Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ITT Cannon |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Top Tape Sealed |
Gold |
0.16 in (4.06 mm) |
0.1A@25VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
25 V |
Approval: UL |
e4 |
|||||||||
|
C & K Components |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Top Tape Sealed |
Gold |
0.17 in (4.31 mm) |
0.1A@25VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bright Tin |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
25 V |
Approval: UL |
e3 |
|||||||||
|
C & K Components |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, 13 in |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Top Tape Sealed |
Gold |
0.17 in (4.31 mm) |
0.1A@25VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bright Tin |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
25 V |
Approval: UL |
e3 |
|||||||||
|
C & K Components |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Gold |
0.17 in (4.31 mm) |
0.1A@25VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bright Tin |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
25 V |
Approval: UL |
e3 |
||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.295 in (7.5 mm) |
4.48 in (113.792 mm) |
IP40; Waterproof |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.478 in (12.14 mm) |
7.5 in (190.5 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.476 in (12.1 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
Spc Technology/ Multicomp |
Surface Mount-Straight |
1000 Cycle(s) |
4.5 in (114.3 mm) |
Top Tape Sealed |
0.056 in (1.42 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
MCDHN |
24 V |
e4 |
||||||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
e4 |
|||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.448 in (11.38 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.362 in (9.2 mm) |
5.6 in (142.24 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
|||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.461 in (11.7 mm) |
5.4 in (137.16 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Apem Components |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
50 mΩ |
24 V |
Approval: UL |
e4 |
||||||||||||
|
Knitter-switch |
Surface Mount-Straight |
Tape and Reel |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Waterproof |
0.118 in (3 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
6 V |
e4 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
10000 Cycle(s) |
Anti-Static Tube |
0.786 in (19.96 mm) |
9.78 in (248.412 mm) |
0.299 in (7.6 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
50 mA |
Solder |
204 |
24 V |
e3 |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.348 in (8.85 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.213 in (5.4 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.461 in (11.7 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.461 in (11.7 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Apem Components |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
e4 |
|||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
e4 |
|||||||||
|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Tin |
25 mA |
Solder |
IKH |
100 mΩ |
Phosphor Bronze |
24 V |
Very Low Profile |
e3 |
||||||||
Spc Technology/ Multicomp |
Surface Mount-Straight |
1000 Cycle(s) |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
0.056 in (1.42 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
MCNHDS |
24 V |
e4 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
0.886 in (22.5 mm) |
10.41 in (264.414 mm) |
Bottom Sealed; Top Tape Sealed |
0.359 in (9.12 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
50 V |
e3 |
||||||||||||||||
|
Cts |
Surface Mount-Straight |
Tape and Reel |
0.886 in (22.5 mm) |
10.41 in (264.414 mm) |
Bottom Sealed; Top Tape Sealed |
0.359 in (9.12 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
50 V |
e3 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
Tape and Reel |
0.41 in (10.41 mm) |
7.26 in (184.404 mm) |
Bottom Sealed; Top Tape Sealed |
0.359 in (9.12 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
50 V |
e3 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.478 in (12.14 mm) |
8.15 in (207.01 mm) |
0.236 in (5.99 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
500 mV |
|||||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.268 in (6.81 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.236 in (6 mm) |
4.98 in (126.492 mm) |
IP40 |
Gold |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.396 in (10.06 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.362 in (9.2 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.177 in (4.5 mm) |
3.77 in (95.758 mm) |
Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Tin |
25 mA |
Solder |
IKH |
100 mΩ |
Phosphor Bronze |
24 V |
Very Low Profile |
e3 |
||||||||
Otax |
Surface Mount-Straight |
Tape and Reel |
Tape Sealed |
Gold |
Solder |
KH |
||||||||||||||||||||||||
|
Otax |
Surface Mount-Straight |
Tape and Reel |
Tape Sealed |
Gold |
Gold |
Solder |
e4 |
||||||||||||||||||||||
|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold over Nickel |
0.056 in (1.42 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.