Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.596 in (15.14 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
1.08 in (27.432 mm) |
9.652 in (245.161 mm) |
Gold over Nickel |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 mΩ |
Copper Alloy |
30 V |
0.156 in (3.962 mm) |
||||||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
3.67 in (93.218 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.244 in (6.2 mm) |
3.67 in (93.218 mm) |
Tape Sealed |
Gold over Nickel |
0.087 in (2.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
1 GΩ |
Tube |
0.78 in (19.8 mm) |
7.49 in (190.246 mm) |
Gold over Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
1 A |
Wire |
300 mΩ |
Copper Alloy |
14 |
5 V |
RoHS Compliant |
0.157 in (3.988 mm) |
|||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.878 in (22.3 mm) |
9.65 in (245.11 mm) |
Tape Sealed |
Tin |
0.29 in (7.36 mm) |
1A@40VDC |
1 A |
1 A |
Wire |
Copper Alloy |
40 V |
Low Profile |
0.14 in (3.556 mm) |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.571 in (14.5 mm) |
7.37 in (187.198 mm) |
Top Tape Sealed |
0.165 in (4.19 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
100 mA |
Solder |
6 V |
e3 |
||||||||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.48 in (12.2 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
8 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.296 in (7.52 mm) |
Tape Sealed |
Gold over Nickel |
0.134 in (3.4 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.444 in (11.28 mm) |
6.18 in (156.972 mm) |
Tape Sealed |
Gold over Nickel |
0.091 in (2.31 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
|||||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.946 in (24.02 mm) |
0.146 in (3.7 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.68 in (169.672 mm) |
Environmentally Sealed; Waterproof |
Gold |
0.158 in (4.02 mm) |
85 °C (185 °F) |
-55 °C (-67 °F) |
Solder |
50 mΩ |
Beryllium Copper |
Low Profile, Standard: UL |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Cui |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.239 in (6.08 mm) |
6.2 in (157.48 mm) |
Gold |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
|||||||||||||
TE Connectivity |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.437 in (11.1 mm) |
7.3 in (185.42 mm) |
Top Tape Sealed |
Gold |
0.1 in (2.55 mm) |
0.1A@24VDC |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Nickel |
100 mA |
Solder |
100 mΩ |
Bronze |
24 V |
Low Profile |
|||||||||||
Itw Mcmurdo Connectors |
Through Hole-Straight |
0.661 in (16.8 mm) |
10.5 in (266.7 mm) |
Tape Sealed |
0.354 in (9 mm) |
Solder |
SDS023 |
|||||||||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
1000 Cycle(s) |
100 MΩ |
Tube |
0.394 in (10.01 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
8 |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
||||||||
|
Cts |
Surface Mount-Straight |
10000 Cycle(s) |
1 GΩ |
0.886 in (22.5044 mm) |
9.779 in (248.387 mm) |
Epoxy |
Gold |
0.359 in (9.1186 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
RoHS Compliant |
e4 |
||||||||||
|
Cts |
Through Hole-Straight |
10000 Cycle(s) |
Anti-Static Tube |
0.886 in (22.5 mm) |
9.78 in (248.412 mm) |
Epoxy Terminal Sealed; Top Tape Sealed |
0.299 in (7.6 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
24 V |
e4 |
||||||||||||||
|
Cts |
Surface Mount-Straight |
1000 Cycle(s) |
Anti-Static Tube |
0.446 in (11.33 mm) |
5.8 in (147.32 mm) |
Bottom Sealed; Top Tape Sealed |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold Flash |
25 mA |
Solder |
218 |
24 V |
||||||||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.264 in (6.7 mm) |
6.55 in (166.37 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.858 in (21.79 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e4 |
|||||||||
Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.239 in (6.08 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
4 |
24 V |
0.122 in (3.099 mm) |
||||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.996 in (25.3 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 kΩ |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
Top Tape Sealed |
Gold over Nickel |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
0.156 in (3.962 mm) |
|||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.177 in (4.5 mm) |
3.76 in (95.504 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
IP40; Waterproof; Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
||||||||||||
|
ITT Cannon |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Tube |
0.38 in (9.65 mm) |
9.65 in (245.11 mm) |
Epoxy Terminal Sealed |
Silver over Nickel |
0.265 in (6.73 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - with Nickel barrier |
100 mA |
Solder |
BD |
50 mΩ |
Phosphor Bronze |
4 |
5 V |
e3 |
0.141 in (3.581 mm) |
|||||||
|
Apem Components |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
e4 |
|||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
1.037 in (26.34 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
e4 |
|||||||||
|
Cui |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
0.156 in (3.96 mm) |
9.9 in (251.46 mm) |
Gold |
0.217 in (5.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
2 |
24 V |
0.15 in (3.81 mm) |
||||||||||||
|
C & K Components |
Surface Mount-Straight |
100 MΩ |
0.236 in (5.9944 mm) |
2.3876 in (60.645 mm) |
Gold over Nickel |
0.091 in (2.3114 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
Gold over Nickel |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
50 V |
e4 |
|||||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
0.637 in (16.18 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
|||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.177 in (4.5 mm) |
3.77 in (95.758 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.177 in (4.5 mm) |
3.77 in (95.758 mm) |
Tape Sealed |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
||||||||||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40; Waterproof; Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
|||||||||||
|
Itw Erg Components |
Through Hole-Straight |
0.791 in (20.1 mm) |
10.5 in (266.7 mm) |
Moisture Proof |
0.339 in (8.6 mm) |
1A@100VDC |
100 °C (212 °F) |
-55 °C (-67 °F) |
1 A |
Solder |
100 V |
||||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.578 in (14.68 mm) |
7.5 in (190.5 mm) |
Tape Sealed |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||
|
Cts |
Through Hole-Right Angle |
10000 Cycle(s) |
Anti-Static Tube |
0.986 in (25.04 mm) |
7.24 in (183.896 mm) |
0.4 in (10.16 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
206RA |
24 V |
e4 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.