Surface Mount-Straight DIP & SIP Switches 488

Reset All
Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

SD04H0SB

ITT Cannon

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Top Tape Sealed

Gold

0.16 in (4.06 mm)

0.1A@25VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Beryllium Copper

25 V

Approval: UL

e4

SD04H0SB1

C & K Components

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Top Tape Sealed

Gold

0.17 in (4.31 mm)

0.1A@25VDC

85 °C (185 °F)

-40 °C (-40 °F)

Bright Tin

100 mA

Solder

50 mΩ

Beryllium Copper

25 V

Approval: UL

e3

SD04H0SB1R

C & K Components

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, 13 in

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Top Tape Sealed

Gold

0.17 in (4.31 mm)

0.1A@25VDC

85 °C (185 °F)

-40 °C (-40 °F)

Bright Tin

100 mA

Solder

50 mΩ

Beryllium Copper

25 V

Approval: UL

e3

SD04H0SBD

C & K Components

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Gold

0.17 in (4.31 mm)

0.1A@25VDC

85 °C (185 °F)

-40 °C (-40 °F)

Bright Tin

100 mA

Solder

50 mΩ

Beryllium Copper

25 V

Approval: UL

e3

A6SN-1101

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.295 in (7.5 mm)

4.48 in (113.792 mm)

IP40; Waterproof

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

ADF04ST

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.478 in (12.14 mm)

7.5 in (190.5 mm)

Top Tape Sealed

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

SDA04H1SBD

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.476 in (12.1 mm)

7.49 in (190.246 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

MCDHN-06F-T-V

Spc Technology/ Multicomp

Surface Mount-Straight

1000 Cycle(s)

4.5 in (114.3 mm)

Top Tape Sealed

0.056 in (1.42 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

MCDHN

24 V

e4

DMR-04-T-V

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tube

0.537 in (13.64 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

e4

97C08ST

Grayhill

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.448 in (11.38 mm)

4.5 in (114.3 mm)

Top Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

e4

CHS-06A

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

CHS-08TB

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.461 in (11.7 mm)

5.4 in (137.16 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

IKD0203101

Apem Components

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tube

0.244 in (6.2 mm)

6.02 in (152.908 mm)

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

50 mΩ

24 V

Approval: UL

e4

SBS1002T

Knitter-switch

Surface Mount-Straight

Tape and Reel

0.244 in (6.2 mm)

6.02 in (152.908 mm)

Waterproof

0.118 in (3 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

6 V

e4

204-7

Cts

Surface Mount-Straight

10000 Cycle(s)

Anti-Static Tube

0.786 in (19.96 mm)

9.78 in (248.412 mm)

0.299 in (7.6 mm)

0.05A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

50 mA

Solder

204

24 V

e3

219-4ES

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4ESF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8MSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8MSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

418121270803

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.337 in (8.56 mm)

6.2 in (157.48 mm)

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

A6H-6101-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.348 in (8.85 mm)

4.5 in (114.3 mm)

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

A6S-8102-PH

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed

0.837 in (21.26 mm)

6.2 in (157.48 mm)

IP40; Waterproof; Top Tape Sealed

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

CHS-02B1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.213 in (5.4 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-08TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.461 in (11.7 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-08TB1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.461 in (11.7 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

DMR04TVTR

Apem Components

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

e4

DMR-04-T-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.537 in (13.64 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

e4

IKH0404000

Apem Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Tin

25 mA

Solder

IKH

100 mΩ

Phosphor Bronze

24 V

Very Low Profile

e3

MCNHDS-04T

Spc Technology/ Multicomp

Surface Mount-Straight

1000 Cycle(s)

0.448 in (11.39 mm)

4.5 in (114.3 mm)

Top Tape Sealed

0.056 in (1.42 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

MCNHDS

24 V

e4

204-124ST

Cts

Surface Mount-Straight

0.886 in (22.5 mm)

10.41 in (264.414 mm)

Bottom Sealed; Top Tape Sealed

0.359 in (9.12 mm)

0.1A@50VDC

85 °C (185 °F)

-40 °C (-40 °F)

Tin

100 mA

Solder

50 V

e3

204-124STR

Cts

Surface Mount-Straight

Tape and Reel

0.886 in (22.5 mm)

10.41 in (264.414 mm)

Bottom Sealed; Top Tape Sealed

0.359 in (9.12 mm)

0.1A@50VDC

85 °C (185 °F)

-40 °C (-40 °F)

Tin

100 mA

Solder

50 V

e3

204-211STR

Cts

Surface Mount-Straight

Tape and Reel

0.41 in (10.41 mm)

7.26 in (184.404 mm)

Bottom Sealed; Top Tape Sealed

0.359 in (9.12 mm)

0.1A@50VDC

85 °C (185 °F)

-40 °C (-40 °F)

Tin

100 mA

Solder

50 V

e3

219-8MSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8MSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

4-1571999-6

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

Tube

0.478 in (12.14 mm)

8.15 in (207.01 mm)

0.236 in (5.99 mm)

0.1A@0.5VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

500 mV

418121160803

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.337 in (8.56 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

418121160805

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.537 in (13.64 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

78HJ04GWT

Grayhill

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.882 in (22.4 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.268 in (6.81 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

100 mΩ

Copper Alloy

30 V

e3

A6S-1101-PH

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed

0.244 in (6.2 mm)

3.48 in (88.392 mm)

IP40

Gold

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

A6SR-2104

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.236 in (6 mm)

4.98 in (126.492 mm)

IP40

Gold

0.197 in (5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

Low Profile

e4

A6SR-4104

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.396 in (10.06 mm)

6 in (152.4 mm)

IP40

0.197 in (5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

Low Profile

e4

CHS-06A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

IKH0203000

Apem Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.177 in (4.5 mm)

3.77 in (95.758 mm)

Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Tin

25 mA

Solder

IKH

100 mΩ

Phosphor Bronze

24 V

Very Low Profile

e3

KHS82C

Otax

Surface Mount-Straight

Tape and Reel

Tape Sealed

Gold

Solder

KH

KHS82E

Otax

Surface Mount-Straight

Tape and Reel

Tape Sealed

Gold

Gold

Solder

e4

NHDS04T

Apem Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Top Tape Sealed

Gold over Nickel

0.056 in (1.42 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.