OT PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PHD16N8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

No

High Speed Decoder

6

5962-9176008MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

7.5 ns

No

5.25 V

BICMOS

MIL-STD-883 Class B

5

In-Line

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

71 MHz

10

PLC18V8ZZID-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

18 MHz

12.8 mm

8

PLS173A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Output Polarity

10

11.505 mm

10

PLUS16L8/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

Rectangular

Ceramic, Metal-Sealed Cofired

12 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

Security Fuse

6

PLUS16R8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Power-Up Reset

74 MHz

8.965 mm

0

5962-8768201M2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

10

S82S153F/883B

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

5.5 V

TTL

18

PLA-TYPE

5

In-Line

DIP20,.3

No

4.5 V

42

125 °C (257 °F)

0 Dedicated Inputs, 10 I/O

0

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

e0

10

No

10

PLC415-16N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.25 V

CMOS

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

15 Dedicated Inputs, 0 I/O

15

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

13.3 MHz

36.51 mm

0

PLS159AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Logic Sequencer; 1 External Clock

18 MHz

12

PLS167AA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

11.505 mm

0

PLQ20R4-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

4

PLUS16L8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8.965 mm

6

PLUS405/B3A

NXP Semiconductors

OT PLD

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Chip Carrier

16 Dedicated Inputs

16

Quad

S-CQCC-N28

No

30 MHz

PLUS105-70N3

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6.5 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.33 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

35.505 mm

0

M38510/50201BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

PML2852-35KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PLC18V8ZIAN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

ABT22V10B/BLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.5 V

BICMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

71 MHz

10

PML2552-50KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

35 MHz

24.065 mm

24

P3Q20V8-7A

NXP Semiconductors

OT PLD

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

12 Dedicated Inputs, 9 I/O

12

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

11.505 mm

9

ABT22V10A5A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

167 MHz

11.5062 mm

10

5962-8670901YX

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDFP-F28

No

0

PLC18V8Z35A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8.965 mm

8

PLS101A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

5.25 V

TTL

16

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Open Collector Output

8

11.505 mm

0

82S100/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

5962-9176013NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

PLUS20R8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

0

PLS101N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

50 ns

No

5.25 V

TTL

16

PLA-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Combinatorial

4.75 V

48

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

No

Open Collector Output

8

0

P3C18V8ZIA

NXP Semiconductors

OT PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

2.7 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

8.9662 mm

8

5962-9176013NXX

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

PLC18V8ZIAD-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

12.8 mm

8

N82S153AFB

NXP Semiconductors

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

TTL

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

42

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T20

e0

10

PLQ16R4-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

No

Register Preload; Power-Up Reset

118 MHz

4

PLC18V8ZIAD

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline

SOP20,.4

Programmable Logic Devices

Macrocell

4.5 V

74

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

12.8 mm

8

PLUS153DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

TTL

18

PLA-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Output Polarity

10

8.965 mm

10

N82S103N

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PAD-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

9

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

9

PLQ22V10-7F

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

87 MHz

10

PLS168AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

31.7 mm

0

LVT22V10-BD

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

15.4 mm

10

LVT22V10-BA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

11.5062 mm

10

LVT22V10BDA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Output Polarity; Shared Input/Clock

74 MHz

11.5062 mm

10

PML2552-35A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.23 mm

No

50 MHz

24.23 mm

24

P3C18V8ZIDB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

2.7 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

7.2 mm

8

P3C18V8Z40D-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

Programmable Output Polarity

22 MHz

12.8 mm

8

PLUS405/BYA

NXP Semiconductors

OT PLD

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Flatpack

16 Dedicated Inputs

16

Dual

R-CDFP-F28

No

30 MHz

PLC18V8Z25D-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

12.8 mm

8

P3C18V8Z40DH

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

Programmable Output Polarity

22 MHz

6.5 mm

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.