DIP & SIP Switches

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

MCDHA-08TQR

Multicomp Pro

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

0.444 in (11.29 mm)

6.2 in (157.48 mm)

Gold

0.087 in (2.2 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

24 V

Low Profile

MCDHN-02F-V

Spc Technology/ Multicomp

Surface Mount-Straight

1000 Cycle(s)

0.148 in (3.77 mm)

4.5 in (114.3 mm)

Tape Sealed

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

24 V

e4

MCDM(R)-02-T

Multicomp Pro

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

0.244 in (6.2 mm)

6.02 in (152.908 mm)

Top Tape Sealed

Gold over Nickel

0.145 in (3.683 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

DMR

100 mΩ

Copper Alloy

24 V

Low Profile

TDP02H1SBD1

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.236 in (6 mm)

3.7 in (93.98 mm)

Molded

Gold over Nickel

0.161 in (4.1 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

TDS04

Apem Components

Through Hole-Straight

2000 Cycle(s)

100 MΩ

Tube

0.557 in (14.14 mm)

10.1 in (256.54 mm)

Gold

0.232 in (5.9 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

TDS

50 mΩ

Brass

8

24 V

UL94V-0 Materials used

0.126 in (3.2 mm)

1-2319848-2

TE Connectivity

Panel Mount

Tube

0.196 in (4.98 mm)

Gold over Nickel

0.136 in (3.45 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

1-5435802-2

TE Connectivity

Through Hole-Right Angle

Tube

1.28 in (32.51 mm)

Tin

0.29 in (7.36 mm)

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

Copper Alloy

50 V

Low Profile

0.14 in (3.556 mm)

2-1825058-1

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

1 GΩ

Tube

0.878 in (22.3 mm)

7.5 in (190.5 mm)

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

2-435802-2

TE Connectivity

Through Hole-Right Angle

7000 Cycle(s)

100 GΩ

Bulk

1.28 in (32.51 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.36 mm)

0.025A@24VDC

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

100 mΩ

Copper Alloy

24

50 V

Low Profile

0.14 in (3.556 mm)

219-3MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.358 in (9.09 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-4LPST

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Gold

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e4

219-4LPSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-4LPSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.458 in (11.63 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL; Low Profile

e3

219-5MSTF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5MSTJ

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5MSTJF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5MSTJR

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-5MSTJRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.558 in (14.17 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.2 in (5.07 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

219-7MSTRF

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel

0.758 in (19.25 mm)

6.7 in (170.18 mm)

Bottom Sealed; Top Tape Sealed

Gold

0.159 in (4.05 mm)

0.1A@20VDC

85 °C (185 °F)

-55 °C (-67 °F)

Tin

100 mA

Solder

25 mΩ

Beryllium Copper

20 V

Approval: UL

e3

2319747-7

TE Connectivity

Panel Mount

Tube

0.546 in (13.86 mm)

0.161 in (4.1 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

3-5435640-0

TE Connectivity

Through Hole-Right Angle

Tube

0.38 in (9.65 mm)

9.65 in (245.11 mm)

Tin

0.34 in (8.64 mm)

1 A

1 A

Wire

Copper Alloy

40 V

0.14 in (3.556 mm)

4-435166-9

TE Connectivity

Through Hole-Right Angle

7000 Cycle(s)

1 GΩ

Box; Tube

0.48 in (12.19 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.36 mm)

0.1A@5VDC

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

100 mΩ

Beryllium Copper

50 V

0.14 in (3.556 mm)

418117270908

Wurth Elektronik

Through Hole-Straight

2000 Cycle(s)

100 MΩ

0.839 in (21.32 mm)

9.6 in (243.84 mm)

Gold

0.224 in (5.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Tin

25 mA

Solder

100 mΩ

Copper Alloy

16

24 V

e3

0.146 in (3.708 mm)

418121270810

Wurth Elektronik

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel, Embossed, 13 in

1.037 in (26.34 mm)

6.2 in (157.48 mm)

Gold

0.146 in (3.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

25 mA

Solder

100 mΩ

Copper Alloy

24 V

e4

76PSB12ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

1.28 in (32.5 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.281 in (7.14 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

30 V

76RSC04ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.78 in (19.8 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.247 in (6.27 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

30 V

76SB02T

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.38 in (9.65 mm)

7.1 in (180.34 mm)

0.292 in (7.42 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

150 mA

Solder

30 V

78H02ST

Grayhill

Through Hole-Straight

2000 Cycle(s)

Tube

0.882 in (22.4 mm)

9.65 in (245.11 mm)

Top Tape Sealed

0.265 in (6.73 mm)

0.15A@30VDC

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin over Nickel

150 mA

Solder

30 V

e3

97C08SRT

Grayhill

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.448 in (11.38 mm)

4.5 in (114.3 mm)

Top Tape Sealed

Gold over Nickel

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

e4

A6D-8100

Omron

Through Hole-Straight

2000 Cycle(s)

100 MΩ

Tube

0.882 in (22.4 mm)

6.6 in (167.64 mm)

IP64

0.134 in (3.4 mm)

0.03A@30VDC

70 °C (158 °F)

-20 °C (-4 °F)

Gold

30 mA

Solder

100 mΩ

Beryllium Copper

16

30 V

Sealed Construction

e4

0.181 in (4.597 mm)

A6H-8101-PM

Omron

Surface Mount-Straight

1000 Cycle(s)

Tape and Reel

0.448 in (11.39 mm)

4.5 in (114.3 mm)

0.057 in (1.45 mm)

