Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Multicomp Pro |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
0.444 in (11.29 mm) |
6.2 in (157.48 mm) |
Gold |
0.087 in (2.2 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
24 V |
Low Profile |
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|
Spc Technology/ Multicomp |
Surface Mount-Straight |
1000 Cycle(s) |
0.148 in (3.77 mm) |
4.5 in (114.3 mm) |
Tape Sealed |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
24 V |
e4 |
|||||||||||||||
Multicomp Pro |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
0.244 in (6.2 mm) |
6.02 in (152.908 mm) |
Top Tape Sealed |
Gold over Nickel |
0.145 in (3.683 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
DMR |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
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|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.236 in (6 mm) |
3.7 in (93.98 mm) |
Molded |
Gold over Nickel |
0.161 in (4.1 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
||||||||||
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.557 in (14.14 mm) |
10.1 in (256.54 mm) |
Gold |
0.232 in (5.9 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
TDS |
50 mΩ |
Brass |
8 |
24 V |
UL94V-0 Materials used |
0.126 in (3.2 mm) |
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|
TE Connectivity |
Panel Mount |
Tube |
0.196 in (4.98 mm) |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
1.28 in (32.51 mm) |
Tin |
0.29 in (7.36 mm) |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
Copper Alloy |
50 V |
Low Profile |
0.14 in (3.556 mm) |
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|
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
1 GΩ |
Tube |
0.878 in (22.3 mm) |
7.5 in (190.5 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
||||||||||||
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
100 GΩ |
Bulk |
1.28 in (32.51 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
24 |
50 V |
Low Profile |
0.14 in (3.556 mm) |
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|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.358 in (9.09 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Gold |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e4 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.458 in (11.63 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL; Low Profile |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.558 in (14.17 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.2 in (5.07 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
Cts |
Surface Mount-Straight |
2000 Cycle(s) |
1 GΩ |
Tape and Reel |
0.758 in (19.25 mm) |
6.7 in (170.18 mm) |
Bottom Sealed; Top Tape Sealed |
Gold |
0.159 in (4.05 mm) |
0.1A@20VDC |
85 °C (185 °F) |
-55 °C (-67 °F) |
Tin |
100 mA |
Solder |
25 mΩ |
Beryllium Copper |
20 V |
Approval: UL |
e3 |
|||||||||
|
TE Connectivity |
Panel Mount |
Tube |
0.546 in (13.86 mm) |
0.161 in (4.1 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
||||||||||||||||||
|
TE Connectivity |
Through Hole-Right Angle |
Tube |
0.38 in (9.65 mm) |
9.65 in (245.11 mm) |
Tin |
0.34 in (8.64 mm) |
1 A |
1 A |
Wire |
Copper Alloy |
40 V |
0.14 in (3.556 mm) |
|||||||||||||||||
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
1 GΩ |
Box; Tube |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.1A@5VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Beryllium Copper |
50 V |
0.14 in (3.556 mm) |
||||||||||||
|
Wurth Elektronik |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
0.839 in (21.32 mm) |
9.6 in (243.84 mm) |
Gold |
0.224 in (5.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
16 |
24 V |
e3 |
0.146 in (3.708 mm) |
||||||||||
|
Wurth Elektronik |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel, Embossed, 13 in |
1.037 in (26.34 mm) |
6.2 in (157.48 mm) |
Gold |
0.146 in (3.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
e4 |
|||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
1.28 in (32.5 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.281 in (7.14 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.78 in (19.8 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.247 in (6.27 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.38 in (9.65 mm) |
7.1 in (180.34 mm) |
0.292 in (7.42 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
150 mA |
Solder |
30 V |
|||||||||||||||||
|
Grayhill |
Through Hole-Straight |
2000 Cycle(s) |
Tube |
0.882 in (22.4 mm) |
9.65 in (245.11 mm) |
Top Tape Sealed |
0.265 in (6.73 mm) |
0.15A@30VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin over Nickel |
150 mA |
Solder |
30 V |
e3 |
||||||||||||||
|
Grayhill |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.448 in (11.38 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold over Nickel |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
