Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.63 in (16 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
2.5 in (63.5 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.213 in (5.4 mm) |
2.5 in (63.5 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
2.5 in (63.5 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.213 in (5.4 mm) |
2.5 in (63.5 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
2.5 in (63.5 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.63 in (16 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
Beryllium Copper |
24 V |
Tape and Reel Packaging |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
218 |
24 V |
e4 |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.244 in (6.21 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.945 in (24 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
e4 |
|||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
218 |
24 V |
e4 |
|||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.444 in (11.29 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
TDA |
100 mΩ |
Copper Alloy |
24 V |
RoHS Compliant |
e4 |
|||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
6.1976 in (157.419 mm) |
Molded |
Gold over Nickel |
0.091 in (2.3114 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
218 |
24 V |
e4 |
|||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.213 in (5.4 mm) |
2.5 in (63.5 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
24 V |
Low Profile |
e4 |
||||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tape and Reel |
0.469 in (11.9 mm) |
7.37 in (187.198 mm) |
Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
4.52 in (114.808 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.244 in (6.2 mm) |
3.67 in (93.218 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.241 in (6.12 mm) |
5.6 in (142.24 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
0.146 in (3.71 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
25 mA |
Solder |
24 V |
e3 |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Gold |
25 mA |
Solder |
Beryllium Copper |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.