BGA ATM/SONET/SDH Circuits 165

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3161N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS31612	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	COMMERCIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS3184	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3164+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified				27 mm
DS3181+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3100GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.146 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified		20	240	17 mm
DS3183N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.61 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3182N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3162N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS31415GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
DS3181N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3166	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	COMMERCIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS31407GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		416 mA	1.8 V		GRID ARRAY	BGA256,16X16,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.62 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS3181	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3168	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	COMMERCIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS3161	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3164N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS31408GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256
DS3163	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3100GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.146 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e3			17 mm
DS3184+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS3184N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3182	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.448 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3166N	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS31612N	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS3182+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3181N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3184N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS3100GN#	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified				17 mm
DS31408GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
DS3164	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
82P5088BB	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm	17 mm	Not Qualified	e0			17 mm
82P5088BBG	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B256	3				e1	NOT SPECIFIED	260
UPD98414F2-RN1	Renesas Electronics		INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS		3.3 V	3.3	GRID ARRAY	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B352				Not Qualified
UPD98412N7-H6	Renesas Electronics		INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS	1300 mA	3.3 V	3.3	GRID ARRAY	BGA576,30X30,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B576				Not Qualified	e0
UPD98410S2-K6	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	580	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm				BOTTOM	S-PBGA-B580		2.78 mm	45 mm	Not Qualified				45 mm
TMXF846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B700	2A	2.51 mm	35 mm	Not Qualified				35 mm
TTRN0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	198	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B198		1.961 mm	15 mm	Not Qualified	e0	30	240	15 mm
MTMXL846221BL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
T-8208---BAL2-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
TMXL33625BL-2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
L-TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e1	40	250	35 mm
L-TMXL336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e1	40	245	45 mm
M-TDAT162G52-3BAL2	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS			1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792				Not Qualified
M-TMXL336251BL-2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
TAAD08JU21BCL-L3A	Broadcom		COMMERCIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS			1.5,3.3	GRID ARRAY	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B520				Not Qualified
TDCS6440G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792		2.85 mm	40 mm	Not Qualified	e0	30	225	40 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.