Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.478 in (12.14 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
0.346 in (8.79 mm) |
8.43 in (214.122 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.104 in (2.65 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
e3 |
|||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.245 in (6.22 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
0.278 in (7.06 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.157 in (4 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.537 in (13.64 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
ITT Cannon |
Through Hole-Right Angle |
10000 Cycle(s) |
1 GΩ |
Tube |
0.32 in (8.13 mm) |
7.11 in (180.594 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.38 in (9.65 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
4 |
5 V |
e3 |
0.125 in (3.175 mm) |
|||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
IP40 |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
Spc Technology/ Multicomp |
Surface Mount-Straight |
1000 Cycle(s) |
4.5 in (114.3 mm) |
Top Tape Sealed |
0.056 in (1.42 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
MCDHN |
24 V |
e4 |
||||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
1.079 in (27.4 mm) |
7.49 in (190.246 mm) |
Tape Sealed |
Gold over Nickel |
0.157 in (4 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
||||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Bulk |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.34 in (8.64 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
8 |
40 V |
Sealed |
0.14 in (3.556 mm) |
||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
Tube |
1.28 in (32.51 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
|||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.346 in (8.79 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
218 |
24 V |
e4 |
|||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.337 in (8.56 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Tube |
0.794 in (20.17 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
16 |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.276 in (7.01 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
Copper Alloy |
5 V |
0.157 in (3.988 mm) |
||||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.104 in (2.65 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
||||||||||||||
Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.439 in (11.16 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
8 |
24 V |
0.122 in (3.099 mm) |
||||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.37 in (9.4 mm) |
7.37 in (187.198 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
1.28 in (32.51 mm) |
Tin |
0.29 in (7.36 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
Tube |
1.28 in (32.51 mm) |
9.65 in (245.11 mm) |
Tape Sealed |
Gold over Nickel |
0.29 in (7.36 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
24 |
40 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.295 in (7.49 mm) |
7.06 in (179.324 mm) |
Top Tape Sealed |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.578 in (14.68 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
Grayhill |
Surface Mount-Straight |
Tube |
0.248 in (6.3 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
24 V |
Low Profile |
e4 |
||||||||||||||
|
TE Connectivity |
Panel Mount |
2000 Cycle(s) |
Tape and Reel |
0.096 in (2.44 mm) |
2.44 in (61.976 mm) |
Tape Sealed |
Gold over Nickel |
0.134 in (3.4 mm) |
0.025A@24VDC |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 kΩ |
Tube |
0.48 in (12.2 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
Gold over Nickel |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
0.156 in (3.962 mm) |
|||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.177 in (4.5 mm) |
3.76 in (95.504 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
Epoxy |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
0.156 in (3.962 mm) |
|||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
1.2 in (30.48 mm) |
Tin |
0.079 in (2 mm) |
85 °C (185 °F) |
2 A |
-30 °C (-22 °F) |
2 A |
Solder |
Copper Alloy |
500 V |
0.15 in (3.81 mm) |
||||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.22 in (5.6 mm) |
3.58 in (90.932 mm) |
Tape Sealed |
Gold |
0.079 in (2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Surface Mount-Right Angle |
2000 Cycle(s) |
Tape and Reel |
0.681 in (17.3 mm) |
9.65 in (245.11 mm) |
0.305 in (7.75 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
Epoxy |
Gold over Nickel |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
||||||||||
|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
5 GΩ |
Tube |
0.29 in (7.37 mm) |
6.9 in (175.26 mm) |
Moisture Proof; Top Tape Sealed |
Gold |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
100 mA |
Solder |
20 mΩ |
Copper Alloy |
6 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.378 in (9.6 mm) |
7.5 in (190.5 mm) |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||
|
C & K Components |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.321 in (8.15 mm) |
7 in (177.8 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant |
e4 |
||||||||||
|
ITT Cannon |
Surface Mount-Straight |
1000 Cycle(s) |
Tube |
0.544 in (13.83 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
0.091 in (2.3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold Flash - with Nickel barrier |
25 mA |
Solder |
TDA |
24 V |
||||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Top Tape Sealed |
Gold |
0.128 in (3.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.