Surface Mount-Straight DIP & SIP Switches 488

Reset All
Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

TDA04H0SB1R

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.63 in (16 mm)

6.2 in (157.48 mm)

Tape Sealed

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold Flash - with Nickel barrier

25 mA

Solder

TDA

24 V

CHS-01TA

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

2.5 in (63.5 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-01TB

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.213 in (5.4 mm)

2.5 in (63.5 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-01TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-01TB1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.213 in (5.4 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-01TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

TDA02H0SB1R

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.63 in (16 mm)

6.2 in (157.48 mm)

Tape Sealed

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold Flash - with Nickel barrier

25 mA

Solder

TDA

24 V

218-4LPSTR

Cts

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

25 mA

Solder

Beryllium Copper

24 V

Tape and Reel Packaging

e4

218-4LPSTRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

25 mA

Solder

218

24 V

e4

A6S-1104-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.244 in (6.2 mm)

3.48 in (88.392 mm)

IP40

Gold

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

TDA04H0SB1

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tube

0.244 in (6.21 mm)

6.2 in (157.48 mm)

Tape Sealed

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold Flash - with Nickel barrier

25 mA

Solder

TDA

24 V

A6S-4101-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

IP40

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

218-4LPSTJRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-2MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

218-2LPSTRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-4MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

CHS-04TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

TDA08H0SB1R

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.945 in (24 mm)

6.2 in (157.48 mm)

Tape Sealed

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold - with Nickel barrier

25 mA

Solder

TDA

24 V

e4

219-4MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

218-4LPSTJR

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

218-2LPSTR

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

25 mA

Solder

24 V

e4

CHS-04TB

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

218-4LPSTJF

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

25 mA

Solder

218

24 V

e4

TDA08H0SB1

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tube

0.444 in (11.29 mm)

6.2 in (157.48 mm)

Tape Sealed

Gold over Nickel

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold - with Nickel barrier

25 mA

Solder

TDA

100 mΩ

Copper Alloy

24 V

RoHS Compliant

e4

TDA01H0SB1R

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

6.1976 in (157.419 mm)

Molded

Gold over Nickel

0.091 in (2.3114 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

218-4LPSTJ

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.246 in (6.25 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

25 mA

Solder

218

24 V

e4

219-2MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

CHS-01TB2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.213 in (5.4 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

218-2LPSTJRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

A6H-4101

Omron

Surface Mount-Straight

1000 Cycle(s)

Tube

0.248 in (6.31 mm)

4.5 in (114.3 mm)

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold - with Nickel barrier

25 mA

Solder

24 V

Low Profile

e4

90HBW04PRT

Grayhill

Surface Mount-Straight

2000 Cycle(s)

5 GΩ

Tape and Reel

0.469 in (11.9 mm)

7.37 in (187.198 mm)

Tape Sealed

Gold

0.165 in (4.19 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

100 mA

Solder

20 mΩ

Copper Alloy

6 V

Approval: UL

e3

CHS-04TB1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

218-2LPSTJR

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-4LPSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

CHS-02TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-02TA

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

SDA01H0SBR

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.295 in (7.49 mm)

4.52 in (114.808 mm)

Top Tape Sealed

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

218-2LPSTJ

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

TDA02H0SB1

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

Tube

0.244 in (6.2 mm)

3.67 in (93.218 mm)

Tape Sealed

0.091 in (2.3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold Flash - with Nickel barrier

25 mA

Solder

TDA

24 V

218-2LPSTJF

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.228 in (5.8 mm)

3.71 in (94.234 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

416131160804

Wurth Elektronik

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.241 in (6.12 mm)

5.6 in (142.24 mm)

Tape Sealed

Gold

0.079 in (2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

218-2LPST

Cts

Surface Mount-Straight

0.146 in (3.71 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Tin

25 mA

Solder

24 V

e3

A6H-4102-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

218-4LPST

Cts

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

0.346 in (8.79 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Gold

25 mA

Solder

Beryllium Copper

24 V

e4

A6H-4101-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.248 in (6.31 mm)

4.5 in (114.3 mm)

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

219-4LPSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.