DIP & SIP Switches

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NDS-04V

Diptronics Manufacturing

Through Hole-Straight

2000 Cycle(s)

100 MΩ

Tube

0.454 in (11.52 mm)

9.9 in (251.46 mm)

Gold over Nickel

0.23 in (5.85 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Phosphor Bronze

8

24 V

e4

0.126 in (3.2 mm)

NDS-04-V

Apem Components

Through Hole-Straight

2000 Cycle(s)

100 MΩ

Tube

0.454 in (11.52 mm)

9.9 in (251.46 mm)

Gold

0.23 in (5.85 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

50 mΩ

8

24 V

e4

0.12 in (3.048 mm)

NDS-08V

Diptronics Manufacturing

Through Hole-Straight

2000 Cycle(s)

Tube

0.854 in (21.68 mm)

9.9 in (251.46 mm)

0.23 in (5.85 mm)

0.025A@24VDC

Gold - with Nickel barrier

25 mA

Solder

24 V

e4

NDS-08-V

Apem Components

Through Hole-Straight

2000 Cycle(s)

Tube

0.854 in (21.68 mm)

9.9 in (251.46 mm)

0.23 in (5.85 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

24 V

e4

218-8LPSTRF

Cts

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.446 in (11.33 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

219-2LPSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-8MSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.858 in (21.79 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

76SB03ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.382 in (9.7 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.292 in (7.42 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

30 V

GDH04S04

TE Connectivity

Panel Mount

1000 Cycle(s)

100 MΩ

Tube

0.244 in (6.2 mm)

6.2 in (157.48 mm)

Tape Sealed

Gold over Nickel

0.091 in (2.31 mm)

0.025A@24VDC

85 °C (185 °F)

100 mA

-30 °C (-22 °F)

Gold - with Nickel barrier

100 mA

Solder

100 mΩ

Copper Alloy

50 V

e4

5161390-8

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

1 GΩ

Box

0.9 in (22.86 mm)

9.906 in (251.612 mm)

Tin

0.335 in (8.5 mm)

0.025A@50VDC

70 °C (158 °F)

10 mA

-25 °C (-13 °F)

10 mA

Wire

Phosphor Bronze

16

50 V

0.126 in (3.2 mm)

A6S-4101

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Gold

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

SDA03H1SBD

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.378 in (9.6 mm)

7.49 in (190.246 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

219-2LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-3LPSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-2LPST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-2LPSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4MST-P

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

418121270801

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.244 in (6.2 mm)

3.48 in (88.392 mm)

Gold

0.124 in (3.15 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

78B07ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

1 GΩ

Tube

0.78 in (19.8 mm)

9.65 in (245.11 mm)

Top Tape Sealed

Gold over Nickel

0.265 in (6.73 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

50 mΩ

Copper Alloy

14

30 V

RoHS Compliant, With Top Seal

e3

A6H-4101-R100

Omron

A6S-6101-H

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.637 in (16.18 mm)

6.2 in (157.48 mm)

IP40

0.118 in (3 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

e4

2-5435802-9

TE Connectivity

Through Hole-Right Angle

Tube

0.48 in (12.19 mm)

9.65 in (245.11 mm)

Tin

0.29 in (7.36 mm)

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

Copper Alloy

50 V

Low Profile

0.14 in (3.556 mm)

219-2LPSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

A6SR-4101

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.396 in (10.06 mm)

6 in (152.4 mm)

IP40

0.197 in (5 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

25 mA

Solder

200 mΩ

24 V

Low Profile

e4

EDS03SGRNTR04Q

TE Connectivity

Panel Mount

Tape and Reel

0.296 in (7.52 mm)

Gold over Nickel

0.134 in (3.4 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

1-5435802-9

TE Connectivity

Through Hole-Right Angle

Box; Tube

0.98 in (24.89 mm)

Tin

0.29 in (7.36 mm)

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

Copper Alloy

50 V

Low Profile

0.14 in (3.556 mm)

219-2MSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.264 in (6.7 mm)

6.55 in (166.37 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

3-5435640-6

TE Connectivity

Through Hole-Right Angle

Tube

0.58 in (14.73 mm)

9.65 in (245.11 mm)

Tin

0.34 in (8.64 mm)

1 A

Gold

1 A

Wire

Copper Alloy

40 V

e4

0.14 in (3.556 mm)

418121160804

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Top Tape Sealed

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

76PSB08T

Grayhill

Through Hole-Right Angle

2000 Cycle(s)

Tube

0.882 in (22.4 mm)

