6 Cellphone ICs 105

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMH2110TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm		e1	30	260	1.24 mm
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V	CHIP CARRIER	.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e4			1.1 mm
LMH2110TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm		e1	30	260	1.24 mm
BGA7H1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	CHIP CARRIER, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-N6	1	.4 mm	.7 mm		e3			1.1 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			CHIP CARRIER					BOTTOM	R-XBCC-B6	1
LMH2110TM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified				1.24 mm
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
MAX2674EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
MAX2674EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGA7L1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	CHIP CARRIER, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-N6	1	.4 mm	.7 mm		e3			1.1 mm
SKY65723-81	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1				1.8 V	MICROELECTRONIC ASSEMBLY		85 Cel	-40 Cel		DUAL	R-XDMA-N6		.8 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
IAM-91563-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
LMV227SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
LMH2120UMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4 mA	4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm	.816 mm		e1	30	260	1.216 mm
LMH2120UMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.47 mm	.825 mm	Not Qualified				1.225 mm
LMV225SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
LMH2100TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.844 mm		e1	30	260	1.244 mm
LMV227SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0			2.5 mm
LMV225SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0		260	2.5 mm
LMH2120UM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.47 mm	.825 mm	Not Qualified				1.225 mm
LMH2120UM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4 mA	4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm	.816 mm		e1	30	260	1.216 mm
TS3A26746EYZPR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	2		.05 mA	3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	.5 mm	.9 mm	Not Qualified	e1	30	260	1.4 mm
LMV228SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0			2.5 mm
LMH2110TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified				1.24 mm
LMV228SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
LMH2100TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.844 mm		e1	30	260	1.244 mm
LMV225SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA	2.7 V	SMALL OUTLINE, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3	30	260	2.5 mm
LMV227SDX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6	1	.8 mm	2.2 mm		e3	30	260	2.5 mm
LMV227SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6	1	.8 mm	2.2 mm		e3	30	260	2.5 mm
LMV225SDX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA	2.7 V	SMALL OUTLINE, VERY THIN PROFILE	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3	30	260	2.5 mm
MAX2606EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
MAX2676EWT+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2609EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
MAX2607EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
MAX2674EWT+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2608EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
MAX2609EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
MAX2605EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
MAX2605EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
MAX2608EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
MAX2607EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
MAX2676EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
LTE3401LX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
LTE3401L	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
LTE3401H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.