DIP & SIP Switches

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

219-4ESJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4LPSF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4LPSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4MS

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5MST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-6MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.658 in (16.71 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-6MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.658 in (16.71 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-8LPST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8LPSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8LPSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8LPSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-9LPST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.958 in (24.33 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

2319764-4

TE Connectivity

Panel Mount

Tube

0.796 in (20.22 mm)

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

3-1571999-4

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.978 in (24.84 mm)

8.15 in (207.01 mm)

0.236 in (5.99 mm)

0.1A@0.5VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

500 mV

3-435668-3

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

1 GΩ

Tube

0.38 in (9.65 mm)

9.65 in (245.11 mm)

Tape Sealed

Gold over Nickel

0.29 in (7.36 mm)

0.015A@24VDC

105 °C (221 °F)

1 A

-55 °C (-67 °F)

1 A

Wire

100 mΩ

Copper Alloy

40 V

Low Profile

0.14 in (3.556 mm)

418121270806

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.637 in (16.18 mm)

6.2 in (157.48 mm)

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

435470-1

TE Connectivity

Through Hole-Straight

7000 Cycle(s)

100 GΩ

0.48 in (12.19 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.37 mm)

0.025A@24VDC

105 °C (221 °F)

-55 °C (-67 °F)

25 mA

Solder

435470

100 mΩ

Copper Alloy

8

24 V

Low Profile

0.14 in (3.556 mm)

435668-7

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

1 GΩ

0.88 in (22.35 mm)

9.65 in (245.11 mm)

Bottom Sealed

Gold over Nickel

0.29 in (7.36 mm)

0.015A@24VDC

105 °C (221 °F)

1 A

-55 °C (-67 °F)

1 A

Wire

100 mΩ

Copper Alloy

16

40 V

Low Profile

0.14 in (3.556 mm)

5-1571999-4

TE Connectivity

Panel Mount

1000 Cycle(s)

Box; Tube

0.778 in (19.76 mm)

8.15 in (207.01 mm)

Gold over Nickel

0.236 in (6 mm)

0.1A@0.5VDC

85 °C (185 °F)

1 A

-30 °C (-22 °F)

1 A

Wire

Copper Alloy

5 V

0.157 in (3.988 mm)

5-2319764-4

TE Connectivity

Panel Mount

Tape and Reel

0.796 in (20.22 mm)

Tape Sealed

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

5-435470-7

TE Connectivity

Through Hole-Right Angle

Tube

0.28 in (7.11 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.36 in (9.14 mm)

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Solder

Copper Alloy

50 V

Low Profile

0.14 in (3.556 mm)

6-1571999-4

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

Tube

1.078 in (27.38 mm)

8.15 in (207.01 mm)

0.236 in (5.99 mm)

0.1A@0.5VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

500 mV

76RSB02T

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.38 in (9.65 mm)

7.1 in (180.34 mm)

0.292 in (7.42 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

30 V

76SC02T

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.382 in (9.7 mm)

9.65 in (245.11 mm)

0.247 in (6.27 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

30 V

e3

0.156 in (3.962 mm)

76SC03ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.579 in (14.7 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.247 in (6.27 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

76

30 V

78HJ03GWRT

Grayhill

Surface Mount-Straight

2000 Cycle(s)

Tape and Reel

0.681 in (17.3 mm)

9.65 in (245.11 mm)

0.268 in (6.81 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

30 V

e3

78RB03ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.382 in (9.7 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.265 in (6.73 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

30 V

e3

90HBW06PT

Grayhill

Surface Mount-Straight

2000 Cycle(s)

5 GΩ

Tube

0.669 in (17 mm)

7.37 in (187.198 mm)

Moisture Proof; Top Tape Sealed

Gold

0.165 in (4.19 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

100 mA

Solder

20 mΩ

Copper Alloy

6 V

Approval: UL

e3

A6FR-3101

Omron

A6H-2102

Omron

Surface Mount-Straight

1000 Cycle(s)

Tube

0.177 in (4.5 mm)

3.77 in (95.758 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

A6S-3102-PH

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed

0.337 in (8.56 mm)

6.2 in (157.48 mm)

IP40; Waterproof; Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

A6SN-1104

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.295 in (7.5 mm)

4.48 in (113.792 mm)

IP40; Waterproof

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

ADF10STTR

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

1.079 in (27.4 mm)

7.5 in (190.5 mm)

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL

BD08

ITT Cannon

Through Hole-Straight

10000 Cycle(s)

1 GΩ

Tube

0.98 in (24.89 mm)

9.65 in (245.11 mm)

Epoxy Terminal Sealed

Silver over Nickel

0.265 in (6.73 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - with Nickel barrier

100 mA

Solder

BD

50 mΩ

Phosphor Bronze

16

5 V

e3

0.141 in (3.581 mm)

BD08AV

ITT Cannon

Through Hole-Right Angle

10000 Cycle(s)

1 GΩ

Tube

0.98 in (24.89 mm)

7.11 in (180.594 mm)

Epoxy Terminal Sealed

Silver over Nickel

0.38 in (9.65 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - with Nickel barrier

100 mA

Solder

BD

50 mΩ

Phosphor Bronze

16

5 V

e3

0.125 in (3.175 mm)

CHS-01A

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.22 in (5.6 mm)

2.5 in (63.5 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04A

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

DHN-08F-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.448 in (11.39 mm)

4.5 in (114.3 mm)

Gold

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

DM-04-V

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

DM-04-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

DM-08-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.837 in (21.26 mm)

6.2 in (157.48 mm)

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold - with Nickel barrier

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

e4

EDSP08SGLFNTR04

TE Connectivity

Panel Mount

Tape and Reel

0.796 in (20.22 mm)

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

EHS104LT

Excel Cell Electronic

Surface Mount-Straight

0.244 in (6.2 mm)

6.2 in (157.48 mm)

Tape Sealed

0.067 in (1.7 mm)

0.025A@24VDC

70 °C (158 °F)

-25 °C (-13 °F)

25 mA

Solder

EHS

24 V

IKN0404000

TE Connectivity

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, 14.2 in

0.437 in (11.1 mm)

7.3 in (185.42 mm)

Top Tape Sealed

Gold

0.1 in (2.55 mm)

0.1A@24VDC

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Nickel

100 mA

Solder

100 mΩ

Bronze

24 V

Low Profile

KA-J-04-T-G-G-R

E-switch

Surface Mount-Straight

2000 Cycle(s)

Tape and Reel

Tape Sealed

0.126 in (3.2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

24 V

Low Profile

e4

MCDA10

Multicomp Pro

Through Hole-Right Angle

2000 Cycle(s)

100 MΩ

Tube

0.041 in (1.054 mm)

0.389 in (9.881 mm)

Epoxy Terminal Sealed; Top Tape Sealed

Gold over Nickel

0.008 in (0.211 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

Phosphor Bronze

20

24 V

0.114 in (2.896 mm)

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.