Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ITT Cannon |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tube |
0.78 in (19.81 mm) |
9.65 in (245.11 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.265 in (6.73 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
8 |
5 V |
e3 |
0.141 in (3.581 mm) |
|||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
Box; Tube |
0.244 in (6.21 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.2 mm) |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
Copper Alloy |
50 V |
||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.344 in (8.74 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.21 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
Low Profile |
||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.194 in (4.93 mm) |
4.93 in (125.222 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
4.52 in (114.808 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.394 in (10.01 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
e4 |
0.169 in (4.293 mm) |
|||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.244 in (6.2 mm) |
3.67 in (93.218 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
ITT Cannon |
Through Hole-Right Angle |
10000 Cycle(s) |
1 GΩ |
Tube |
0.48 in (12.19 mm) |
8.13 in (206.502 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.38 in (9.65 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
8 |
5 V |
e3 |
0.125 in (3.175 mm) |
|||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.478 in (12.14 mm) |
7.5 in (190.5 mm) |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.241 in (6.12 mm) |
5.6 in (142.24 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
0.146 in (3.71 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
25 mA |
Solder |
24 V |
e3 |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Gold |
25 mA |
Solder |
Beryllium Copper |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.378 in (9.6 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Waterproof |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
TE Connectivity |
Panel Mount |
Box; Tube |
0.444 in (11.29 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.2 mm) |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
Copper Alloy |
50 V |
||||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.63 in (16 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
TDA |
24 V |
e4 |
|||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Box |
0.4 in (10.16 mm) |
Tin |
0.335 in (8.5 mm) |
70 °C (158 °F) |
10 mA |
-25 °C (-13 °F) |
10 mA |
Wire |
Phosphor Bronze |
50 V |
0.126 in (3.2 mm) |
||||||||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
4.52 in (114.808 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box; Tube |
0.578 in (14.68 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
50 mΩ |
Copper Alloy |
10 |
5 V |
RoHS Compliant |
0.157 in (3.988 mm) |
|||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.228 in (5.8 mm) |
3.71 in (94.234 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.246 in (6.25 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.441 in (11.2 mm) |
5.6 in (142.24 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.469 in (11.9 mm) |
7.37 in (187.198 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.278 in (7.06 mm) |
7.06 in (179.324 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
1 GΩ |
Tube |
0.678 in (17.22 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.157 in (4 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
1 A |
Wire |
300 mΩ |
Copper Alloy |
6 |
5 V |
e4 |
0.157 in (3.988 mm) |
||||||||
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.394 in (10.01 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Tape and Reel |
0.878 in (22.3 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
Gold Flash |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
1 GΩ |
Box; Tube |
0.48 in (12.19 mm) |
7.366 in (187.096 mm) |
Tin |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
8 |
50 V |
Low Profie |
0.14 in (3.556 mm) |
|||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.248 in (6.3 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Tape and Reel |
0.578 in (14.68 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
Low Profile |
|||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.98 in (24.9 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
1.079 in (27.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.