Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DOUBLE BALANCED |
15 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1300 MHz |
2300 MHz |
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|
Analog Devices |
DOUBLE BALANCED |
15 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1300 MHz |
2300 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
BIPOLAR |
12 dBm |
113 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
50 MHz |
2400 MHz |
|||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
CMOS COMPATIBLE |
e3 |
2000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
75 mA |
COMPONENT |
5 |
TSSOP14,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
2500 MHz |
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|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15 dB |
22000 MHz |
38000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
15 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
1 MHz |
6000 MHz |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15 dB |
22000 MHz |
38000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
9.5 dB |
5500 MHz |
14000 MHz |
|||||||||
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11 dB |
e4 |
3000 MHz |
10000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold/Nickel (Au/Ni) |
11.5 dB |
e4 |
6000 MHz |
26500 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
CMOS COMPATIBLE |
e3 |
2000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
SOP8,.25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
1500 MHz |
4500 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
CMOS COMPATIBLE |
e3 |
2000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
TRIPLE BALANCED |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11 dB |
e4 |
3000 MHz |
10000 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
8500 MHz |
13500 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
4000 MHz |
8500 MHz |
|||||||
|
Analog Devices |
TRIPLE BALANCED |
GAAS |
28 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
TUNGSTEN NICKEL GOLD |
11 dB |
3000 MHz |
10000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
18 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
12.5 dB |
14000 MHz |
30000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
9.5 dB |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
20 dBm |
150 mA |
COMPONENT |
3.3 |
LCC12,.08X.12,20 |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
3000 MHz |
20000 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
105 Cel |
-40 Cel |
MATTE TIN |
e3 |
3000 MHz |
20000 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
TSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
10.5 dB |
e3 |
5000 MHz |
12000 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
2500 MHz |
7000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15.5 dB |
7000 MHz |
34000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15.5 dB |
7000 MHz |
34000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15.5 dB |
7000 MHz |
34000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
GOLD OVER NICKEL |
10 dB |
e4 |
4500 MHz |
8000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
1500 MHz |
4500 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
5500 MHz |
14000 MHz |
||||||||||
|
Analog Devices |
IMAGE REJECTION |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
2500 MHz |
8500 MHz |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
|||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
GAAS |
16 dBm |
COMPONENT |
LCC20,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
8000 MHz |
12000 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
15 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) |
12 dB |
e4 |
5000 MHz |
20000 MHz |
|||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
I/P POWER-MAX (PEAK)=23DBM |
e4 |
8500 MHz |
13500 MHz |
|||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
7 |
GAAS |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
||||||||||
|
Analog Devices |
DOUBLE BALANCED |
||||||||||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
16 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
8000 MHz |
12000 MHz |
||||||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
TSSOP8,.19 |
85 Cel |
-40 Cel |
10 dB |
1500 MHz |
4500 MHz |
|||||||||||
Analog Devices |
DOUBLE BALANCED |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.