Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.267 in (6.78 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, 13 in |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Top Tape Sealed |
Gold |
0.16 in (4.06 mm) |
0.1A@25VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
25 V |
Approval: UL |
e4 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Tape and Reel |
0.278 in (7.06 mm) |
7.06 in (179.324 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@0.5VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
16 |
30 V |
RoHS Compliant, Recessed Slide |
e3 |
0.136 in (3.454 mm) |
|||||||
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.878 in (22.3 mm) |
7.49 in (190.246 mm) |
Gold/Nickel |
0.175 in (4.44 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
300 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
1 GΩ |
Tube |
0.88 in (22.35 mm) |
7.366 in (187.096 mm) |
Tin |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
16 |
50 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||
|
Grayhill |
Through Hole-Right Angle |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.301 in (7.65 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.344 in (8.75 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.846 in (21.48 mm) |
0.146 in (3.7 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
1.078 in (27.38 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Box |
0.926 in (23.52 mm) |
3.18 in (80.772 mm) |
Gold over Nickel |
0.245 in (6.22 mm) |
0.01A@5VDC |
70 °C (158 °F) |
1 A |
-25 °C (-13 °F) |
1 A |
Wire |
50 mΩ |
Copper Alloy |
5 V |
0.142 in (3.607 mm) |
|||||||||||
|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.144 in (3.66 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
1571983 |
110 mΩ |
Copper Alloy |
24 V |
RoHS Compliant |
||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.26 in (6.6 mm) |
5.4 in (137.16 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
ITT Cannon |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tube |
0.38 in (9.65 mm) |
9.65 in (245.11 mm) |
Silver over Nickel |
0.265 in (6.73 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
2 |
5 V |
e3 |
0.141 in (3.581 mm) |
||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
Tape and Reel |
0.244 in (6.2 mm) |
6.19 in (157.226 mm) |
Tape Sealed |
Gold over Nickel |
0.067 in (1.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
Copper Alloy |
50 V |
Low Profile |
||||||||||||
|
ITT Cannon |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tube |
0.58 in (14.73 mm) |
9.65 in (245.11 mm) |
Silver over Nickel |
0.265 in (6.72 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
10 |
5 V |
e3 |
0.141 in (3.581 mm) |
||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.378 in (9.6 mm) |
8.15 in (207.01 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant, Tape and Reel |
e4 |
||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.295 in (7.49 mm) |
4.52 in (114.808 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
16 |
30 V |
e3 |
0.136 in (3.454 mm) |
||||||||
|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel, Embossed, 10 in |
0.22 in (5.6 mm) |
4.1 in (104.14 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
||||||||||||||
|
TE Connectivity |
Panel Mount |
Box; Tube |
0.344 in (8.75 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.2 mm) |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
Copper Alloy |
50 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
Low Profile |
||||||||||||||||
|
Multicomp Pro |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
0.454 in (11.52 mm) |
9.9 in (251.46 mm) |
Gold |
0.23 in (5.85 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
50 mΩ |
24 V |
e4 |
0.126 in (3.2 mm) |
||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
1.28 in (32.5 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.87 in (22.1 mm) |
7.37 in (187.198 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40; Waterproof; Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
1 GΩ |
Tube |
0.878 in (22.3 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.157 in (4 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
Gold - with Nickel barrier |
1 A |
Wire |
300 mΩ |
Copper Alloy |
8 |
5 V |
e4 |
0.157 in (3.988 mm) |
||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.382 in (9.7 mm) |
9.65 in (245.11 mm) |
0.267 in (6.78 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Cui |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.139 in (3.54 mm) |
6.2 in (157.48 mm) |
Gold |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.