Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.658 in (16.71 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.658 in (16.71 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.958 in (24.33 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.796 in (20.22 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.978 in (24.84 mm) |
8.15 in (207.01 mm) |
0.236 in (5.99 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
500 mV |
|||||||||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Tube |
0.38 in (9.65 mm) |
9.65 in (245.11 mm) |
Tape Sealed |
Gold over Nickel |
0.29 in (7.36 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
40 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
TE Connectivity |
Through Hole-Straight |
7000 Cycle(s) |
100 GΩ |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.37 mm) |
0.025A@24VDC |
105 °C (221 °F) |
-55 °C (-67 °F) |
25 mA |
Solder |
435470 |
100 mΩ |
Copper Alloy |
8 |
24 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
0.88 in (22.35 mm) |
9.65 in (245.11 mm) |
Bottom Sealed |
Gold over Nickel |
0.29 in (7.36 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
16 |
40 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Box; Tube |
0.778 in (19.76 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.28 in (7.11 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.36 in (9.14 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Solder |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||||||
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
1.078 in (27.38 mm) |
8.15 in (207.01 mm) |
0.236 in (5.99 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
500 mV |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
76 |
30 V |
|||||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
Tape and Reel |
0.681 in (17.3 mm) |
9.65 in (245.11 mm) |
0.268 in (6.81 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.669 in (17 mm) |
7.37 in (187.198 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
Omron |
|||||||||||||||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.177 in (4.5 mm) |
3.77 in (95.758 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.295 in (7.5 mm) |
4.48 in (113.792 mm) |
IP40; Waterproof |
0.138 in (3.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
||||||||||||||
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
1.079 in (27.4 mm) |
7.5 in (190.5 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||||
|
ITT Cannon |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tube |
0.98 in (24.89 mm) |
9.65 in (245.11 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.265 in (6.73 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
16 |
5 V |
e3 |
0.141 in (3.581 mm) |
|||||||
|
ITT Cannon |
Through Hole-Right Angle |
10000 Cycle(s) |
1 GΩ |
Tube |
0.98 in (24.89 mm) |
7.11 in (180.594 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.38 in (9.65 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
16 |
5 V |
e3 |
0.125 in (3.175 mm) |
|||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.22 in (5.6 mm) |
2.5 in (63.5 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
Gold |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
e4 |
||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
Excel Cell Electronic |
Surface Mount-Straight |
0.244 in (6.2 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.067 in (1.7 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-25 °C (-13 °F) |
25 mA |
Solder |
EHS |
24 V |
||||||||||||||||||
TE Connectivity |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, 14.2 in |
0.437 in (11.1 mm) |
7.3 in (185.42 mm) |
Top Tape Sealed |
Gold |
0.1 in (2.55 mm) |
0.1A@24VDC |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Nickel |
100 mA |
Solder |
100 mΩ |
Bronze |
24 V |
Low Profile |
|||||||||||
|
E-switch |
Surface Mount-Straight |
2000 Cycle(s) |
Tape and Reel |
Tape Sealed |
0.126 in (3.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
24 V |
Low Profile |
e4 |
|||||||||||||||
Multicomp Pro |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.041 in (1.054 mm) |
0.389 in (9.881 mm) |
Epoxy Terminal Sealed; Top Tape Sealed |
Gold over Nickel |
0.008 in (0.211 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
Phosphor Bronze |
20 |
24 V |
0.114 in (2.896 mm) |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.