e4 |
|||||||||
|
Omron |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.882 in (22.4 mm) |
6.6 in (167.64 mm) |
IP64 |
0.134 in (3.4 mm) |
0.03A@30VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
Gold |
30 mA |
Solder |
100 mΩ |
Beryllium Copper |
16 |
30 V |
Sealed Construction |
e4 |
0.181 in (4.597 mm) |
||||||||
|
Omron |
Surface Mount-Straight |
1000 Cycle(s) |
Tape and Reel |
0.448 in (11.39 mm) |
4.5 in (114.3 mm) |
0.057 in (1.45 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
24 V |
|||||||||||||||||
TE Connectivity |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.678 in (17.22 mm) |
7.5 in (190.5 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
|||||||||||||
|
Knitter-switch |
Through Hole-Right Angle |
0.05A@48VAC |
500 MΩ |
0.374 in (9.4996 mm) |
5.588 in (141.935 mm) |
Gold over Nickel |
0.415 in (10.541 mm) |
0.05A@48VDC |
85 °C (185 °F) |
50 mA |
-20 °C (-4 °F) |
50 mA |
Solder |
50 mΩ |
Phosphor Bronze |
6 |
48 V |
48 V |
0.13 in (3.302 mm) |
0.4VA@48VAC |
|||||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tube |
0.321 in (8.15 mm) |
7 in (177.8 mm) |
Gold over Nickel |
0.236 in (6 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
RoHS Compliant |
e4 |
||||||||||
TE Connectivity |
Through Hole-Straight |
2.4 in (60.96 mm) |
12.42 in (315.468 mm) |
0.319 in (8.1 mm) |
Solder |
C42315-A1347 |
||||||||||||||||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.248 in (6.31 mm) |
4.5 in (114.3 mm) |
Top Tape Sealed |
Gold |
0.059 in (1.5 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Low Profile |
|||||||||||
|
TE Connectivity |
Panel Mount |
Tape and Reel |
0.996 in (25.3 mm) |
Gold over Nickel |
0.136 in (3.45 mm) |
85 °C (185 °F) |
25 mA |
-20 °C (-4 °F) |
25 mA |
Wire |
Copper Alloy |
24 V |
|||||||||||||||||
|
Apem Components |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
Top Tape Sealed |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
24 V |
Approval: UL |
|||||||||||||
Apem Components |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.437 in (11.1 mm) |
6.2 in (157.48 mm) |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
24 V |
Approval: UL |
|||||||||||||||
|
E-switch |
|||||||||||||||||||||||||||||
|
Apem Components |
Through Hole-Straight |
2000 Cycle(s) |
1 GΩ |
Tube |
0.854 in (21.7 mm) |
9.7 in (246.38 mm) |
Epoxy Terminal Sealed |
Gold over Nickel |
0.381 in (9.68 mm) |
0.025A@24VDC |
70 °C (158 °F) |
-25 °C (-13 °F) |
Gold - with Nickel barrier |
25 mA |
Solder |
MPG |
50 mΩ |
Brass |
16 |
24 V |
UL94V-0 Materials used |
e4 |
0.118 in (2.997 mm) |
||||||
|
C & K Components |
Surface Mount-Straight |
1000 Cycle(s) |
100 MΩ |
Tape and Reel, 13 in |
0.476 in (12.1 mm) |
7.49 in (190.246 mm) |
Gold |
0.138 in (3.5 mm) |
0.1A@5VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
Gold over Nickel |
100 mA |
Solder |
50 mΩ |
Beryllium Copper |
5 V |
Low Profie, UL |
e4 |
||||||||||
|
Wurth Elektronik |
Through Hole-Straight |
2000 Cycle(s) |
100 MΩ |
Tube |
0.39 in (9.9 mm) |
3.84 in (97.536 mm) |
Gold |
0.224 in (5.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-40 °C (-40 °F) |
25 mA |
Solder |
100 mΩ |
Copper Alloy |
2 |
24 V |
0.146 in (3.708 mm) |
|||||||||||
|
Diptronics Manufacturing |
Surface Mount-Straight |
2000 Cycle(s) |
100 MΩ |
Tape and Reel |
0.244 in (6.2 mm) |
3.48 in (88.392 mm) |
Top Tape Sealed |
Gold |
0.118 in (3 mm) |
0.025A@24VDC |
85 °C (185 °F) |
-20 °C (-4 °F) |
25 mA |
Solder |
50 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
|||||||||||
TE Connectivity |
Through Hole-Right Angle |
2000 Cycle(s) |
1 GΩ |
0.48 in (12.19 mm) |
9.65 in (245.11 mm) |
Bottom Sealed |
Gold over Nickel |
0.34 in (8.64 mm) |
0.015A@24VDC |
105 °C (221 °F) |
1 A |
-55 °C (-67 °F) |
1 A |
Wire |
100 mΩ |
Copper Alloy |
8 |
40 V |
Unsealed |
0.14 in (3.556 mm) |
||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.594 in (15.09 mm) |
6.2 in (157.48 mm) |
Tape Sealed |
Gold over Nickel |
0.106 in (2.7 mm) |
0.025A@24VDC |
85 °C (185 °F) |
100 mA |
-30 °C (-22 °F) |
25 mA |
Wire |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL; Low Profile |
0.169 in (4.293 mm) |
|||||||||
TE Connectivity |
Through Hole-Right Angle |
7000 Cycle(s) |
100 GΩ |
0.88 in (22.35 mm) |
9.65 in (245.11 mm) |
Gold over Nickel |
0.29 in (7.36 mm) |
0.025A@24VDC |
105 °C (221 °F) |
1.5 A |
-55 °C (-67 °F) |
1.5 A |
Wire |
100 mΩ |
Copper Alloy |
16 |
50 V |
Low Profile |
0.14 in (3.556 mm) |
|||||||||||
|
TE Connectivity |
Panel Mount |
1000 Cycle(s) |
100 MΩ |
Tube |
0.278 in (7.06 mm) |
7.06 in (179.324 mm) |
Nickel |
0.138 in (3.5 mm) |
0.1A@24VDC |
85 °C (185 °F) |
1 A |
-30 °C (-22 °F) |
100 mA |
Solder |
100 mΩ |
Copper Alloy |
24 V |
Approval: UL |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.