Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
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|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.678 in (17.22 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
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|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.878 in (22.3 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
100 mA |
Wire |
50 mΩ |
Copper Alloy |
16 |
24 V |
Approval: UL |
e4 |
0.157 in (3.988 mm) |
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|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.278 in (7.06 mm) |
7.06 in (179.324 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Wire |
50 mΩ |
Copper Alloy |
4 |
24 V |
Approval: UL |
0.157 in (3.988 mm) |
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TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
0.484 in (12.29 mm) |
10.16 in (258.064 mm) |
Tape Sealed |
Gold |
0.256 in (6.5 mm) |
0.1A@5VDC |
60 °C (140 °F) |
100 mA |
-10 °C (14 °F) |
100 mA |
Wire |
100 mΩ |
Copper Alloy |
16 |
50 V |
0.15 in (3.81 mm) |
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|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.144 in (3.66 mm) |
6.18 in (156.972 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
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|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Tube |
0.244 in (6.2 mm) |
6.18 in (156.972 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
Copper Alloy |
50 V |
|||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.344 in (8.74 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.21 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
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|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.444 in (11.28 mm) |
6.18 in (156.972 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
e4 |
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|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.244 in (6.2 mm) |
6.19 in (157.226 mm) |
Tape Sealed |
0.069 in (1.76 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
Low Profile |
e4 |
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TE Connectivity |
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|
Omron |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.937 in (23.8 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.554 in (14.0716 mm) |
9.906 in (251.612 mm) |
Gold |
0.23 in (5.842 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
0.126 in (3.2 mm) |
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|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
0.761 in (19.34 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
14 |
24 V |
e4 |
0.126 in (3.2 mm) |
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|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.382 in (9.7 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
6 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.596 in (15.14 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
1.037 in (26.34 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.236 in (6 mm) |
4.98 in (126.492 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
Omron |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
10.8 in (274.32 mm) |
Bottom Sealed |
0.402 in (10.2 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
20 |
24 V |
e4 |
0.126 in (3.2 mm) |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
1.037 in (26.34 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.98 in (24.9 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
18 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
1.079 in (27.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
20 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
12 |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.544 in (13.83 mm) |
6.2 in (157.48 mm) |
0.087 in (2.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
|||||||||||||||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.575 in (14.6 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.236 in (6 mm) |
3.67 in (93.218 mm) |
0.165 in (4.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.677 in (17.2 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed; Tube |
0.378 in (9.6 mm) |
7.5 in (190.5 mm) |
IP40; Waterproof |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.737 in (18.72 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
|||||||||||||||||||||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Tape Sealed |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
2 |
24 V |
With Seal Tape |
e4 |
||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.344 in (8.75 mm) |
6.2 in (157.48 mm) |
0.087 in (2.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.78 in (19.8 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
14 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
8 |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.996 in (25.3 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
1.061 in (26.96 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
20 |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.937 in (23.8 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.