0.025A@24VDC

70 °C (158 °F)

-20 °C (-4 °F)

25 mA

Solder

24 V

ADF06STTR

TE Connectivity

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.678 in (17.22 mm)

7.5 in (190.5 mm)

Gold

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

ASE2DRA

Knitter-switch

Through Hole-Right Angle

0.05A@48VAC

500 MΩ

0.374 in (9.4996 mm)

5.588 in (141.935 mm)

Gold over Nickel

0.415 in (10.541 mm)

0.05A@48VDC

85 °C (185 °F)

50 mA

-20 °C (-4 °F)

50 mA

Solder

50 mΩ

Phosphor Bronze

6

48 V

48 V

0.13 in (3.302 mm)

0.4VA@48VAC

BPA02SB

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tube

0.321 in (8.15 mm)

7 in (177.8 mm)

Gold over Nickel

0.236 in (6 mm)

0.1A@5VDC

85 °C (185 °F)

-20 °C (-4 °F)

Gold over Nickel

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

RoHS Compliant

e4

C42315-A1347-A124

TE Connectivity

Through Hole-Straight

2.4 in (60.96 mm)

12.42 in (315.468 mm)

0.319 in (8.1 mm)

Solder

C42315-A1347

DHNF-04F-T-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel

0.248 in (6.31 mm)

4.5 in (114.3 mm)

Top Tape Sealed

Gold

0.059 in (1.5 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

24 V

Low Profile

EDS10SNRNTR04Q

TE Connectivity

Panel Mount

Tape and Reel

0.996 in (25.3 mm)

Gold over Nickel

0.136 in (3.45 mm)

85 °C (185 °F)

25 mA

-20 °C (-4 °F)

25 mA

Wire

Copper Alloy

24 V

IKD0403000

Apem Components

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

Top Tape Sealed

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

24 V

Approval: UL

IKD0405101

Apem Components

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tube

0.437 in (11.1 mm)

6.2 in (157.48 mm)

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

24 V

Approval: UL

KAT1108E

E-switch

MPG304B

Apem Components

Through Hole-Straight

2000 Cycle(s)

1 GΩ

Tube

0.854 in (21.7 mm)

9.7 in (246.38 mm)

Epoxy Terminal Sealed

Gold over Nickel

0.381 in (9.68 mm)

0.025A@24VDC

70 °C (158 °F)

-25 °C (-13 °F)

Gold - with Nickel barrier

25 mA

Solder

MPG

50 mΩ

Brass

16

24 V

UL94V-0 Materials used

e4

0.118 in (2.997 mm)

SDA04H0SBDR

C & K Components

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, 13 in

0.476 in (12.1 mm)

7.49 in (190.246 mm)

Gold

0.138 in (3.5 mm)

0.1A@5VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold over Nickel

100 mA

Solder

50 mΩ

Beryllium Copper

5 V

Low Profie, UL

e4

418117170901

Wurth Elektronik

Through Hole-Straight

2000 Cycle(s)

100 MΩ

Tube

0.39 in (9.9 mm)

3.84 in (97.536 mm)

Gold

0.224 in (5.7 mm)

0.025A@24VDC

85 °C (185 °F)

-40 °C (-40 °F)

25 mA

Solder

100 mΩ

Copper Alloy

2

24 V

0.146 in (3.708 mm)

DMR-01-T-V-T/R

Diptronics Manufacturing

Surface Mount-Straight

2000 Cycle(s)

100 MΩ

Tape and Reel

0.244 in (6.2 mm)

3.48 in (88.392 mm)

Top Tape Sealed

Gold

0.118 in (3 mm)

0.025A@24VDC

85 °C (185 °F)

-20 °C (-4 °F)

25 mA

Solder

50 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

435640-2

TE Connectivity

Through Hole-Right Angle

2000 Cycle(s)

1 GΩ

0.48 in (12.19 mm)

9.65 in (245.11 mm)

Bottom Sealed

Gold over Nickel

0.34 in (8.64 mm)

0.015A@24VDC

105 °C (221 °F)

1 A

-55 °C (-67 °F)

1 A

Wire

100 mΩ

Copper Alloy

8

40 V

Unsealed

0.14 in (3.556 mm)

1-1825006-1

TE Connectivity

Panel Mount

1000 Cycle(s)

100 MΩ

Tube

0.594 in (15.09 mm)

6.2 in (157.48 mm)

Tape Sealed

Gold over Nickel

0.106 in (2.7 mm)

0.025A@24VDC

85 °C (185 °F)

100 mA

-30 °C (-22 °F)

25 mA

Wire

100 mΩ

Copper Alloy

24 V

Approval: UL; Low Profile

0.169 in (4.293 mm)

435802-9

TE Connectivity

Through Hole-Right Angle

7000 Cycle(s)

100 GΩ

0.88 in (22.35 mm)

9.65 in (245.11 mm)

Gold over Nickel

0.29 in (7.36 mm)

0.025A@24VDC

105 °C (221 °F)

1.5 A

-55 °C (-67 °F)

1.5 A

Wire

100 mΩ

Copper Alloy

16

50 V

Low Profile

0.14 in (3.556 mm)

ADF02S04

TE Connectivity

Panel Mount

1000 Cycle(s)

100 MΩ

Tube

0.278 in (7.06 mm)

7.06 in (179.324 mm)

Nickel

0.138 in (3.5 mm)

0.1A@24VDC

85 °C (185 °F)

1 A

-30 °C (-22 °F)

100 mA

Solder

100 mΩ

Copper Alloy

24 V

Approval: UL

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.