BCC Cellphone ICs 32

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e4			1.1 mm
SARA-U201-04B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
SARA-U201-03B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B6	1
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B10	1
SARA-U270-03S-01	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		55 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
SKY65344-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	BCC	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER	1 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20		1.4 mm	6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6 mm
LTE3401LX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm					260	1.1 mm
LTE3401L	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
LTE3401H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
LTE3401HX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm					260	1.1 mm
BGS8L2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
BGS8L5	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
BGS8M2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm						1.5 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B10	1
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm				NOT SPECIFIED	NOT SPECIFIED	1.5 mm
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm						1.5 mm
BGSX22GN10	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	2.6 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B10		.4 mm	1.1 mm						1.5 mm
BGA7H1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e3			1.1 mm
BGA7L1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e3			1.1 mm
BGA7H1BN6E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.4 mm	.7 mm						1.1 mm
ACPM-5252-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2412-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER	2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified				260	3.3 mm
ALM-2412-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER	2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified				260	3.3 mm
ALM-2712-SG1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-5252-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2712-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-5281-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2712-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
S1M8659X01-F0T0	Samsung	RF AND BASEBAND CIRCUIT	OTHER	BUTT	32	BCC	SQUARE	UNSPECIFIED	YES	1	BICMOS	3 V	CHIP CARRIER	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32			5 mm	Not Qualified					5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.