Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
218 |
24 V |
e4 |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.37 in (9.4 mm) |
7.37 in (187.198 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
|||||||||
|
Grayhill |
Surface Mount-Straight |
Tube |
0.248 in (6.3 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
24 V |
Low Profile |
e4 |
||||||||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.177 in (4.5 mm) |
3.76 in (95.504 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.22 in (5.6 mm) |
3.58 in (90.932 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.29 in (7.37 mm) |
6.9 in (175.26 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.544 in (13.83 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Top Tape Sealed |
Gold |
0.128 in (3.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.378 in (9.6 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Gold |
0.124 in (3.15 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.396 in (10.06 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
Low Profile |
|||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
|||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.22 in (5.6 mm) |
4.85 in (123.19 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.321 in (8.15 mm) |
7 in (177.8 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant, Tape and Reel |
e4 |
||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.476 in (12.1 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant, Tape and Reel |
e4 |
||||||||||
|
Cui |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.139 in (3.54 mm) |
6.2 in (157.48 mm) |
Gold |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
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|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
24 V |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.