HVSON Cellphone ICs 33

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
OC2321VQFN8XTMA2	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.24	1.27 mm	105 Cel	-40 Cel		DUAL	R-PDSO-N8	1	.9 mm	6 mm					5 mm
TQP3M9036	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N8	1	.95 mm	2 mm				260	2 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N14	2	.8 mm	3 mm	Not Qualified	e3		260	4 mm
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
MAX4003ETA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX4003ETA+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N14		.8 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	1 mm	2 mm	Not Qualified	e3		260	2 mm
LMV225SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
LMV225SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0		260	2.5 mm
LMV228SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0			2.5 mm
LMV228SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD		HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		8 mA		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					MATTE TIN	DUAL	R-PDSO-N6	1				e3	30	260
LMV228SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
LMV227SDX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6	1	.8 mm	2.2 mm		e3	30	260	2.5 mm
LMV227SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6	1	.8 mm	2.2 mm		e3	30	260	2.5 mm
LT5570IDD#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
LT5570IDD#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
BGU7224	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm					1.6 mm
BGU7258X	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	.5 mm	1.6 mm		e4	30	260	1.6 mm
BGU7258	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
BGM1044N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
BGM1044N7E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
OC1120-0810VQFN8	Infineon Technologies	BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			10 mA	1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		1.27 mm	85 Cel	-25 Cel		DUAL	R-PQCC-N8		.9 mm	5 mm					6 mm
BGA777N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
MAX4003ETA+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX4003ETA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
AJAV-5602-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5508-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.