Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.351 in (8.92 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
6 |
24 V |
0.122 in (3.099 mm) |
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Wurth Elektronik |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
Tube |
0.639 in (16.24 mm) |
9.68 in (245.872 mm) |
Gold |
0.39 in (9.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
12 |
24 V |
0.122 in (3.099 mm) |
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|
Grayhill |
Surface Mount-Right Angle |
2000 Cycle(s) |
2 GΩ |
Tape and Reel |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.305 in (7.75 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
RoHS Compliant |
e3 |
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|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
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|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Epoxy |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
30 V |
e3 |
0.156 in (3.962 mm) |
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|
Grayhill |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.268 in (6.81 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
100 mΩ |
Copper Alloy |
30 V |
e3 |
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|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.681 in (17.3 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.245 in (6.22 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
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|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.579 in (14.7 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
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|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.896 in (22.76 mm) |
Tape Sealed |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
Omron |
Through Hole-Right Angle |
2000 Cycle(s) |
100 MΩ |
0.35 in (8.9 mm) |
7.1 in (180.34 mm) |
0.252 in (6.4 mm) |
0.1A@5VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
100 mA |
Solder |
100 mΩ |
Beryllium Copper |
4 |
5 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
0.861 in (21.88 mm) |
9.9 in (251.46 mm) |
Bottom Sealed |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
A6E |
200 mΩ |
16 |
24 V |
e4 |
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|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
IP40 |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
e4 |
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|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.236 in (6 mm) |
4.98 in (126.492 mm) |
IP40 |
Gold |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
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|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.396 in (10.06 mm) |
6 in (152.4 mm) |
IP40 |
0.197 in (5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
24 V |
Low Profile |
e4 |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.837 in (21.26 mm) |
6.2 in (157.48 mm) |
0.142 in (3.6 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
25 mA |
Solder |
200 mΩ |
16 |
24 V |
e4 |
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|
Omron |
Through Hole-Straight |
1000 Cycle(s) |
Tube |
0.295 in (7.5 mm) |
7 in (177.8 mm) |
0.167 in (4.25 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
25 mA |
Solder |
24 V |
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|
C & K Components |
Through Hole-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.321 in (8.15 mm) |
4.48 in (113.792 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
e4 |
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|
Nidec Copal Electronics |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Bag |
0.362 in (9.2 mm) |
5.6 in (142.24 mm) |
Gold |
0.098 in (2.5 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
100 mA |
Solder |
50 mΩ |
Copper Alloy |
6 V |
Low Profile |
e4 |
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|
Nidec Copal Electronics |
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|
Cui |
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|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.296 in (7.52 mm) |
Gold over Nickel |
0.15 in (3.8 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.796 in (20.22 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
TE Connectivity |
Panel Mount |
Tube |
0.796 in (20.22 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
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|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.177 in (4.5 mm) |
3.77 in (95.758 mm) |
Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Tin |
25 mA |
Solder |
IKH |
100 mΩ |
Phosphor Bronze |
24 V |
Very Low Profile |
e3 |
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|
E-switch |
Through Hole-Straight |
100 MΩ |
0.854 in (21.6916 mm) |
9.8806 in (250.967 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold/Nickel |
100 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
50 V |
Packaging Tape |
0.126 in (3.2 mm) |
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|
E-switch |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
0.854 in (21.6916 mm) |
9.906 in (251.612 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
24 V |
0.126 in (3.2 mm) |
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|
E-switch |
Through Hole-Straight |
100 MΩ |
0.854 in (21.6916 mm) |
9.8806 in (250.967 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold/Nickel |
100 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
50 V |
Packaging Tape |
0.126 in (3.2 mm) |
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|
E-switch |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
0.854 in (21.6916 mm) |
9.906 in (251.612 mm) |
Gold over Nickel |
0.236 in (5.9944 mm) |
0.025A@24VDC |
80 °C (176 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Phosphor Bronze |
16 |
24 V |
0.126 in (3.2 mm) |
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Otax |
Surface Mount-Straight |
Tape and Reel |
Tape Sealed |
Gold |
Solder |
KH |
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|
Otax |
Surface Mount-Straight |
Tape and Reel |
Tape Sealed |
Gold |
Gold |
Solder |
e4 |
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|
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.39 in (9.9 mm) |
6.44 in (163.576 mm) |
0.23 in (5.85 mm) |
0.025A@24VDC |
Gold - with Nickel barrier |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||||
|
Diptronics Manufacturing |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.39 in (9.9 mm) |
6.44 in (163.576 mm) |
0.23 in (5.85 mm) |
0.025A@24VDC |
Gold - with Nickel barrier |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||||
|
Apem Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold over Nickel |
0.056 in (1.42 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
|
Knitter-switch |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Waterproof |
Gold over Nickel |
0.118 in (3 mm) |
0.1A@6VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
50 mΩ |
6 V |
e4 |
|||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.946 in (24.02 mm) |
Tape Sealed |
0.161 in (4.1 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Through Hole-Straight |
0.8 in (20.32 mm) |
12.42 in (315.468 mm) |
0.319 in (8.1 mm) |
Solder |
||||||||||||||||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.794 in (20.17 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
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|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.446 in (11.32 mm) |
0.146 in (3.7 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||||
TE Connectivity |
Panel Mount |
Tube |
0.796 in (20.22 mm) |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||||
TE Connectivity |
Panel Mount |
Tube |
0.796 in (20.22 mm) |
Tape Sealed |
Gold over Nickel |
0.197 in (5 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
TE Connectivity |
Through Hole-Right Angle |
Box; Tube |
0.28 in (7.11 mm) |
7.11 in (180.594 mm) |
Gold over Nickel |
0.29 in (7.37 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Beryllium Copper |
50 V |
0.14 in (3.556 mm) |
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|
Cts |
Surface Mount-Straight |
0.686 in (17.42 mm) |
10.41 in (264.414 mm) |
Bottom Sealed; Top Tape Sealed |
0.359 in (9.12 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
50 V |
e3 |
||||||||||||||||
Cts |
Surface Mount-Straight |
0.886 in (22.5 mm) |
10.41 in (264.414 mm) |
Bottom Sealed; Top Tape Sealed |
0.359 in (9.12 mm) |
0.1A@50VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
100 mA |
Solder |
204 |
50 V |
e3 |
||||||||||||||||
|
Cts |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Anti-Static Tube |
0.486 in (12.34 mm) |
9.78 in (248.412 mm) |
Gold |
0.299 in (7.6 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
50 mA |
Solder |
100 mΩ |
Copper Alloy |
8 |
24 V |
RoHS Compliant |
e4 |
0.15 in (3.81 mm) |
||||||||
|
Cts |
Through Hole-Straight |
10000 Cycle(s) |
1 GΩ |
Anti-Static Tube |
0.886 in (22.5 mm) |
9.78 in (248.412 mm) |
Epoxy Terminal Sealed; Top Tape Sealed |
Gold |
0.299 in (7.6 mm) |
0.05A@24VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Matte Tin - with Nickel barrier |
50 mA |
Solder |
Copper Alloy |
16 |
24 V |
RoHS Compliant |
e3 |
0.15 in (3.81 mm) |
||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold - with Nickel barrier |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e4 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.