6 Cellphone ICs 105

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTE3401HX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
BGS8L2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
BGS8L5	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
BGU7224	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm					1.6 mm
BGS8M2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
BGU8103UK	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGU7258X	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	.5 mm	1.6 mm		e4	30	260	1.6 mm
BGU7258	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
BGM1044N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMY91	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE			.95 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.3 mm	Not Qualified	e0			2.9 mm
BGM1044N7E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
BGA713L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.4 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGA777N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGA713N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.3 mm					2 mm
BGA713L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7L1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGA777L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.4 mm	.7 mm					1.1 mm
BGS8H2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		7 mA	1.8 V		GRID ARRAY			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8L3UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8M2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
MAX2676EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2607EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2202EWT+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2202EWT+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2609EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2605EUT	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2605EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2608EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2202EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.69 mm	.865 mm	Not Qualified		30	260	1.27 mm
MAX2202EMT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.69 mm	.865 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.27 mm
UPC8112TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPC8112TB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPG2128TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2121TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	GAAS	.0045 mA	2.8 V	2.8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Other Telecom ICs	.65 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPG2130TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG174TA-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.53 mm	1.5 mm		e0			2.9 mm
UPC8112TB-E3-A	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e6			2 mm
UPG2106TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2110TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
IAM-91563-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR2G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-TR2	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.