Surface Mount-Straight DIP & SIP Switches 488

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

219-3MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

DHN-04F-T-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Top Tape Sealed

Gold

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

SDA04H0SBR

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.476 in (12.1 mm)

7.49 in (190.246 mm)

Top Tape Sealed

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

218-6LPSTJF

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.346 in (8.79 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

218-6LPSTJRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.346 in (8.79 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-2MSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

SDA03H1SBDR

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.378 in (9.6 mm)

7.49 in (190.246 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

219-2LPST-P

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

IKH0403000

Apem Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Tin

25 mA

Solder

IKH

100 mΩ

Phosphor Bronze

24 V

Very Low Profile

e3

SDA04H1SBDR

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.476 in (12.1 mm)

7.49 in (190.246 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

219-8LPSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

416131160801

Wurth Elektronik

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.22 in (5.6 mm)

2.31 in (58.674 mm)

Tape Sealed

Gold

0.079 in (2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

219-8LPSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-5MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

TDA02H0JB1

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.244 in (6.2 mm)

3.67 in (93.218 mm)

Tape Sealed

Gold over Nickel

0.087 in (2.2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

TDA02H0JB1R

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.244 in (6.2 mm)

3.67 in (93.218 mm)

Tape Sealed

Gold over Nickel

0.087 in (2.2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

24 V

219-2MSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4LPST-P

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Environmentally Sealed; Waterproof

Gold

0.158 in (4.02 mm)

85 °C (185 °F)

-55 °C (-67 °F)

Solder

50 mΩ

Beryllium Copper

Low Profile, Standard: UL

219-5MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

A6H-8102-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.448 in (11.39 mm)

4.5 in (114.3 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

DS04-254-2-02BK-SMT-TR

Cui

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.239 in (6.08 mm)

6.2 in (157.48 mm)

Gold

0.167 in (4.25 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

24 V

IKN0403000

TE Connectivity

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.437 in (11.1 mm)

7.3 in (185.42 mm)

Top Tape Sealed

Gold

0.1 in (2.55 mm)

0.1A@24VDC

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Nickel

100 mA

Solder

100 mΩ

Bronze

24 V

Low Profile

204-124LPST

Cts

Surface Mount-Straight

10000 Cycle(s)

1 GΩ

0.886 in (22.5044 mm)

9.779 in (248.387 mm)

Epoxy

Gold

0.359 in (9.1186 mm)

0.1A@50VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

100 mA

Solder

100 mΩ

Copper Alloy

50 V

RoHS Compliant

e4

218-8LPSTJF

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.446 in (11.33 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-2MSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8MST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold - with Nickel barrier

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e4

97C02SRT

Grayhill

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.177 in (4.5 mm)

3.76 in (95.504 mm)

Top Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

e4

A6S-4102-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

IP40; Waterproof; Top Tape Sealed

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

A6S-8102-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.837 in (21.26 mm)

6.2 in (157.48 mm)

IP40; Waterproof; Top Tape Sealed

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

DMR08TV/TR

Apem Components

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.837 in (21.26 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

e4

DMR-08-T-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

1.037 in (26.34 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold over Nickel

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

e4

TDD01H0SB1R

C & K Components

Surface Mount-Straight

100 MΩ

0.236 in (5.9944 mm)

2.3876 in (60.645 mm)

Gold over Nickel

0.091 in (2.3114 mm)

0.1A@50VDC

85 °C (185 °F)

-30 °C (-22 °F)

Gold over Nickel

100 mA

Solder

100 mΩ

Copper Alloy

50 V

e4

418121160806

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.637 in (16.18 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

A6H-2102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.177 in (4.5 mm)

3.77 in (95.758 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

A6H-2102-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.177 in (4.5 mm)

3.77 in (95.758 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

A6S-1102-PH

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed

0.244 in (6.2 mm)

3.48 in (88.392 mm)

IP40; Waterproof; Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

218-8LPSTJ

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.446 in (11.33 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

418121160808

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.837 in (21.26 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

6-1825059-2

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

1.077 in (27.36 mm)

7.5 in (190.5 mm)

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

A6S-8104-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.837 in (21.26 mm)

6.2 in (157.48 mm)

IP40

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

A6SN-8104

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.878 in (22.3 mm)

7.5 in (190.5 mm)

IP40; Waterproof

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

MCDHN-08F-T-V

Multicomp Pro

Surface Mount-Straight

1000 Cycle(s)

4.5 in (114.3 mm)

Top Tape Sealed

Gold

0.056 in (1.42 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

MCDHN

100 mΩ

Copper Alloy

24 V

e4

MCDM(R)-04-T

Spc Technology/ Multicomp

Surface Mount-Straight

2000 Cycle(s)

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Top Tape Sealed

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

DMR

24 V

Low Profile

204-4

Cts

Surface Mount-Straight

10000 Cycle(s)

Anti-Static Tube

0.486 in (12.34 mm)

9.78 in (248.412 mm)

0.299 in (7.6 mm)

0.05A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

50 mA

Solder

204

24 V

e3

219-8LPSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

ADF04STTR

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.478 in (12.14 mm)

7.5 in (190.5 mm)

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

ADF10ST

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

1.079 in (27.4 mm)

7.5 in (190.5 mm)

Top Tape Sealed

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.