Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Diptronics Manufacturing |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.454 in (11.52 mm) |
9.9 in (251.46 mm) |
Gold over Nickel |
0.23 in (5.85 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Phosphor Bronze |
8 |
24 V |
e4 |
0.126 in (3.2 mm) |
|||||||||
|
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.454 in (11.52 mm) |
9.9 in (251.46 mm) |
Gold |
0.23 in (5.85 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
50 mΩ |
8 |
24 V |
e4 |
0.12 in (3.048 mm) |
||||||||||
|
Diptronics Manufacturing |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.854 in (21.68 mm) |
9.9 in (251.46 mm) |
0.23 in (5.85 mm) |
0.025A@24VDC |
Gold - with Nickel barrier |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||||
|
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.854 in (21.68 mm) |
9.9 in (251.46 mm) |
0.23 in (5.85 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
e4 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Box |
0.9 in (22.86 mm) |
9.906 in (251.612 mm) |
Tin |
0.335 in (8.5 mm) |
0.025A@50VDC |
70 °C (158 °F) |
10 mA |
-25 °C (-13 °F) |
10 mA |
Wire |
Phosphor Bronze |
16 |
50 V |
0.126 in (3.2 mm) |
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|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.378 in (9.6 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Gold |
0.124 in (3.15 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
50 mΩ |
Copper Alloy |
14 |
30 V |
RoHS Compliant, With Top Seal |
e3 |
||||||||
|
Omron |
|||||||||||||||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Tin |
0.29 in (7.36 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.396 in (10.06 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
|||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.296 in (7.52 mm) |
Gold over Nickel |
0.134 in (3.4 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Box; Tube |
0.98 in (24.89 mm) |
Tin |
0.29 in (7.36 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.58 in (14.73 mm) |
9.65 in (245.11 mm) |
Tin |
0.34 in (8.64 mm) |
1 A |
Gold |
1 A |
Wire |
Copper Alloy |
40 V |
e4 |
0.14 in (3.556 mm) |
|||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Through Hole-Right Angle |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.301 in (7.65 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
1.079 in (27.4 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.157 in (4 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.58 in (14.73 mm) |
9.65 in (245.11 mm) |
Tape Sealed |
Tin |
0.29 in (7.36 mm) |
1 A |
Gold |
1 A |
Wire |
Copper Alloy |
40 V |
Low Profile |
e4 |
0.14 in (3.556 mm) |
|||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Box |
0.2 in (5.08 mm) |
9.906 in (251.612 mm) |
Tin |
0.335 in (8.5 mm) |
0.025A@50VDC |
70 °C (158 °F) |
10 mA |
-25 °C (-13 °F) |
10 mA |
Wire |
Phosphor Bronze |
2 |
50 V |
0.126 in (3.2 mm) |
|||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.58 in (14.73 mm) |
9.65 in (245.11 mm) |
Tin |
0.29 in (7.36 mm) |
1 A |
1 A |
Wire |
Copper Alloy |
40 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.68 in (17.27 mm) |
Tin |
0.29 in (7.36 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.996 in (25.3 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.68 in (17.27 mm) |
9.65 in (245.11 mm) |
Tape Sealed |
Tin |
0.29 in (7.36 mm) |
1 A |
Gold |
1 A |
Wire |
Copper Alloy |
40 V |
Low Profile |
e4 |
0.14 in (3.556 mm) |
|||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1 GΩ |
Tube |
0.878 in (22.3 mm) |
9.65 in (245.11 mm) |
Tin |
0.34 in (8.64 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
40 V |
0.14 in (3.556 mm) |
||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
16 |
30 V |
RoHS Compliant |
e3 |
0.136 in (3.454 mm) |
|||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
Low Profile |
|||||||||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.396 in (10.06 mm) |
Gold over Nickel |
0.152 in (3.85 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
100 GΩ |
Box; Tube |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
8 |
50 V |
Low Profile |
0.14 in (3.556 mm) |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.