Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
75 mA |
COMPONENT |
5 |
TSSOP14,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
e0 |
0 MHz |
2500 MHz |
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|
Analog Devices |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC20,.20SQ,25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
145 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
5 |
LCC40,.24SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
2500 MHz |
2900 MHz |
|||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
75 mA |
COMPONENT |
5 |
TSSOP14,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
e0 |
0 MHz |
2500 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
9 dB |
e4 |
3000 MHz |
7000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
7000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
12 dB |
2.92 MM; SMA |
e4 |
23000 MHz |
37000 MHz |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC40,.24SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
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|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
220 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
SINGLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
27 dBm |
COMPONENT |
5 |
TSSOP8,.19 |
85 Cel |
-40 Cel |
11 dB |
HIGH DYNAMIC RANGE |
1700 MHz |
2400 MHz |
||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
5500 MHz |
14000 MHz |
||||||||||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
220 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
9.4 dB |
e3 |
9000 MHz |
15000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
SOP8,.25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
11.5 dB |
25000 MHz |
40000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
|||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
3 |
TSSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
TIN LEAD |
11 dB |
e0 |
600 MHz |
1300 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
18 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
14.5 dB |
22000 MHz |
38000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
16 |
CERAMIC |
GAAS |
LCC16,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
24 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
9.4 dB |
e3 |
9000 MHz |
15000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
7000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
10 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
10 MHz |
3000 MHz |
|||||||||||||
Analog Devices |
DOUBLE BALANCED |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
HIGH ISOLATION |
1200 MHz |
2500 MHz |
||||||||||||||||
Analog Devices |
DOUBLE BALANCED |
10 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
e0 |
10 MHz |
3000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
4000 MHz |
8500 MHz |
||||||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
SOP8,.25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||||
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10.5 dB |
e4 |
2500 MHz |
7000 MHz |
|||||||||||||
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
10.5 dB |
e0 |
4000 MHz |
7000 MHz |
|||||||||||||
|
Analog Devices |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
40 mA |
4 |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
7000 MHz |
14000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COAXIAL |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
SMA |
e4 |
8500 MHz |
13500 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
SMA |
e4 |
6000 MHz |
10000 MHz |
|||||||||||
|
Analog Devices |
DOUBLE BALANCED |
||||||||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
1.5 |
110 mA |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1700 MHz |
2200 MHz |
||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
1.5 |
110 mA |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1700 MHz |
2200 MHz |
||||
|
Analog Devices |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
265 mA |
5 |
LCC20,.20SQ,25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
265 mA |
5 |
LCC20,.20SQ,25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
|||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
1.5 |
110 mA |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1700 MHz |
2200 MHz |
||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
1.5 |
110 mA |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
e3 |
1700 MHz |
2200 MHz |
||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
e4 |
26000 MHz |
40000 MHz |
||||||||||||
|
Analog Devices |
|||||||||||||||||||||||
Analog Devices |
DOUBLE BALANCED |
27 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
10.5 dB |
e0 |
1800 MHz |
2200 MHz |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.