				Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz				26.73 mm		8
PLS105AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5			Chip Carrier				Registered	4.75 V		1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz				11.505 mm		0
5962-9176008MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	9 ns	No	5.5 V	BICMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			71 MHz						10
LVT22V10-DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3			Chip Carrier				Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz				11.5062 mm		10
PLHS501A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	52	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	5.25 V	TTL		32	PLE-TYPE	5		5 V	Chip Carrier	LDCC52,.8SQ	Programmable Logic Devices		Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	24 Dedicated Inputs, 8 I/O	24	0 °C (32 °F)		Quad	S-PQCC-J52	1	4.57 mm	19.1262 mm	No			30 MHz		24		19.1262 mm		8
PLS173N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL		22	PLA-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Output Polarity				10		31.7 mm		10
P3C18V8Z40DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		22 MHz				6.5 mm		8
PML2552-35KA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5			Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-CQCC-J68		4.83 mm	24.065 mm	No			50 MHz				24.065 mm		24
LVT22V10-DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	3.6 V	BICMOS				3.3			In-Line				Macrocell	3 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz				31.7 mm		10
PLUS20R4DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5			In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Power-Up Reset		60.6 MHz				31.7 mm		4
82S105/BYA	NXP Semiconductors	OT PLD	Military	Flat	28	DFP	Rectangular	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL				5			Flatpack				Registered	4.5 V			125 °C (257 °F)	15 Dedicated Inputs, 0 I/O	15	-55 °C (-67 °F)		Dual	R-CDFP-F28				No			10.5 MHz						0
PLQ20R8-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	BICMOS				5			Chip Carrier				Registered	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28				No	Register Preload; Power-Up Reset		118 MHz						0
PLUS105-45N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	TTL				5			In-Line				Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		31.3 MHz				36.51 mm		0
PLUS20R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5			In-Line				Registered	4.75 V		2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Power-Up Reset		60.6 MHz				31.7 mm		0
PLS153A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.25 V	TTL				5			Chip Carrier				Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Programmable Output Polarity						8.965 mm		10
PLHS18P8A/BRA	NXP Semiconductors	OT PLD		Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	30 ns	No									In-Line									10 Dedicated Inputs, 8 I/O	10			Dual	R-CDIP-T20				No									8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.