Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
|||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.678 in (17.22 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
50 mΩ |
Copper Alloy |
5 V |
RoHS Compliant |
0.157 in (3.988 mm) |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
100 GΩ |
0.68 in (17.27 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
Tin/Lead |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
12 |
50 V |
Low Profile |
e0 |
0.14 in (3.556 mm) |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.22 in (5.6 mm) |
4.85 in (123.19 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Through Hole-Right Angle |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
0.301 in (7.65 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
0.156 in (3.962 mm) |
||||||||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.321 in (8.15 mm) |
7 in (177.8 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant, Tape and Reel |
e4 |
||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.476 in (12.1 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant, Tape and Reel |
e4 |
||||||||||
|
Cui |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.139 in (3.54 mm) |
6.2 in (157.48 mm) |
Gold |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
|||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
24 V |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.87 in (22.1 mm) |
7.37 in (187.198 mm) |
Top Tape Sealed |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
6 V |
e3 |
||||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
|||||||||||
|
Cts |
Through Hole-Right Angle |
0.986 in (25.04 mm) |
9.78 in (248.412 mm) |
Bottom Sealed; Top Tape Sealed |
0.3 in (7.62 mm) |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
Solder |
206 |
e4 |
||||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Tin |
0.34 in (8.64 mm) |
1 A |
1 A |
Wire |
Copper Alloy |
40 V |
0.14 in (3.556 mm) |
|||||||||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.396 in (10.06 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.196 in (4.98 mm) |
Gold over Nickel |
0.152 in (3.85 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.476 in (12.1 mm) |
7.49 in (190.246 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
|||||||||
|
Cts |
Through Hole-Right Angle |
10000 Cycle(s) |
0.886 in (22.5 mm) |
9.78 in (248.412 mm) |
Bottom Sealed; Top Tape Sealed |
0.3 in (7.62 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
206 |
24 V |
e4 |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.378 in (9.6 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
0.378 in (9.6 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
||||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Tin |
25 mA |
Solder |
IKH |
100 mΩ |
Phosphor Bronze |
24 V |
Very Low Profile |
e3 |
||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.476 in (12.1 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Cts |
Through Hole-Straight |
2000 Cycle(s) |
Anti-Static Tube |
0.886 in (22.5 mm) |
9.78 in (248.412 mm) |
0.299 in (7.6 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
50 mA |
Solder |
208 |
24 V |
e3 |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.22 in (5.6 mm) |
2.31 in (58.674 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.196 in (4.98 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
1 GΩ |
Tube |
1.077 in (27.36 mm) |
7.5 in (190.5 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.778 in (19.76 mm) |
7.5 in (190.5 mm) |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
0.878 in (22.3 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.34 in (8.64 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
16 |
40 V |
Sealed |
0.14 in (3.556 mm) |
|||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.681 in (17.3 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 kΩ |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
0.156 in (3.962 mm) |
|||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.396 in (10.06 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.378 in (9.6 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.