9.65 in (245.11 mm)

0.301 in (7.65 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

30 V

e3

219-3LPSTR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

1-1825002-7

TE Connectivity

Through Hole-Right Angle

1000 Cycle(s)

Tube

1.079 in (27.4 mm)

7.49 in (190.246 mm)

Gold over Nickel

0.157 in (4 mm)

0.1A@24VDC

85 °C (185 °F)

1 A

-30 °C (-22 °F)

1 A

Wire

Copper Alloy

5 V

0.157 in (3.988 mm)

218-6LPSTF

Cts

Surface Mount-Straight

1000 Cycle(s)

Anti-Static Tube

0.346 in (8.79 mm)

5.8 in (147.32 mm)

Bottom Sealed; Top Tape Sealed

0.104 in (2.65 mm)

0.025A@24VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold Flash

25 mA

Solder

218

24 V

3-5435668-5

TE Connectivity

Through Hole-Right Angle

Tube

0.58 in (14.73 mm)

9.65 in (245.11 mm)

Tape Sealed

Tin

0.29 in (7.36 mm)

1 A

Gold

1 A

Wire

Copper Alloy

40 V

Low Profile

e4

0.14 in (3.556 mm)

5161390-1

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

1 GΩ

Box

0.2 in (5.08 mm)

9.906 in (251.612 mm)

Tin

0.335 in (8.5 mm)

0.025A@50VDC

70 °C (158 °F)

10 mA

-25 °C (-13 °F)

10 mA

Wire

Phosphor Bronze

2

50 V

0.126 in (3.2 mm)

5435668-4

TE Connectivity

Through Hole-Right Angle

Tube

0.58 in (14.73 mm)

9.65 in (245.11 mm)

Tin

0.29 in (7.36 mm)

1 A

1 A

Wire

Copper Alloy

40 V

Low Profile

0.14 in (3.556 mm)

5435802-5

TE Connectivity

Through Hole-Right Angle

Tube

0.68 in (17.27 mm)

Tin

0.29 in (7.36 mm)

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

Copper Alloy

50 V

Low Profile

0.14 in (3.556 mm)

76RSB04ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.48 in (12.2 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.292 in (7.42 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

150 mA

Solder

30 V

e3

EDSP10SGRFSTR04

TE Connectivity

Panel Mount

Tape and Reel

0.996 in (25.3 mm)

Tape Sealed

Gold over Nickel

0.197 in (5 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

SDA02H1SBD

ITT Cannon

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.295 in (7.49 mm)

7.06 in (179.324 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold - with Nickel barrier

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

2-5435668-5

TE Connectivity

Through Hole-Right Angle

Tube

0.68 in (17.27 mm)

9.65 in (245.11 mm)

Tape Sealed

Tin

0.29 in (7.36 mm)

1 A

Gold

1 A

Wire

Copper Alloy

40 V

Low Profile

e4

0.14 in (3.556 mm)

3-5435640-9

TE Connectivity

Through Hole-Right Angle

1 GΩ

Tube

0.878 in (22.3 mm)

9.65 in (245.11 mm)

Tin

0.34 in (8.64 mm)

0.015A@24VDC

105 °C (221 °F)

1 A

-55 °C (-67 °F)

1 A

Wire

100 mΩ

Copper Alloy

40 V

0.14 in (3.556 mm)

76RSB08ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

1 GΩ

Tube

0.882 in (22.4 mm)

9.65 in (245.11 mm)

Top Tape Sealed

Gold over Nickel

0.292 in (7.42 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

150 mA

Solder

100 mΩ

Copper Alloy

16

30 V

RoHS Compliant

e3

0.136 in (3.454 mm)

A6H-8102

Omron

Surface Mount-Straight

1000 Cycle(s)

Tube

0.448 in (11.39 mm)

4.5 in (114.3 mm)

Tape Sealed

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

Low Profile

EDS04SNNNTU04Q

TE Connectivity

Panel Mount

Tube

0.396 in (10.06 mm)

Gold over Nickel

0.152 in (3.85 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

1-435802-5

TE Connectivity

Through Hole-Right Angle

7000 Cycle(s)

100 GΩ

Box; Tube

0.48 in (12.19 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.36 mm)

0.025A@24VDC

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

100 mΩ

Copper Alloy

8

50 V

Low Profile

0.14 in (3.556 mm)

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.