OT PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
LVT20V8-7A	NXP Semiconductors	OT PLD		J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm		12 Dedicated Inputs, 8 I/O	12			Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		110 MHz		11.505 mm	8
PLS105A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		9.8 MHz		11.505 mm	0
PML2552-50A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.23 mm	No			35 MHz		24.23 mm	24
ABT22V10A5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS		22	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock		167 MHz	10	11.5062 mm	10
PLUS16R4-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	4
PML2852-50A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No	52 Flip Flops				29.3116 mm	24
PLQ20R6-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz			2
5962-8670901XA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				No		e0				0
PLUS16R8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	0
PLS168AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		11.505 mm	0
PLS179A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		18.2 MHz		11.505 mm	12
PLC18V8Z35DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No			21 MHz		7.2 mm	8
PLUS405-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		38.5 MHz		36.51 mm	0
5962-8768201RX	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-CDIP-T20				No						10
LVT20V8-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		12 Dedicated Inputs, 8 I/O	12			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		110 MHz		15.4 mm	8
82S101/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Quad	S-CQCC-N28				No						0
82S100/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Quad	S-CQCC-N28				No						0
PLUS16R4-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Power-Up Reset		74 MHz		8.965 mm	4
PLUS173DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	TTL		22	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Output Polarity			10	11.505 mm	10
PLC18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz	8	6.5 mm	8
PLC18V8Z25DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		7.2 mm	8
P3C18V8ZIADB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	Programmable Output Polarity		18 MHz		7.2 mm	8
PLC18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8	26.73 mm	8
N82S100I	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL		16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T28				No		e0		8
PLQ16R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz			4
10020EV8-4F	NXP Semiconductors	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns	No		ECL		20	PAL-TYPE		-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz	8	31.955 mm	8
PLC18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	26.73 mm	8
PLS100A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	50 ns	Yes	5.25 V	TTL		16	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	48	1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Tri-State Output			8	11.505 mm	0
PLUS16R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	0
P3C18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		26.73 mm	8
PLC18V8ZIDB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Shrink Pitch	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No			18 MHz	8	7.2 mm	8
LVT22V10-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	15.4 mm	10
LVT22V10-DA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		11.5062 mm	10
PLUS105-55N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		35.505 mm	0
PLQ20R6-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS				5		Chip Carrier			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28				No	Register Preload; Power-Up Reset		118 MHz			2
PML2852-50KA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-CQCC-J84		4.83 mm	29.145 mm	No	52 Flip Flops				29.145 mm	24
PLC18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		6.5 mm	8
PLC18V8Z35A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	8.965 mm	8
LVT16V8-7DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		7.2 mm	8
P3C18V8ZIAD-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	Programmable Output Polarity		18 MHz		12.8 mm	8
82S153A/B2A	NXP Semiconductors	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20				No						10
82S101/BYA-T	NXP Semiconductors	OT PLD	Military	Flat	28	DFP	Rectangular	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Flatpack			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDFP-F28				No						0
82S153A/BRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No						10
ABT22V10A/BLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	BICMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			55 MHz			10
PLS168A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		9.8 MHz		11.505 mm	0
PLS157A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock		14 MHz		8.965 mm	12
PLC18V8ZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		12.8 mm	8
5962-9176014NXX	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	71 MHz			10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.