BASEBAND CIRCUIT Cellphone ICs 371

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
TLV320AC57IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel		-40 Cel	1 dB		DUAL	R-PDIP-T20			5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TLV320AC57CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel		0 Cel	1 dB		DUAL	R-PDIP-T20			5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel		0 Cel	1 dB		DUAL	R-PDIP-T20			5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV321AC36IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TLV321AC36CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD	S-PQFP-G48			1.6 mm		7 mm	Not Qualified						7 mm
TLV321AC36CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		3 V		IN-LINE			2.54 mm	70 Cel		0 Cel			DUAL	R-PDIP-T20			5.08 mm		7.62 mm	Not Qualified						24.325 mm
TLV320AC56IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel		-40 Cel	1 dB		DUAL	R-PDSO-G20			2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM320AC57CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TLV320AC56CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TCM8010-37FR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4 V	3.7/4	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel		-30 Cel			QUAD	S-PQFP-G44			2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TCM4400EPN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	FLATPACK	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel		-25 Cel			QUAD	S-PQFP-G80			1.6 mm		12 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	12 mm
TLV320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel		0 Cel	1 dB		DUAL	R-PDSO-G20			2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV321AC37IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		3 V		IN-LINE			2.54 mm	85 Cel		-40 Cel			DUAL	R-PDIP-T20			5.08 mm		7.62 mm	Not Qualified						24.325 mm
TLV320AC56DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TCM4400EPET	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	FLATPACK	TQFP80,.48SQ,16	Other Telecom ICs	.4 mm	85 Cel		-25 Cel			QUAD	S-PQFP-G80			1.2 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TLV320AC57IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel		-40 Cel	1 dB		DUAL	R-PDSO-G20			2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV321AC37IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm		7 mm	Not Qualified						7 mm
TLV321AC36IPTR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm		7 mm							7 mm
TLV320AC57IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
TLV320AC56PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm		7 mm	Not Qualified						7 mm
TLV320AC57PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm		7 mm	Not Qualified						7 mm
TCM8010-50FR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel		0 Cel			QUAD	S-PQFP-G44			2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TCM320AC56CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel		0 Cel	1 dB		QUAD	S-PQFP-G48			1.6 mm	13-BIT	7 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
GC5318IZED	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel		-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B388		3	2.5 mm		27 mm	Not Qualified			e1	30	260	27 mm
TCM8000FN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL EXTENDED	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V		CHIP CARRIER			1.27 mm	80 Cel		-25 Cel			QUAD	S-PQCC-J44			4.57 mm		16.5862 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	16.5862 mm
TCM320AC57IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			2.65 mm		7.5 mm	Not Qualified						12.8 mm
HMC900LP5ETR	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			1 mm		5 mm					NOT SPECIFIED	NOT SPECIFIED	5 mm
AD6655ABCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.805 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3	30	260	9 mm
AD6654BBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel		-25 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B256		3	1.85 mm		17 mm	Not Qualified			e1		260	17 mm
AD6653BCPZ-105	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		1	1 mm		9 mm	Not Qualified			e3			9 mm
AD6653BCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD6655ABCPZ-105	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.575 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		Matte Tin (Sn)	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3	30	260	9 mm
AD6653BCPZ-125	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD8366ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	2				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N32		3	1 mm		5 mm	Not Qualified			e3	30	260	5 mm
AD6634XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel		-40 Cel			BOTTOM	S-PBGA-B196					15 mm	Not Qualified						15 mm
AD6655BCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD6635XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	70 Cel		-40 Cel			BOTTOM	S-PBGA-B324					19 mm	Not Qualified						19 mm
AD7005AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		5 V		FLATPACK			.8 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G44			2.45 mm		10 mm	Not Qualified						10 mm
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G28		1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	9.7 mm
AD6653BCPZ-80	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		1	1 mm		9 mm	Not Qualified			e3			9 mm
AD6655ABCPZ-80	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.42 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3	30	260	9 mm
AD7001AS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		5 V		FLATPACK			.8 mm	85 Cel		-25 Cel			QUAD	S-PQFP-G44			2.45 mm		10 mm	Not Qualified						10 mm
AD7002AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS	.03 mA	5 V	5	FLATPACK	QFP44,.57SQ,32	Codecs	.8 mm	85 Cel	10	-40 Cel		TIN LEAD	QUAD	S-PQFP-G44	VOLTAGE		2.45 mm		10 mm	Not Qualified		SINGLE-ENDED	e0			10 mm
AD6634BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B196		3			15 mm	Not Qualified			e0		240	15 mm
AD6635BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B324			3.5 mm		19 mm	Not Qualified			e0			19 mm
AD6655ABCPZRL7-125	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.705 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		3	1 mm		9 mm	Not Qualified			e3	30	260	9 mm
AD6654CBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel		-25 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B256		3	1.85 mm		17 mm	Not Qualified			e1		260	17 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.